© solstudio dreamstime.com Business | November 15, 2019
Nuvia closes series A, eyes data center servers
Santa Clara semiconductor design startup Nuvia Inc., formed earlier this year by three former top Apple Inc. design executives, has closed its series A round with USD 53 million secured.
According to a company press release, the funding round was co-led by Silicon Valley investors Capricorn Investment Group, Dell Technologies Capital, Mayfield Fund, and WRVI Capital, along with additional funds from Nepenthe LLC. Formed with the goal of “reimagining silicon design to deliver industry-leading performance and energy efficiency for the data center,” according to the press release, company founders include semi design veterans John Bruno, Manu Gulati and Gerard Williams III, who have served in engineering leadership roles at companies that include Google, Apple, ARM, Broadcom and AMD. To date, Nuvia has been instrumental in driving the system engineering and silicon design on 20+ chips and amassed over 100 patents. Nuvia CEO Gerard Williams III said, “The world is creating more data than it can process as we become increasingly dependent on high-speed information access, always-on rich media experiences and ubiquitous connectivity. A step-function increase in compute performance and power efficiency is needed to feed these growing user needs. The timing couldn’t be better to create a new model for high-performance silicon design with the support of a world-class group of investors,” the press release said. “The compute-intensive demands of next-generation platforms are stretching the conventional limitations of the semiconductor industry,” Dipender Saluja, managing partner of Capricorn’s Technology Impact Fund said in the press release. “What’s needed is a new approach to silicon design that provides non-linear increases in performance and energy efficiency. We’re excited to partner with NUVIA on this journey as they realize this promise for the next era of semiconductors and computing.” Scott Darling, the president of Dell’s investment arm, Dell Technologies Capital said, “The formation of NUVIA is a prime example of remarkable innovation born in Silicon Valley. The best companies start when founders with outstanding track records of performance come together to identify a big problem and line up the best investment team to help them succeed. As part of that team, we’re focused on providing NUVIA with DTC’s unique value and market leverage.” In a Reuters story published today, Williams said that he could not respond to questions about whether Dell would use Nuvia’s chips, but he did comment on the nature of the semiconductor design industry: “The silicon industry is relentless. It pounds forward. You have to have a world-class team to do something disruptive enough that it will prevail despite the response of competitors. At NUVIA, we think we have found one.”
With the shortage still weighing heavy ADI delays fab closure In January Evertiq reported that Analog Devices was planning to permanently close its facility Milpitas, California.
Tower Semi invests to expand its manufacturing capabilities The company is planning a capacity expansion for 200mm and 300mm to answer the exceeding demand forecast.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Synchronous Rectification on the Secondary Side Question: How can I increase the efficiency of my isolated power supply?
Biden to push for $37 billion to boost chip manufacturing US President Joe Biden has responded to the industry’s call to reinvigorate domestic semiconductor manufacturing. The president is pushing a USD 37 billion bill to identify solutions to the semiconductor shortfall.
Kioxia starts the expansion of its Yokkaichi Plant Kioxia has started the construction of new fabrication facility at its Yokkaichi plant, located on the Mie Prefecture, Japan, to support the production of sixth-generation 3D flash memory.
Mycronic receives US order for two SLX systems The Swedish technology company has received an order for two SLX mask writers from an unnamed, but existing customer in the USA. The total order value is between USD 8 and 12 million.
HP to acquire HyperX in a $425 million HP Inc. has entered into a definitive agreement to acquire HyperX, the gaming division of Kingston Technology Company, for USD 425 million.
TSMC ranks in Top10 in three wafer size categories As of December 2020, only TSMC—the world’s largest foundry—was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
SK Hynix ink $4.3 billion deal with ASML The Dutch supplier of semiconductor equipment has signed a five-year long deal, worth USD 4.3 billion, with SK Hynix as the South Korean company works to secure equipment to boost it output.
Microchip invests $20M in new Irish development centre Up to 200 new engineering jobs will be created in Cork, Ireland as Microchip Technology invests USD 20 million to create a new development centre.
Explosive growth in Automotive DRAM demand expected Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce’s latest investigations.
Renesas Naka facility is back to full operation Following the earthquake that hit the coast of Fukushima Prefecture and the surrounding areas on February 13, Renesas shut down production at its Naka factory to investigate potential damages. Since then then company has brought the plant back online bit by bit.
Rücker Lypsa is now EDAG Engineering Spain Barcelona-based company Rücker Lypsa S.L. has been operating under the name of "EDAG Engineering Spain, S.L." since January, 2021.
Continental invests in German-US AI chip start-up Continental has acquired a minority stake in the German-US start-up Recogni, a company working on a new chip architecture for object recognition in real time based on artificial intelligence (AI).
Edmund Optics opens new assembly and design facility Edmund Optics, a provider of optical and imaging components, has opened a new Assembly and Advanced Design Facility in Tucson, Arizona, the second Edmund Optics location in the state.
SEMI calls on Biden to reinvigorate US semiconductor manufacturing SEMI, along side 16 industry groups have sent a letter to President Biden urging the administration to bolster domestic semiconductor manufacturing and research.
Solas OLED settles patent disputes with LG Display Solas OLED, an Irish company that specialises in OLED technologies that it licenses to consumer electronics manufacturers, has entered into a Settlement and License Agreement with LG Display, resolving a number of patent infringement actions brought by Solas against LG Display and a certain number of its customers, including Sony.
Panthronics seals global partnership agreement with AdvanIDe Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
Logic ICs account for the largest share of China’s IC market China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, the Chinese IC market increased to USD 143.4 billion, a 9% gain from USD 131.3 billion in 2019.
Why Is my processor leaking power? That sounds like an open-ended question Question: Why is my processor consuming more power than its data sheet suggests?
BAE Systems to produce GPS receivers in Iowa BAE Systems received a USD 247 million contract to design and manufacture an advanced military M-Code GPS receiver and ASIC.Load more news