© First Sensor - For illustrative purposes Business | December 10, 2019
LeddarTech partners with First Sensor to accelerate LiDAR deployment
LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
LeddarTech, with the support of First Sensor and other industry players, is developing an open and comprehensive LiDAR platform option for OEMs and Tier1s. One of the goals with this is the creation of common architectures as well as standardised components that ensure lower risk, improved production volume scalability, cost optimisation and flexibility to address multiple LiDAR applications. LeddarTech and First Sensor will initiate this collaboration with the development of a LiDAR Evaluation Kit, demonstrating a technical concept in a working LiDAR and creating a tool for Tier1s and system integrators to develop their own LiDAR based on LeddarEngine technology, First Sensor APDs, and additional ecosystem partners’ technologies, products, and services. The evaluation kit will be primarily targeting automotive front LiDAR applications for high-speed highway driving such as Highway Pilot and Traffic Jam Assist. “We are delighted to partner with First Sensor, one of the world’s leading developers and producers of chips, components, sensors, and sensor systems as a strategic partner” says Michael Poulin, Vice-President, Product Management at LeddarTech. “First Sensor, LeddarTech and other select members, working synergistically as part of the Leddar Ecosystem, will provide increased value to our customers.”
ROHM and Leadrive establish a joint laboratory ROHM and Leadrive Technology, a Chinese manufacturer of automotive powertrain for new energy vehicles, have already held the opening ceremony for their joint laboratory on SiC technology in the China (Shanghai) Pilot Free Trade Zone (Lingang New Area).
Imagination announces latest licensing deal with NXP Imagination Technologies says that NXP has extended its license for Imagination’s Ethernet Packet Processor (EPP) IP for use in S32 vehicle network processors.
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LeddarTech acquires VayaVision LeddarTech has acquired sensor fusion and perception software company VayaVision.
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GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021 The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass USD 1 billion in 2021, energised by demand from hybrid & electric vehicles, power supplies, and photovoltaic (PV) inverters.
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II-VI licenses technology for SiC devices and modules for power electronic II‐VI Incorporated has singed an agreement with General Electric to license GE's technology to manufacture silicon carbide (SiC) devices and modules for power electronics.
Dialog Semi completes its acquisition of Adesto Dialog Semiconductor says it has completed the acquisition of Adesto Technologies Corporation (Adesto)), a provider of custom ICs and embedded systems for the IIoT market.
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USI breaks ground on its new Huizhou manufacturing facility The electronics designer and manufacturer is looking to reinforce its foundation in Southern China and is doing so by adding a new manufacturing facility in Huizhou (Guangzhou, China).
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Osram: Slight recovery after weak 3rd quarter expected Osram Licht AG expects for the fiscal year 2020 a comparable revenue decline of -15 to -19 percent (previously:-3 and +3 percent), an adjusted EBITDA margin of 3 to 6 percent (previously: 9 to 11 percent) and a negative free cash flow in the mid double digit to lower triple digit million range.
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