© maxim integrated - for illustrative purposes
Business | February 20, 2020
Maxim accelerates in Europe with $25M investment in Ireland
Maxim Integrated Products, Inc. is opening a new design centre in Dublin, Ireland. The design centre will focus on product development and conducting R&D in the areas of analog semiconductor design.
To make this vision a reality, the company will recruit a team of mixed-signal and analog design engineers at this facility. The USD 25 million investment will be primarily geared towards recruiting talent, equipment and building costs, as well as research and development. Located on the south side of Dublin, this is Maxim’s seventh design center located in Europe, according to a press release.
“With this new facility, we plan to reinvent the way we develop technology and push innovation even further, giving our customers the products they need to succeed,” says David Dwelley, chief technology officer at Maxim Integrated.
AMD and GlobalFoundries update supply agreement
On May 13, 2021, Advanced Micro Devices (AMD), entered into an amended seventh amendment to the wafer supply agreement with GlobalFoundries (GF) to extend GF’s capacity commitment and wafer pricing to AMD under the backdrop of the current global supply environment.
Siemens expands IC verification portfolio with acquisition
Siemens Digital Industries Software has acquired Fractal Technologies, a provider of production signoff-quality IP validation solutions, based in the U.S. and the Netherlands.
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Taiwan power outage has no impact on memory fabs
The Hsinta Power Plant in Taiwan’s Kaohsiung City was shut down unexpectedly at 2:37 p.m. on May 13 (today local time) due to malfunction. The effect of this incident has been felt across the entire island.
Driving a unipolar gate driver in a bipolar way
Question: Do you need a specialized gate driver to deliver positive and negative voltages?
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The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
German components distribution experiences massive surge in demand
German components distribution (according to FBDi e.V.) records almost 50% increase in order intake in the first quarter of 2021. Sales still slightly down at -6.1%. Components shortage prevents better result.
Monitor shipment for 2021 expected to reach 150M units
Owing to high demand generated by the proliferation of WFH and distance education, monitor shipment for 2020 reached 140 million units, an 8.6% growth YoY, which represents the highest growth in about 10 years, according market researcher TrendForce.
ZEISS to acquire Capture 3D
Zeiss plans to expand its national coverage in the US for its Industrial Quality & Research segment by acquiring Santa Ana, California-based Capture 3D, a US partner for GOM 3D non-contact measuring solutions.
MKS Instruments to acquire optical sensor specialist
MKS Instruments has entered into a definitive agreement pursuant to which MKS will acquire Photon Control for CAD 3.60 per share, in an all-cash transaction valued at approximately CAD 387 million (EUR 263.85 million).
50 billion transistors on a fingernail-sized chip
IBM has unveiled a breakthrough in semiconductor design and process with the development of the world's first chip announced with 2 nanometer nanosheet technology.
Diodes sets new revenue record
The company is reporting first quarter revenue growth of 18% sequentially and 47% YoY, resulting in a record USD 413.1 million.
CEVA to acquire chip design specialist
CEVA, a licensor of wireless connectivity and smart sensing technologies, will acquire Massachusetts-based chip design specialist Intrinsix for approximately USD 33 million in cash.
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Arrow Electronics Tech Snacks put engineers’ time first
Arrow Electronics is launching a new learning concept, Tech Snacks, that will provide engineers with the technical information and insight they need in a choice of formats that have been designed to match their demanding schedules. The Tech Snacks concept will be introduced at an EMEA-wide program that will run from 7-18 June covering a wide range of electronic engineering topics. Individual panel discussions will focus on artificial intelligence and machine learning (AI/ML), automotive/electric vehicles, Industry 4.0 and 5G.
Helios Technologies to acquire the assets of Joyonway
Helios Technologies, a motion control and electronic controls specialist, has entered into a definitive agreement to acquire assets related to the electronic control systems and parts business of Shenzhen Joyonway Electronics & Technology Co., Ltd and its related entities.
Teledyne e2v starts cleanroom upgrade
Teledyne e2v Semiconductors have laid the first stone to what will become the company's new upgraded semiconductor assembly and test cleanroom at the factory near Grenoble, France.
GaN IC company Navitas to go public
GaN Power ICs specialis, Navitas Semiconductor, has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II, a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at $1.4 billion, will result in Navitas becoming a publicly-traded company.
Physik Instrumente continues expansion in Asia
Physik Instrumente (PI) is expanding its precision motion offering in the Asia-Pacific region having invested in a new R&D and manufacturing center in Changzhou, China to specifically focus on the local demands in the APAC region.
Overvoltage protection for RTD-based measurement ysstems
Question: Is it possible to design a complete RTD module with overvoltage protection?
Ericsson and Samsung sign global patent license agreement
Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Jenoptik secures automation orders in North America
Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Infineon looking to increase supply of SiC material
Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sources: TSMC is planning five additional fabs in Arizona
The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
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