© Intel (illustration purpose only) Components | October 15, 2019
NVIDIA leads way but competition is intensifying
Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from USD 2.6 billion in 2019 to USD 7.6 billion by 2024, with no vendor commanding more than 40% of the market. The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing. “In the face of different use cases, NVIDIA chooses to release GPU chipsets with different computational and power budgets. In combination with its large developer ecosystem and partnerships with academic and research institutions, the chipset vendor has developed a strong foothold in the edge AI industry,” said Lian Jye Su, Principal Analyst at ABI Research. NVIDIA is facing stiff competition from Intel with its comprehensive chipset portfolio, from Xeon CPU to Mobileye and Movidius Myriad. At the same time, FPGA vendors, such as Xilinx, QuickLogic, and Lattice Semiconductor, are creating compelling solutions for industrial AI applications. One missing vertical from NVIDIA’s wide footprint is consumer electronics, specifically smartphones. In recent years, AI processing in smartphones has been driven by smartphone chipset manufacturers and smartphone vendors, such as Qualcomm, Huawei, and Apple. In smart home applications, MediaTek and Amlogic are making their presence known through the widespread adoption of voice control front ends and smart appliances. Moving forward, the AI chipset vendors will likely adopt one of three strategies. The first is creating AI chipsets that target the AI-enabled on-premise server and gateway market. Supporting enterprise use cases, these servers and gateways generally have high processing capabilities and require flexible AI chipset architecture that can support the ever-changing AI inference and training workloads. This is a space currently well-served by NVIDIA, Intel, and Xilinx but new entrants such as Huawei, Graphcore, and Habana Labs may challenge the status quo. The second strategy is to target intelligent edge devices and nodes, which, to a certain extent, favors vendors that are active in the consumer electronics space. Chipset vendors like Qualcomm and MediaTek have natural advantages here. Captive vendors who design their own AI chipsets, such as Apple, Huawei, and Samsung, have also started to broaden their AI-enabled product portfolio targeting consumer devices. The final strategy is to target low-cost and battery-powered end devices that feature minimal computational capabilities and long useful lives. These devices are often deployed in smart cities, smart buildings, smart transportation, and utilities, all which rely on public Ethernet or Low-Power Wide-Area Networks (LPWANs) for connectivity. These “very edge” devices require lighter AI implementations, an approach often referred to as tiny or thin AI. ABI Research forecasts shipments for these devices will grow from 0.9 million in 2019 to 5.7 million in 2024, with a CAGR of 45.5%. Traditionally these devices rely heavily on more powerful resources, such as gateways, on-premise servers, and the public cloud for AI training. Recently, many chipset players have engaged in this segment of the market by offering AI chipsets that are ultra-power efficient with a low price point. These include GreenWave Technologies, a startup that develops AI chipset using open-source RISC-V architecture, Lattice Semiconductor, a FPGA chipset vendor, and Syntiant, an Application Specific Integrated Circuit vendor with strength in natural language processing. “The edge AI chipset market is a highly competitive one. The use cases become increasingly complex and diverse, and new players are emerging from the horizon almost monthly. Major key players have a strong heritage in building global scale for their chips, even in hugely fragmented environments. Therefore, it is crucial for the vendors, particularly newcomers, to have a clear value proposition, comprehensive software stack, and strong support from the partner ecosystem and developer community,” concluded Su.
ITW to acquire MTS Test & Simulation business From Amphenol Illinois Tool Works Inc., a global multi-industrial manufacturing company, and the provider interconnect, antenna and sensor solutions, Amphenol Corporation, have entered into an agreement under which ITW will acquire MTS Systems Corporation’s Test & Simulation business, following the closing of Amphenol’s acquisition of MTS.
Tobey Gonnerman named Fusion Worldwide's new President The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Solving the Cable TV Infrastructure Downstream Transmitter Challenge Driven by demand for faster internet connectivity, the cable TV industry has developed new network architectures for the delivery of multigigabit services to subscribers. This fiber deep approach, using a remote PHY device (RPD), moves critical hardware closer to the users by using digital fiber.
Boyd expands its footprint with new facility in Mexico Thermal management and engineered material solutions specialist Boyd Corporation, has expanded its presence in North America with a newly built facility strategically located in Juarez, Mexico.
