© otnaydur dreamstime.com Business | May 13, 2019
Elektrobit and Synopsys form joint effort to advance virtual system testing
Silicon Valley-based Synopsys Inc. and Elektrobit (EB), headquartered in Bavaria, are collaborating in an effort to accelerate automotive electronic systems development using virtual environments, allowing automotive tier 1 and OEMs to move from physical to virtual system testing.
The endeavor will bring together Synopsys Virtualizer Development Kits (VDKs), EB operating systems, development and test tools, and complementary expertise to enable pre-silicon and pre-electronic control unit (ECU) hardware availability and software development. "Automakers engaged at the forefront of automotive development are faced with increased electronic hardware complexity and software content that needs to be delivered within very challenging development timelines," said Martin Schleicher, executive vice president, Business Management at EB. "Together, Synopsys and Elektrobit are providing technologies and expertise enabling automotive engineers to start software development earlier and dramatically accelerate system testing using virtual ECUs." Synopsys VDKs deliver fast simulation of ECU hardware from individual processors to full automotive electronic systems (virtual ECU). EB is using Synopsys VDKs to port its AUTOSAR operating systems, featuring EB corbos and EB tresos product lines, to new automotive processors from leading semiconductor vendors up to 12 months before silicon availability. The integrated solution has been used to establish a virtual development environment demonstrator, bringing together a virtual ECU based on NXP's high-performance S32 Automotive Processing Platform with tools from EB and Synopsys. This solution enables system analysis and visualization, configuration and update management, test drivers, and system management and allows automotive developers to increase interactive software debugging productivity and accelerate testing cycles by deploying the solution in regression. Leading tier 1 and OEM companies have deployed the joint solution for applications ranging from automotive control to autonomous driving and gateway. "Automotive companies desire to deliver their customers new and more advanced functions based on the NXP S32 Automotive Processing Platform and require development tools that enable them to start early and accelerate system testing," says Dev Pradhan, senior director, Automotive Engineering at NXP Semiconductors. "Ecosystem collaborations amongst industry leaders such as Synopsys and Elektrobit are a key enabler for our customers to increase their development productivity and address current and future system and software development challenges." "Reducing automotive development cycles from five years to two years requires a disruption in the current hardware-dependent and linear development approach," says Burkhard Huhnke, vice president Automotive Strategy at Synopsys. "The collaboration between Synopsys and Elektrobit brings virtual prototyping, software technologies, and expertise to automotive tier 1 and OEM companies looking to transition from physical to virtual development environments and accelerate their time to market."
Cicor expands capacity at Wangs facility Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
Pixelworks to sell 7% stake to Chinese investors Pixelworks says it has entered into a Securities Purchase Agreement with MTM-Xinhe Investment Limited, a consortium of investors from the Chinese semiconductor and mobile eco-system, under which Pixelworks would issue and sell in shares representing about 7% of the company's outstanding shares for USD 6.6 million dollars.
Allegro MicroSystems sets terms for $325 IPO Allegro MicroSystems, a fabless chip company focusing on sensing and power technology, has commenced a proposed initial public offering of its common stock.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Advantech expands with three new offices in North America The embedded production and solution provider has opened three new branch offices in Downers Grove, Illinois; Danvers, Massachusetts; and Toronto, Canada.
ASM's CFO, Peter van Bommel, to retire Chief Financial Officer, Peter van Bommel, has notified the Supervisory Board of ASM of his wish to retire from the company at the next Annual General Meeting to be held in May 2021.Load more news