Products | April 24, 2020
4MB On-Chip Flash Memory for Enhanced Real-Time Performance
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the RX72N Group and RX66N Group of 32-bit microcontrollers (MCUs), new additions to the RX Family that combines equipment control and networking function on a single chip.
This is a product release announcement by Renesas Electronics Corporation. The issuer is solely responsible for its content.
Built around the Renesas proprietary RXv3 CPU core, the RX72N features a maximum operating frequency of 240 megahertz (MHz) and two Ethernet channels, and the RX66N features a maximum operating frequency of 120 MHz and one Ethernet channel. In the industrial equipment market, performance and functionality improvements lead to larger program code sizes. As a result, storage capacity and read speed play key roles in determining real-time performance. The new RX72N and RX66N devices offer up to 4 megabytes (MB) of on-chip flash memory that perform read operations at a frequency of 120 MHz, among the fastest in the industry, as well as 1 MB of on-chip SRAM. This ample on-chip memory eliminates the need for external memory, which has slower read speeds, and makes it possible to extract the full performance capacity of the CPU. In addition, larger memory capacity enables high-resolution graphics support, such as WVGA, on a single chip, which was not possible on earlier general-purpose MCUs. With this combination, the MCUs can implement single-chip equipment control and networking function, enhancing the real-time performance of applications such as industrial robots, general-purpose inverters, programmable logic controllers (PLCs), and remote I/O devices. They also make it possible to improve the exterior design and operability of a wide range of industrial automation equipment. “The new products extend our portfolio of MCU products that combine equipment control and networking function on a single chip, joining the already available RX72M with EtherCAT® support, and the mainstream RX65N and RX651 models,” said Sakae Ito, Vice President of IoT Platform Business Division at Renesas. “The RX Family provides a high level of hardware and software inter-compatibility, making it easy for customers to build a development platform that scales from low-end to high-end products. This year marks the ten year anniversary of RX. We are planning a range of activities to appreciate our loyal RX customers and dedicated partners, which includes the launch of new products such as RX72N and RX66N. We are committed to continue to strengthen RX lineups for many more years to come. Key features of the new RX72N Group and RX66N Group: Large-capacity on-chip memory and large pin count package options that contribute to smaller product enclosures The new product lineup features industry-leading capacities of 4 MB flash memory and 1 MB SRAM, with pin count packages ranging up to 224 pins, including a maximum of 182 general-purpose input/output (GPIO) ports. By enabling single-chip implementation where it previously required additional components such as a sub-MCU or external memory, the new MCUs reduce the component mounting area required on the circuit board for smaller form factors. Hardware accelerator for faster motor control The RX72N Group and RX66N Group incorporate an arithmetic unit for trigonometric functions (sin, cos, arctan, hypot; RX72N only) that accelerates motor vector control and a register bank save function that decreases the interrupt response time. This reduces the CPU load required for closed-loop control and simplifies the implementation of additional functions such as networking capabilities. Security functions that protect data communications and programs The Trusted Secure IP module provided as a security engine supports multiple encryption standards, including AES, 3DES, RSA, ECC, SHA, and TRNG, as well as key management. Combined with the protection function of the on-chip flash memory, it provides support for secure firmware updating and secure boot function. HMI functions for improved exterior design and operability The RX72N Group and RX66N Group incorporate an LCD controller, 2D drawing engine, and serial sound interface. They can support high-resolution displays — WVGA (800×480) at 8-bit colors or WQVGA (400 × 240) at 16-bit colors — without the need for external memory. When used in combination with voice recognition or noise reduction middleware, they also enable customers to add voice control function to their products, making them ideal for applications such as network-connected LCD-equipped controllers or smart speakers. Renesas also introduced the RX72N Envision Kit to further reduce common barriers to development. The evaluation board makes it easy to experiment with an array of functions, including:
- Network (wired: Ethernet, wireless: Wi-Fi/Bluetooth LE combo module on-board)
- Security (Trusted Secure IP and flash memory protection function incorporated into RX72N)
- HMI (4.3-inch WQVGA TFT LCD, audio IC, MEMS microphone on-board)
- Connectivity (USB 2.0 Full Speed Host, SD host interface, QSPI)
Rohm SiC MOSFETs qualified for automotive use Rohm’s latest 4th generation of SiC MOSFETs has been fully qualified in Semikron’s eMPack modules for automotive use.
Gapwaves and Bosch to jointly develop radar antennas Swedish tech company Gapwaves have entered into an agreement with Bosch regarding the development and large-scale production of high-resolution radar antennas for automotive vehicle applications aiming at highly automated driving.
