Products | May 20, 2020
Cellular networks will be the communication backbone for billions of mobile devices and machines connected to the Internet of Things (IoT).
This is a product release announcement by Infineon Technologies AG. The issuer is solely responsible for its content.
At the core of this development is the embedded Subscriber Identity Module (eSIM), which securely connects devices to networks. To shape this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching a comprehensive turnkey eSIM solution for the plethora of IoT devices and applications. Infineon’s new OPTIGA™ Connect eSIM IoT solution based on leading-edge security hardware comes with pre-integrated carrier-agnostic cellular coverage in more than 200 countries and territories. Infineon has partnered with Tata Communications to offer its customers unparalleled global reach, leveraging the Tata Communications MOVE™ mobility and IoT platform. “With the progressive rise of IoT devices and the pervasiveness of cloud-based platforms and 5G deployment, cellular IoT connectivity will become a leading technology within the next few years,” says Lars Wemme, head of IoT Security at Infineon’s Digital Security Solutions division. “Infineon’s comprehensive eSIM portfolio of easy-to-integrate solutions perfectly meets the specific demands of IoT device manufacturers.” According to ABI research, total eSIM shipments for machine-to-machine (M2M) applications such as asset tracking, energy management or mobile healthcare are expected to grow with a compound annual growth rate of 18 percent from 101 million units in 2019 to 232 million by 2024. Seamless, scalable and secured IoT connectivity with global reach The OPTIGA Connect solution enables easy deployment and management of cellular-enabled IoT devices at scale. By implementing eSIM, device manufacturers can deliver products capable of worldwide use, instead of having to deliver specific versions for particular markets. This results in economies of scale, cuts costs through simplified product management, and reduces time to market significantly. Infineon’s solution is pre-integrated with a bootstrap Tata Communications MOVE™ eSIM profile, allowing manufacturers to capture, move and manage IoT data seamlessly, reliably and securely across the globe. Additionally, thanks to Tata Communications’ relationships with more than 640 mobile network operators (MNO) worldwide, manufacturers can overcome the complexities of managing potentially hundreds of local connectivity agreements with MNOs in different countries, and instead connect their devices with a single global connectivity agreement with Tata Communications. Use cases include smart metering deployment or telematics and fleet management applications where devices are deployed across broad geographic areas. The eSIM conforms to the Remote SIM Provision specification from the GSMA. Connecting a device or even a fleet of devices to the internet can be entirely managed remotely via an online portal. This remote activation and configuration of IoT devices over the air enables a more automated, secured approach to bringing large numbers of devices online. Furthermore, manufacturers can select connectivity providers after production, shipment and deployment of the device and change them throughout its lifecycle, increasing ease of use as well as flexibility regarding selecting MNOs and data plans. At the core of the new eSIM solution is Infineon’s SLM97 security controller. It provides a high-performance and GSMA eSIM M2M V3.2 compliant operating system, as well as worldwide coverage of 2G, 3G, 4G, 5G, LTE-M and NB-IoT. Infineon’s high-quality security hardware has been deployed for SIM-enabled IoT applications since 2008, with more than 200 million units in the field to date. The eSIM portfolio comes in different quality grades and form factors. Availability The new OPTIGA Connect eSIM IoT is available in a VQFN-8 (MFF2) package and industrial quality grade. More information is available at www.infineon.com/optiga-connect-IoT
Swedish biometrics company expands in Europe and Asia Swedish biometrics company, Fingerprint Cards, is seeing more and more reasons to move closer to "the action". The world’s top three payment card producers are all based in continental Europe, while most of the largest smartphone OEMs are headquartered in Asia - so that's where the company's heading.
Siemens Mobility to triple R&D headcount in Hungary Siemens Mobility is set to create 120 new R&D related jobs at its Budapest, Hungary location as the company moves moves forward in its efforts to "digitalise track-based transport modes".
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
AMD and Xilinx stockholders approve proposed acquisition The stockholders of both companies voted to approve their respective proposals relating to the pending acquisition of Xilinx by AMD.
Renesas to shift production from fire-hit Naka fab The Japanese semiconductor manufacturer is reportedly set to shift some production from its fire damaged Naka fab to a facility in the southwestern prefecture of Ehime.
Netlist and SK hynix reach patent and technology agreement Netlist and SK hynix have reached an agreement for a patent cross license covering memory technologies of both companies and an agreement for the supply of SK hynix products and technical cooperation on Netlist's CXL HybriDIMM technology.
