© vinnstock dreamstime.com Components | November 12, 2018
European semiconductor distribution keeps growth momentum in Q3/2018
DMASS reports 6.3% growth in semiconductor distribution for Q3/CY18. Growth ranges vary by region and country. Major currency effects. Significant variation by region. Smaller countries and Eastern Europe increase faster than key regions. Major product groups struggle.
So far, 2018 has proved to be a healthy mid-single-digit growth year for the European semiconductor distribution industry. With product shortages and price increases continuing through the summer, Q3/2018 ended, according to DMASS Ltd., with 2.3 Billion Euro of sales, an increase of 6.3% compared to 2017. The first nine months of 2018 showed exactly the same increase of 6.3%, to 6.91 Billion Euro of sales, a press release reads. Georg Steinberger, chairman of DMASS: “Compared to the double-digit projections we keep seeing for the total European semiconductor market from WSTS and others, European distribution does not seem to enjoy the same dynamics. However, most of their total projections are in US Dollars. Stated in US Dollars as well, DMASS grew by 14% in the first nine months of 2018.” By country and region, the growth spread in Q3/2018 is rather large, between +41% and -17%. Of the major regions/countries, Eastern Europe and Benelux led the pack, while Germany, Austria, Russia and Nordic trailed the average growth. In numbers, Germany grew by 2.4% to 700 Million Euro, Italy by 5% to 193 Million Euro, the UK by 9.5% to 166 Million Euro, France by 9% to 155 Million Euro, Eastern Europe by 15.6% to 375 Million Euro and Nordic by 3.2% to 189 Million Euro. Georg Steinberger: “After 9 months, it shows clearly that countries with a rather huge contract manufacturing focus are growing significantly faster than the major countries in Western Europe. And most of these contractor countries are in the East and to some extent the South of Europe.” On the product side, growth rates were widely distributed, too – between -17% and +45%. Similarly to Q2, commodities like Discretes and Standard Logic did exceptionally well, while the key areas Analog and MOS Micro trailed the trend – although for different reasons – and Opto products actually decreased. Discretes grew by 23.5% to 141 Million Euro, Power Discretes by 12.1% to 240 Million Euro, Sensors by 11.4% to 56 Million Euro. Opto on the other side shrank by 2.7% to 210 Million Euro. Analog ICs grew by 3.4% to 678 Million Euro, Memories increased by 9.9% to 189 Million Euro, MOS Micro by 3.7% to 466 Million Euro, Programmable Logic by 6.8% to 147 Million Euro, Standard Logic by 9.9% to 40 Million and finally Other Logic (ASSPs etc.) by 11.4% to 128 Million Euro. Georg Steinberger: “What is clearly visible from a 9-months-view, is that a group of commodities did really well, while some areas like LEDs, Analog and “older” MOS Micro technologies suffered. In the MOS Micro arena it seems that MPUs and higher end MCUs are taking control, while the Analog field is seeing former distribution business being handled by manufacturers direct. For the year 2018, we maintain our position of a solid single-digit ending.”
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.
Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news