© dmitriy shironosov dreamstime.com Components | November 20, 2018
ams & Qualcomm to focus engineering on active stereo camera solution
ams and Qualcomm Technologies jointly announced the intent to focus engineering efforts towards a 3D depth sensing camera solution for mobile phone applications like 3D imaging and scanning and, in particular, biometric face authentication.
With ams’ VCSEL light sources and optical IR pattern technology incorporating mass- production proven wafer level optics and Qualcomm's Snapdragon Mobile Platforms, the companies have a goal to create a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones. Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning, a press release reads. “Qualcomm Technologies is committed to providing active depth camera solutions to our customers,” says Keith Kressin, senior vice president, product management, Qualcomm Technologies, Inc. “We’re excited to work with ams on the development and commercialization of this reference design with the goal of bringing these depth sensing solutions to consumers in the future.” “ams provides the full range of IR illumination devices specifically designed to address the three 3D technologies Active Stereo Vision, Structured Light and Time-of-Flight (ToF). Utilizing this leading capability together with Qualcomm Technologies’ mobile application processors for active stereo camera solutions is an exciting opportunity. We want to enable fast time-to-commercialization and broad-based availability of high quality 3D sensing solutions for Android-based smartphones and mobile devices, and this is a step towards this goal,” adds Alexander Everke, CEO of ams.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
Sponsored content by CMLCML manufactures Insulated Metal Substrate (IMS) solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.
Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news