Products | May 12, 2020
Renesas Extends Bluetooth 5.0 Connectivity to RA Family of 32-Bit MCUs
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio.
This is a product release announcement by Renesas Electronics Corporation. The issuer is solely responsible for its content.
The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs. The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications. “While offering an MCU with Bluetooth 5.0 connectivity is not new to Renesas, the addition of the RA4W1 enables our customers to easily adopt Bluetooth 5.0,” said Sakae Ito, Vice President of IoT Platform Business Division at Renesas. “Customers can also take full advantage of the on-chip MCU features, including Secure Crypto Engine to implement strong key management for the ultimate IoT security, and best-in-class output power consumption and sensitivity to achieve a superior link budget for longer range applications.” Key Features of RA4W1 MCU
- Arm Cortex M4 core and Bluetooth 5.0 core housed in 7mm x 7mm 56-pin QFN: The single-chip RA4W1 48 MHz MCU features 512 KB flash memory, 96 KB SRAM, and connectivity such as USB, CAN, and Renesas’ popular HMI capacitive touch technology. It also includes Renesas’ Secure Crypto Engine supporting customers with symmetric encryption and decryption, hash functions, true random number generation (TRNG), and advanced key handling with key generation and MCU-unique key wrapping.
- Full Bluetooth 5.0 support with industry best power consumption and sensitivity for superior reception: The RA4W1 MCU includes full Bluetooth 5.0 functions such as 2 Mbps data throughput, all advertising extension functions with maximum advertising length (1650 Byte), periodic advertisements, and channel selection algorithm #2 for applications requiring large amounts of traffic. The RA4W1 also offers superior low peak power consumption at 3.3mA during receiving and 4.5mA (@0dBm) while transmitting. An industry best sensitivity of -105dBm in 125kbps mode is achieved without additional loss from external components.
- Basic protocol stack package and all standard profiles: In addition to the Bluetooth 5.0 basic protocol stack package, Renesas provides several API functions that conform to all standard profiles, including a Heart Rate Profile (HRP), an Environment Sensing Profile (ESP), and an Automation I/O profile (AIOP). These functions allow users to quickly start and speed up prototype development and evaluation.
- Innovative development environment allows simultaneous development of communication control and system control: Renesas’ Smart Configurator GUI generates Bluetooth code and MCU peripheral function driver code as well as pin settings for the e2 Studio integrated development environment (IDE). The Renesas QE tool for BLE generates programs for custom profiles and embeds them in user application programs to support application program development. And the Bluetooth Trial Tool Suite GUI allows users to perform initial wireless characteristics evaluations and Bluetooth functional verification. Users can typically have the RA4W1 evaluation board up and running with the downloadable smartphone applications demo in less than 30 minutes.
- Reduced BOM through integration: The RA4W1 includes a high-precision, low-speed on-chip oscillator, and also integrates an RF oscillator adjustment circuit and on-chip matching circuit for easy antenna connection. This high-level of integration reduces both BOM (bills of materials) costs and circuit board area, resulting in lower IoT equipment manufacturing costs.
- The Flexible Software Package’s (FSP) open architecture allows customers to re-use their legacy code and combine it with software examples from Renesas and ecosystem partners: The FSP for RA Family MCUs speed the implementation of complex functions like connectivity and security. It features FreeRTOS and middleware offering a premium device-to-cloud option for developers. These out-of-box options can be easily replaced and expanded with any other RTOS or middleware.
ASML ships first-generation multibeam inspection system ‘eScan1000’ ASML Holding NV says that it has completed system integration and testing of its first-generation HMI multibeam inspection (MBI) system for 5 nm nodes and beyond.
Cognex takes measures to counter deteriorating market conditions Machine vision technology provider, Cognex Corporation, says it is taking significant steps to reducing expenses due to deteriorating market conditions and to position the company for growth when conditions improve.
Verkotan selects PWC technology from Rohde & Schwarz Test and measurement specialist Rohde & Schwarz has recently introduced the R&S PWC200, the first plane wave converter (PWC) on the market. Verkotan is the first independent test house to choose this technology to test 5G NR FR1 base stations over-the-air (OTA).
Kurt Sievers takes the helm at NXP At its annual general meeting of shareholders, the appointment of Kurt Sievers as the company’s next CEO was overwhelmingly approved.
Excelitas’ Qioptiq subsidiary expands with new plant Excelitas Technologies, a company delivering photonic solutions, sats that its Qioptiq subsidiary held a ground-breaking ceremony last week to mark the beginning of construction for a new factory in Göttingen, Germany.
Farnell adds Sorensen power supplies to its roster Distributor Farnell announces that it has added Sorensen, the premier DC programmable power supply brand from Ametek, to its range of power supplies.
Infineon raises EUR 1 billion following successful share placement Infineon informs that the company placed 55 million new shares, following an accelerated bookbuilding process with institutional investors, under the exclusion of subscription rights. The shares were placed at a price of EUR19.30 per share, meaning that the company managed to raise EUR 1.06 billion.
Skeleton Technologies strengthens management with new COO Skeleton Technologies has appointed Ants Vill, former Vice President of Product, as Chief Operating Officer.
SiPearl chooses Germany for its first international operational subsidiary SiPearl, a designer of the microprocessor for the European exascale supercomputer, is opening its first international subsidiary in Duisburg, in the Ruhr region, Germany, in order to build closer connections with its German partners and future clients.
DELO reports increased revenues despite current pandemic DELO closed the financial year that ended on March 31 with a turnover of EUR 163 million. This is an increase of almost 5% compared to the previous year (EUR 156 million).
China falls far short of its "Made-in-China 2025" goal IC production in China represented 15.7% of its $125 billion IC market in 2019, up only slightly from 15.1% five years earlier in 2014. IC Insights forecasts that this share will increase by 5.0 percentage points to 20.7% in 2024 (one percentage point per year on average).
COVID-19 highlights the gravity of the secondary market for SME Cha Jin-Seok, Chief Financial Officer of SK Hynix, said it best in the company’s Q1 earnings call, “Because of a never experienced pandemic, even basic business activities such as maintaining normal operations and predicting future demand have become challenging tasks.”
GlobalFoundries to implement ITAR at US manufacturing facility GlobalFoundries plans to implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York.
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.Load more news
- Rolls-Royce takes heavy hit from COVID-19 – reduces workforce by 9000
- COVID-19 highlights the gravity of the secondary market for SME
- Data Link Solutions to provide MIDS cabinet terminals to US Navy
- China falls far short of its "Made-in-China 2025" goal
- GlobalFoundries to implement ITAR at US manufacturing facility