Würth Elektronik ICS opens subsidiary in Italy Würth Elektronik ICS is expanding its activities in Italy with the opening of the new subsidiary Würth Elektronik ICS Italia s.r.l.
Semtech to acquire Sierra Wireless Semtech and Sierra Wireless have entered into a definitive agreement under which Semtech will acquire all outstanding shares of Sierra Wireless for USD 31 per share in an all-cash deal valued at USD 1.2 billion.
Materion looking to accelerate growth with new facility Materion Corporation, a supplier of advanced materials, has established a new facility in Milwaukee, Wisconsin to accelerate the growth of advanced chemical solutions for the semiconductor and EV battery markets.
Cyber incident at SEMIKRON The SEMIKRON Group has become a victim of a cyber-attack by a professional hacker group.
Alexander Battery and Anglia sign distribution agreement Anglia Components, a distributor of electronic components, has signed an agreement with Alexander Battery Technologies for exclusive distribution in the UK and Ireland.
MKS and Atotech deal receive China antitrust clearance MKS Instruments and Atotech have received unconditional merger approval from China’s State Administration for Market Regulation for MKS’ pending acquisition of Atotech.
Micron plans to invest in US memory manufacturing Micron Technology commends the passing of the “Chips and Science” legislation. The company says that this is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness.
Applied Materials looking to future-ready its workforce Applied Materials South East Asia Pte. Ltd. has signed an MoU with the Singapore Institute of Technology (SIT) to develop and implement continuing education and training (CET) programmes for Applied Materials employees.
Kioxia & WDC to receive government subsidy for JV fab Kioxia Corporation and Western Digital Corporation say that their joint venture, the Fab7 manufacturing facility at Yokkaichi Plant, has been approved to receive up to JPY 92.9 billion (USD 699.3 million) in subsidy from the Japanese government.
Green light for the CHIPS and Science Act of 2022 The United States House of Representatives has passed the CHIPS and Science Act of 2022. A decision applauded by SEMI. The bill provides a 25% tax credit for US facilities that produce semiconductors or chipmaking equipment and USD 52 billion in funding for new semiconductor programs.
Littelfuse completes its acquisition of C&K Switches Littelfuse has completed its acquisition of designer and manufacturer of high-performance electromechanical switches and interconnect solutions, C&K Switches.
Intel to make chips for MediaTek MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
Indie Semiconductor opens Dresden center of excellence The center is said to be part of a company strategy to deliver local technical support for a rapidly growing base of OEM and Tier 1 automotive customers in the EMEA region.
Soitec: "We recorded our highest first quarter ever" Semiconductor materials specialist Soitec reported consolidated revenue of EUR 203 million for the first quarter of FY’23, up 12% compared with EUR 180 million during the first quarter of FY’22.
ClassOne acquires complete chip line ClassOne Equipment says it has acquired a major semiconductor fab’s complete chip manufacturing line.
SkyWater to bolster chip fabrication at Purdue SkyWater plans to open a $1.8 billion semiconductor manufacturing facility in Discovery Park District at Purdue University to create 750 new direct jobs within five years.
Toyo Ink Group to focus on electronics materials in Shenzhen Toyo Ink SC Holdings Co., Ltd., the parent company of the Tokyo-based materials manufacturer Toyo Ink Group, recently opened the Shenzhen Toyo Ink Technical Center in Shenzhen, China.
SkyWater awarded $27M option to facilitate US semiconductors The Department of Defense is funding a $27 million Other Transactional Agreement Option for SkyWater to further develop intellectual property (IP) for its 90 nm Strategic Rad-Hard by Process (RH90) FDSOI technology platform.
Missouri signs bill for multi-million chip investment Missouri Governor, Mike Parson signs house bill 3007, said to make Missouri a leader in ”innovation of advanced manufacturing of active pharmaceutical ingredients and semiconductor computer chips”.
Bosch invests further billions in chip business Bosch announces an investment of three billion euros in its semiconductor business by 2026 as part of the IPCEI on Microelectronics and Communications Technology.
Siemens to establish UK power electronics innovations hub Siemens plc has entered a strategic innovation partnership with the Compound Semiconductor Applications Catapult in Newport to accelerate the development of leading-edge power electronics capability.
Riverside announces sale of Abracon Private investor Riverside has sold its investment in Abracon, a Texas-based provider of passive and electromechanical timing, synchronization, power, connectivity and radio frequency solutions, to Genstar Capital.Load more news