Farnell becomes a global distribution partner NI the distributor of electronic components, products and solutions has been appointed as an NI Authorized Distributor, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
Foxconn and Winbond invest in chipmaker Kneron Foxconn and Winbond joins companies such as Qualcomm, Horizons, Sequoia and Weltrend as high profile investors in Kneron
EV Group sets up customer training facility at HQ EV Group (EVG) has established the EVG Academy, a training facility for customers that provides technical training on all classes of the company's equipment as well as on its CIM Framework software platform in an optimised environment.
Denso team up with Aeva to develop sensing and perception systems Mobility supplier Denso says that it is partnering with U.S. LiDAR and perception systems company, Aeva, to develop next-generation sensing and perception systems.
Fire hit Taiwanese MLCC manufacturer in China On January 13 a fire broke out at Taiwanese passive component maker Walsin Technology’s Dongguan, China site.
Thin Film Products joins SERMA Microelectronics SERMA Microelectronics, a subsidiary of the French electronics specialist SERMA Group, has finalised the purchase of TFP (Thin Film Products), a French manufacturer of thin-film microwave circuits for space, military and civil applications.
New Korean Zestron Technical Center opens for customers The provider of high precision cleaning products has expanded its operations by opening a new Technical Center, located in Anyang, Korea.
A2 Global Electronics names new executives Electronic component distribution and supply chain service provider, A2 Global Electronics, has appointed Anthony Andriano as its new Chief Financial Officer and promoted Jesper Romell as its new President.
ROHM expands production capacity of SiC power devices ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant, which the company started building back in February 2019, to enhance the production capacity of SiC power devices.
Elmos acquires Online Engineering GmbH Elmos is strengthening its in-house competencies in software engineering via the acquisition of Dortmund based engineering service provider Online Engineering.
Plasmatreat expands with new subsidiary in Switzerland The technology company says it has further developed its international proximity to its customers by founding its new subsidiary Plasmatreat Schweiz AG, and thus taking steps to better serve the Swiss market.
RAFI Group increases their presence on the Nordic market The RAFI Group, a specialist of human–machine interaction and EMS, increases their presence on the Nordic market in 2021. Stefan Steiner has been named the RAFI sales manager for the Nordic operations located in Stockholm.
Filtronic wins new UK defence contract UK designer and manufacturer of antennas, filters and mmWave products, Filtronic plc, has won a significant contract from a new major UK defence customer for the supply of battlefield radio communications hardware valued at over GBP 1 million.
A2 Global expands with new facility in Singapore Electronic component distribution and supply chain service provider, A2 Global Electronics, announces the opening of its new distribution facility located in the New Tech Park area of Singapore.
Sensata acquires majority ownership of Lithium Balance Sensata, an industrial technology company that develops sensors and sensor-based solutions, has acquired 75% of Lithium Balance based in Denmark.
Analog Devices to shutter California facility In a WARN notice, the company says that due to changing business needs will require the company to permanently close its facility Milpitas, California.
Intelliconnect moves to larger factory as sales grow Intelliconnect (Europe) Ltd the UK based specialist manufacturer of RF, waterproof and cryogenic connectors and cable assemblies, announces that it has moved to a larger facility at the Corby Innovation Hub following sales growth of 30% in 2020.
Pat Gelsinger to replace Bob Swan as Intel CEO Intel has appointed 40-year technology industry veteran Pat Gelsinger as its new chief executive officer, effective February 15, 2021. He will succeed Bob Swan, who will remain CEO until Pat starts.
Qualcomm to acquire NUVIA Qualcomm says it has entered into a definitive agreement to acquire NUVIA for approximately USD 1.4 billion before working capital and other adjustments.
Advanced Energy acquires RF specialist Advanced Energy, a provider of precision power conversion, measurement, and control solutions, has completed the acquisition of Versatile Power, a Campbell, California-based provider of radio frequency (RF) and programmable power supplies for medical and industrial applications.
Achronix to list on Nasdaq via merger with ACE Convergence FPGA and embedded FPGA specialist, Achronix Semiconductor, has entered into a business combination agreement with special-purpose acquisition company ACE Convergence Acquisition Corp., which result in a combined entity which will continue as a publicly listed company.
iCoupler Technology Benefits Gallium Nitride (GaN) Transistors in AC/DC Designs Highly efficient ac/dc power supplies are key to the evolution of the telecom and datacom infrastructure, as power consumption grows rapidly due to hyperscale data centers, enterprise servers, or telecom switching stations. However, the power electronics industry has reached the theoretical limit of silicon MOSFETs.Load more news