© Toshiba Memory Business | May 17, 2019
Toshiba and WD to jointly invest in flash manufacturing facility
Toshiba Memory Corporation and Western Digital have finalised a formal agreement to jointly invest in the “K1” manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan.
The K1 facility will produce 3D flash memory to support growing demand for storage in applications such as data centers, smartphones and autonomous cars. Construction of the K1 facility is expected to be completed in the fall of calendar 2019. The companies’ joint capital investments in equipment for the K1 facility will enable initial production output of 96-layer 3D flash memory beginning in calendar 2020, with meaningful output expected to begin later in the year, according to a press release. “We are determined to demonstrate Toshiba Memory’s leadership in the market, including collaborating with Western Digital to actively execute initiatives that will strengthen our mutual competitiveness,” says Yasuo Naruke, President and CEO of Toshiba Memory, in the release. “We look forward to jointly developing 3D flash memory and carrying out investments tailored to promising market opportunities.” “The agreement to jointly invest in the K1 facility marks the continuation of our highly successful collaboration with Toshiba Memory, which has fostered growth and innovation of NAND flash technology for two decades,” adds Steve Milligan, chief executive officer of Western Digital. “Western Digital’s long-term investment strategy for the Kitakami site reflects our ongoing commitment to drive flash technology development and manufacturing along with Toshiba Memory. This expansion positions us well to provide the industry’s most competitive flash supply to meet long-term demand trends driven by the growing volume, velocity, variety and value of data.”
Private equity firm acquires Evans Capacitor Company Arcline Investment Management has acquired the Rhode Island based manufacturer of high energy density capacitors.
Diodes completes its acquisition of Lite-On Semiconductor Diodes Incorporated has completed its close to USD 450 million acquisition of Lite-On Semiconductor (LSC).
Toshiba says it's not negotiating with UMC Toshiba Electronic Devices & Storage Corporation states that despite certain media reports, the company is not selling two of its fabs to Taiwanese United Microelectronics Corporation.
NVIDIA acquires Swedish VCSEL startup On the heels of the GPU-giant’s massive USD 40 billion acquisition of ARM – which was just made official back in September – comes yet another acquisition; though this time at a much smaller scale.
Analog Devices ends its fiscal year 2020 on a high Fourth quarter revenue came in at USD 1.53 billion, above the high-end of the company’s outlook.
GlobalWafers confirms takeover discussions with Siltronic The Taiwanese company says it is in advanced, near to final discussions on a takeover offer of German supplier of silicon wafers, Siltronic AG.
Covid-19 halts Chinese SK Hynix plant The discovery of an asymptomatic, but infected, employee brought SK Hynix’s plant in Chongqing, China to a halt on Sunday.
Murata to shut down Chinese production facility Saitama Murata Manufacturing, a subsidiary of Murata, will close its its coil production subsidiary Sheng Long TOKO Tech, located in Shenzhen, China, during December 2020
Antistat™ launch new product range of ESD Anti-fatigue matting Manufactured in the EU, Antistat’s new range of matting blends exceptional quality with durability offering a life span of up to 5 years.
Digi-Key inks new U.S. distribution partnership with MISCO Digi-Key Electronics has expanded its product portfolio to include a U.S. distribution partnership with MISCO, a resource offering complete audio solution services.
Arkema kickstarts capacity increase of fluoropolymer in China Arkema is starting up its 50% capacity increase of Kynar fluoropolymer for the lithium-ion battery business at its Changshu plant in China in December 2020, with the first commercial supplies for January 2021.
STMicro and YTO set up joint lab for smart agricultural equipment Semiconductor manufacturer STMicroelectronis, is teaming up with Chinese provider of agricultural and construction machinery YTO Group to establish a joint lab which will focus on R&D of electronic solutions for engine, vehicle, and agricultural controls in tractors.
12 new 1200V Hyperfast and Ultrafast Rectifiers from Vishay New Yorker Electronics has announced the availability of 12 new FRED Pt® Gen 5 1200 V Hyperfast and Ultrafast rectifiers from Vishay Semiconductor. The ideal choice for soft switched and resonant high frequency converters, it features a unique combination of low conduction and switching losses.
SKT's new AI chip changes the company's AI semiconductor business vision SK Telecom (SKT) has unveiled its new, self-developed, AI chip named SAPEON X220; a chip that, according to the company, will alter the company's AI semiconductor business vision.
Labour dispute at ST France – the conflict continues The strike at STMicroelectronics French operations continues. For the last four weeks, the site in Crolles has been on an indefinite strike following the company’s decision not to increase employee salaries this year.
Tachyum resumes hiring in Slovakia and USA Following a short halt due to COVID-19, the Silicon Valley and Slovakian semiconductor company says that it is restarting its hiring activities.
Intel CEO pens open letter to President-elect Biden Intel CEO Bob Swan is, in an open letter, urging the President-elect to invest in U.S. manufacturing.
Wafer acpacity by feature size shows strongest growth at <10nm IC capacity for leading-edge (<10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, based on information in IC Insights’ Global Wafer Capacity 2020-2024 report.
Powell Electronics now Europe’s largest Positronic stockist Powell Electronics, the supplier of connectors and more for high-rel applications, is to become Europe’s largest stocking distributor of Positronic connectors following a franchise deal signed by the two companies.
Alps Alpine develops, starts shipping samples of HAPTIC Reactor Heavy Type Alps Alpine Co., Ltd. has developed the HAPTIC™ Reactor Heavy Type for powerful vibrations in touch feedback. Sample shipments, destined primarily for the automotive market, begin in October 2020, with a start to mass production expected in January 2021.
SkyWater and Multibeam form partnership to deploy Multibeam’s Innovative MEBL system Maskless lithography technology company, Multibeam Corporation, has disclosed a partnership to deploy Multibeam’s Multicolumn Electron-Beam Lithography (MEBL) system into SkyWater’s newly expanded fabrication facility in support the company roadmap to advance its manufacturing capabilities and accelerate growth.
Intel to keep its number One in 2020 Seven top-15 semiconductor suppliers forecast to show ≥22% growth this year with Nvidia expected to post a huge 50% increase, writes market researcher IC Insights in their latest report.
Trina Solar buys 1.2B units of 210mm monocrystal silicon wafers from Zhonghuan On 19 November 2020, Changzhou Trina Solar Energy and Tianjin Zhonghuan Semiconducto, signed a framework contract. Under the contract, Trina Solar intends to purchase 210mm monocrystal silicon wafers from Tianjin Huanou International Silicon Material Co., Ltd., a Zhonghuan subsidiary.
Kontron Industrial AI Platform for easy integration of Artificial Intelligence The Kontron Industrial AI Platform accelerates the use of AI algorithms for inference in industrial environments, such as quality control or predictive maintenance.Load more news