© otnaydur dreamstime.com Business | May 13, 2019
Elektrobit and Synopsys form joint effort to advance virtual system testing
Silicon Valley-based Synopsys Inc. and Elektrobit (EB), headquartered in Bavaria, are collaborating in an effort to accelerate automotive electronic systems development using virtual environments, allowing automotive tier 1 and OEMs to move from physical to virtual system testing.
The endeavor will bring together Synopsys Virtualizer Development Kits (VDKs), EB operating systems, development and test tools, and complementary expertise to enable pre-silicon and pre-electronic control unit (ECU) hardware availability and software development. "Automakers engaged at the forefront of automotive development are faced with increased electronic hardware complexity and software content that needs to be delivered within very challenging development timelines," said Martin Schleicher, executive vice president, Business Management at EB. "Together, Synopsys and Elektrobit are providing technologies and expertise enabling automotive engineers to start software development earlier and dramatically accelerate system testing using virtual ECUs." Synopsys VDKs deliver fast simulation of ECU hardware from individual processors to full automotive electronic systems (virtual ECU). EB is using Synopsys VDKs to port its AUTOSAR operating systems, featuring EB corbos and EB tresos product lines, to new automotive processors from leading semiconductor vendors up to 12 months before silicon availability. The integrated solution has been used to establish a virtual development environment demonstrator, bringing together a virtual ECU based on NXP's high-performance S32 Automotive Processing Platform with tools from EB and Synopsys. This solution enables system analysis and visualization, configuration and update management, test drivers, and system management and allows automotive developers to increase interactive software debugging productivity and accelerate testing cycles by deploying the solution in regression. Leading tier 1 and OEM companies have deployed the joint solution for applications ranging from automotive control to autonomous driving and gateway. "Automotive companies desire to deliver their customers new and more advanced functions based on the NXP S32 Automotive Processing Platform and require development tools that enable them to start early and accelerate system testing," says Dev Pradhan, senior director, Automotive Engineering at NXP Semiconductors. "Ecosystem collaborations amongst industry leaders such as Synopsys and Elektrobit are a key enabler for our customers to increase their development productivity and address current and future system and software development challenges." "Reducing automotive development cycles from five years to two years requires a disruption in the current hardware-dependent and linear development approach," says Burkhard Huhnke, vice president Automotive Strategy at Synopsys. "The collaboration between Synopsys and Elektrobit brings virtual prototyping, software technologies, and expertise to automotive tier 1 and OEM companies looking to transition from physical to virtual development environments and accelerate their time to market."
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Sponsored content by CMLCML manufactures Insulated Metal Substrate (IMS) solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.
Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news