13% increase to lift total semi shipments to a new record high Total semiconductor unit shipments, which include integrated circuits as well as optoelectronics, sensor/actuator, and discrete (O-S-D) devices, are forecast to rise 13% in 2021, to 1,135.3 billion (1.1353 trillion) units to set a new all-time annual record.
Sponsored content by TotechLong Term Storage Safe, secure storage and quality testing of sensitive components Shortage of electronic components Worldwide there is a significant shortage of electronic components, especially SMT components. The Long Term Storage of electronic components can be the solution for this problem in the future. But the requirements for long-term storage are increasing.
ROHM Semiconductor Europe appoints new President As of April 1st, 2021, Wolfram Harnack has taken the helm as ROHM Semiconductor Europe's new President. Former President, Toshimitsu Suzuki, will lead the European Sales Division as General Manager from the company's headquarters in Japan.
SK hynix negotiates supply deal with Bosch The South Korean company is reportedly in talks with Germany’s Robert Bosch Gmbh regarding a long-term supply contract.
Camtek receives orders worth more than $20 million The developer and manufacturer of inspection and metrology equipment for the semiconductor industry, says that in recent weeks it has received orders for inspection and metrology systems totaling over USD 20 million.
u‑blox acquires full ownership in Sapcorda JV Wireless and positioning technology specialist, u-blox, says that it has acquired full ownership of Sapcorda Services GmbH, a joint venture formed by u‑blox, Bosch, Geo++, and Mitsubishi Electric.
Sponsored content by MVTechEXCELLENT SURFACEMOUNT TECHNOLOGY SOLUTIONS FROM MVTECH FOR CENTRAL AND EASTERN EUROPE A few years ago, MicroVision Technologies SRL (MVTech) was created by an enthusiastic team to provide state-of-the-art manufacturing tools for the emerging electronics manufacturing industry in Central and Eastern Europe.
Murata spins off plant – establishes new company Murata Manufacturing says it will spin off its Kanazawa Murata Manufacturing Sendai plant and establish a new group company with the name of Sendai Murata Manufacturing, on July 1, 2021.
Problem solver: Multiplying digital-to-analog converter Question: How could a multiplying DAC be used other than as a DAC?
UCT completes acquisition of Ham-Let Ultra Clean Holdings (UCT) has completed the acquisition of Ham-Let (Israel-Canada) Ltd. for approximately USD 351 million. The acquisition expands UCT's addressable market in semiconductors
Axcelis ships multiple systems to CMOS image sensor manufacturers Axcelis Technologies says that it has shipped multiple Purion VXE high energy systems to CMOS image sensor manufacturers. While the CMOS image sensor manufacturers remain unnamed, Axcelis describes them as leading.
Zeiss opens US high-tech centre in the Bay Area Optics and optoelectronics technology company Zeiss has completed the construction of its new R&D, production, sales and customer service site in the San Francisco Bay Area.
Shenmao sets up testing lab in Taiwan - Cheetah Inspection Shenmao has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu.
TSMC to invest $100 billion to increase capacity In the midst of a global semiconductor shortage, the manufacturing giant announces that it is planning to invest USD 100 billion over the course of three years.
It will take Renesas 100 days to get back on track after the fire While the company still aims to complete the recovery of the damaged cleanroom at the N3 Building of the Naka fab within one month as initially announced, the company is also aware that it might that much longer.
BSE receives multiple orders from automotive chip companies Semiconductor test handler company, Boston Semi Equipment (BSE), has received repeat orders from automotive customers for multiple Zeus gravity test handlers configured for MEMS pressure and high power IC testing applications.
Another fire strikes semiconductor manufacturer Taiwanese semiconductor manufacturer Panjit International's Gangshan fab was hit by a fire at around 15:19 on 29th March 2021. All employees were evacuated safely.
Magnachip to be acquired in a $1.4 billion deal The South Korean chipmaker has entered into a definitive agreement with private equity fund, Wise Road Capital, to be acquired in a cash-deal valued at USD 1.4 billion.
A deal has been struck – II-VI to acquire Coherent The engineered materials and optoelectronics specialist says that it has entered into definitive agreement to acquire laser technology provider Coherent.
Damage at Renesas' Naka factory is worse than thought The fire that hit Renesas' N3 building at its Naka manufacturing facility, located on the Ibaraki prefecture, reportedly caused more damaged than initially thought.
Powerchip Semiconductor breaks ground on new Taiwan fab Powerchip Semiconductor Manufacturing Corporation (PSMC) has held a groundbreaking ceremony for a NTD 278 billion (EUR 8.26 billion) 12-inch fab in the Tongluo Science Park.
High-side current sensing Question: Is placing a 100 Ω resistor in front of a MOSFET gate required for stability?Load more news