Baidu and Samsung Electronics collaborate on production of AI chip

Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution. “We are excited to lead the HPC industry together with Samsung Foundry,” said OuYang Jian, Distinguished Architect of Baidu. “Baidu KUNLUN is a very challenging project since it requires not only a high level of reliability and performance at the same time, but is also a compilation of the most advanced technologies in the semiconductor industry. Thanks to Samsung’s state of the art process technologies and competent foundry services, we were able to meet and surpass our goal to offer superior AI user experience. ” “We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”