Products | April 21, 2020
Smallest outdoor fiber optic connector for harsh environments
HUBER+SUHNER, a leading global supplier of optical connectivity solutions, has today launched its smallest ever outdoor fiber optic connector – the Q-ODC-2 Mini – to enable more cost-effective, flexible and higher capacity deployments of new wireless infrastructure in industrial and communication applications.
This is a product release announcement by HUBER+SUHNER Group. The issuer is solely responsible for its content.
Featuring a compact design, this size-optimised connector reduces dimensions by 50% and weight by 40% when compared to the Q-ODC-2 outdoor connector from HUBER+SUHNER. These smaller proportions allow wireless infrastructure providers to access new locations and add more capacity to the network, reducing the cost per bit. The Q-ODC-2 Mini also overcomes the challenge of high system sensitivity and increases reliability. This opens up new areas of application for fiber optics in a number of industries, such as wind energy, railway and shipbuilding. The connector is waterproof, dust-proof and corrosion resistant and provides the maximum safety for outdoor installations. It features a robust push-pull coupling mechanism and an extension connector for cable chaining, making the solution fast and easy to install. “As our smallest outdoor fiber optic connector to date, the Q-ODC-2 Mini addresses critical challenges in the planning, building and operation of new wireless infrastructure deployments by providing an affordable solution that is simple to install and takes up the minimum amount of physical space,” said Carsten Dieckmann, Product Manager at HUBER+SUHNER. “The product adds to our portfolio of fiber optic solutions that are suitable for complex applications with high data rates as network providers look to meet the demand for more capacity at a lower cost per bit.” With cleaning and inspection equipment vital for outdoor connectors, two solutions are currently available on the market which can meet requirements in this area – US Conec IBC Brand Cleaner and Sumix’s inspection equipment the Manta-W+.
Rohm SiC MOSFETs qualified for automotive use Rohm’s latest 4th generation of SiC MOSFETs has been fully qualified in Semikron’s eMPack modules for automotive use.
Gapwaves and Bosch to jointly develop radar antennas Swedish tech company Gapwaves have entered into an agreement with Bosch regarding the development and large-scale production of high-resolution radar antennas for automotive vehicle applications aiming at highly automated driving.
Würth Elektronik ICS opens subsidiary in Italy Würth Elektronik ICS is expanding its activities in Italy with the opening of the new subsidiary Würth Elektronik ICS Italia s.r.l.
Semtech to acquire Sierra Wireless Semtech and Sierra Wireless have entered into a definitive agreement under which Semtech will acquire all outstanding shares of Sierra Wireless for USD 31 per share in an all-cash deal valued at USD 1.2 billion.
Materion looking to accelerate growth with new facility Materion Corporation, a supplier of advanced materials, has established a new facility in Milwaukee, Wisconsin to accelerate the growth of advanced chemical solutions for the semiconductor and EV battery markets.
Cyber incident at SEMIKRON The SEMIKRON Group has become a victim of a cyber-attack by a professional hacker group.
Alexander Battery and Anglia sign distribution agreement Anglia Components, a distributor of electronic components, has signed an agreement with Alexander Battery Technologies for exclusive distribution in the UK and Ireland.
MKS and Atotech deal receive China antitrust clearance MKS Instruments and Atotech have received unconditional merger approval from China’s State Administration for Market Regulation for MKS’ pending acquisition of Atotech.
Micron plans to invest in US memory manufacturing Micron Technology commends the passing of the “Chips and Science” legislation. The company says that this is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness.
Applied Materials looking to future-ready its workforce Applied Materials South East Asia Pte. Ltd. has signed an MoU with the Singapore Institute of Technology (SIT) to develop and implement continuing education and training (CET) programmes for Applied Materials employees.
Kioxia & WDC to receive government subsidy for JV fab Kioxia Corporation and Western Digital Corporation say that their joint venture, the Fab7 manufacturing facility at Yokkaichi Plant, has been approved to receive up to JPY 92.9 billion (USD 699.3 million) in subsidy from the Japanese government.
Green light for the CHIPS and Science Act of 2022 The United States House of Representatives has passed the CHIPS and Science Act of 2022. A decision applauded by SEMI. The bill provides a 25% tax credit for US facilities that produce semiconductors or chipmaking equipment and USD 52 billion in funding for new semiconductor programs.
Littelfuse completes its acquisition of C&K Switches Littelfuse has completed its acquisition of designer and manufacturer of high-performance electromechanical switches and interconnect solutions, C&K Switches.
Intel to make chips for MediaTek MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
Indie Semiconductor opens Dresden center of excellence The center is said to be part of a company strategy to deliver local technical support for a rapidly growing base of OEM and Tier 1 automotive customers in the EMEA region.
Soitec: "We recorded our highest first quarter ever" Semiconductor materials specialist Soitec reported consolidated revenue of EUR 203 million for the first quarter of FY’23, up 12% compared with EUR 180 million during the first quarter of FY’22.
ClassOne acquires complete chip line ClassOne Equipment says it has acquired a major semiconductor fab’s complete chip manufacturing line.
SkyWater to bolster chip fabrication at Purdue SkyWater plans to open a $1.8 billion semiconductor manufacturing facility in Discovery Park District at Purdue University to create 750 new direct jobs within five years.
Toyo Ink Group to focus on electronics materials in Shenzhen Toyo Ink SC Holdings Co., Ltd., the parent company of the Tokyo-based materials manufacturer Toyo Ink Group, recently opened the Shenzhen Toyo Ink Technical Center in Shenzhen, China.
SkyWater awarded $27M option to facilitate US semiconductors The Department of Defense is funding a $27 million Other Transactional Agreement Option for SkyWater to further develop intellectual property (IP) for its 90 nm Strategic Rad-Hard by Process (RH90) FDSOI technology platform.
Missouri signs bill for multi-million chip investment Missouri Governor, Mike Parson signs house bill 3007, said to make Missouri a leader in ”innovation of advanced manufacturing of active pharmaceutical ingredients and semiconductor computer chips”.
Bosch invests further billions in chip business Bosch announces an investment of three billion euros in its semiconductor business by 2026 as part of the IPCEI on Microelectronics and Communications Technology.
Siemens to establish UK power electronics innovations hub Siemens plc has entered a strategic innovation partnership with the Compound Semiconductor Applications Catapult in Newport to accelerate the development of leading-edge power electronics capability.
Riverside announces sale of Abracon Private investor Riverside has sold its investment in Abracon, a Texas-based provider of passive and electromechanical timing, synchronization, power, connectivity and radio frequency solutions, to Genstar Capital.Load more news