© edhar yralaits dreamstime.com Business | June 17, 2019
Purdue & TSMC team up on centre for secured microelectronics
Purdue University and TSMC have jointly announced plans to establish a Centre for Secured Microelectronics Ecosystem aimed at ensuring a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system.
The center, to be located at the Purdue University West Lafayette campus (Indiana) in collaboration with Purdue Research Foundation, will perform research to ensure a secure ecosystem for the manufacture of microelectronics systems. “Semiconductors will continue to be the enabling backbone for technological and economic growth in the 21st century, propelling advancements in the internet of things, autonomous transportation, artificial intelligence, advanced manufacturing, and many other applications,” U.S. Secretary of Commerce Wilbur Ross said, in a press release. “We are pleased that TSMC and Purdue University took their partnership to the next level at SelectUSA — a platform for leading global semiconductor manufacturers to continue expanding and investing in the United States. Under President Trump’s leadership, the administration will continue doing all it can to grow and equip our highly skilled workforce, maintain our competitive investment and regulatory environment, and support world-class American research universities.” “This agreement solidifies a vital global partnership for Purdue and enables our leading researchers to further advance their discoveries in microelectronics,” said Purdue University President Mitch Daniels. “TSMC’s commitment is only the beginning of what we believe will be an internationally significant initiative.” The Purdue School of Electrical and Computer Engineering has about 10 faculty members currently collaborating with TSMC at various levels of research. The new centre is expected to begin operations at the beginning of the new academic year. In February, the Semiconductor Industry Association reported that the global semiconductor industry posted sales of USD 468.8 billion in 2018, the industry’s highest-ever annual total, and an increase of 13.7% compared with the previous year. “This industry is one of the most important for our global economy and security,” said Chad Pittman, vice president of the Purdue Research Foundation National Security and Defense Program Office and Government Relations. “The strengths in research and development of Purdue and TSMC will help support and advance this critical industry on multiple levels and help secure the ever-advancing microelectronics technology.” The agreement also allows TSMC to help facilitate access to multi-project wafer shuttle runs to test the effectiveness of the proposed research and to assign representatives on the advisory board of the center to mentor specific projects.
KORE Wireless picks up Integron KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
memsstar ships MEMS production system to University of Freiburg memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Vishay's plant in Turin, Italy, receives R&D grant Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.
TowerJazz to maintain its TPSCo majority ownership Israeli semiconductor manufacturer, TowerJazz, says that it will not sell its stake and board control in its joint venture with Panasonic Corp in Japan, following the Japanese company's announcement that it is selling its semiconductor business.
NI invests $40M in expansion of multifunctional facility in Penang National Instruments is planning to expand its operations in Penang, Malaysia with a new investment which will create over 250 new jobs.
Rimac chooses Analog Devices to enable precision battery management Rimac Automobili is planning to incorporate Analog Devices, Inc’s precision battery management system (BMS) integrated circuits (ICs) into Rimac’s BMS.Load more news