© vinnstock dreamstime.com Components | November 12, 2018
European semiconductor distribution keeps growth momentum in Q3/2018
DMASS reports 6.3% growth in semiconductor distribution for Q3/CY18. Growth ranges vary by region and country. Major currency effects. Significant variation by region. Smaller countries and Eastern Europe increase faster than key regions. Major product groups struggle.
So far, 2018 has proved to be a healthy mid-single-digit growth year for the European semiconductor distribution industry. With product shortages and price increases continuing through the summer, Q3/2018 ended, according to DMASS Ltd., with 2.3 Billion Euro of sales, an increase of 6.3% compared to 2017. The first nine months of 2018 showed exactly the same increase of 6.3%, to 6.91 Billion Euro of sales, a press release reads. Georg Steinberger, chairman of DMASS: “Compared to the double-digit projections we keep seeing for the total European semiconductor market from WSTS and others, European distribution does not seem to enjoy the same dynamics. However, most of their total projections are in US Dollars. Stated in US Dollars as well, DMASS grew by 14% in the first nine months of 2018.” By country and region, the growth spread in Q3/2018 is rather large, between +41% and -17%. Of the major regions/countries, Eastern Europe and Benelux led the pack, while Germany, Austria, Russia and Nordic trailed the average growth. In numbers, Germany grew by 2.4% to 700 Million Euro, Italy by 5% to 193 Million Euro, the UK by 9.5% to 166 Million Euro, France by 9% to 155 Million Euro, Eastern Europe by 15.6% to 375 Million Euro and Nordic by 3.2% to 189 Million Euro. Georg Steinberger: “After 9 months, it shows clearly that countries with a rather huge contract manufacturing focus are growing significantly faster than the major countries in Western Europe. And most of these contractor countries are in the East and to some extent the South of Europe.” On the product side, growth rates were widely distributed, too – between -17% and +45%. Similarly to Q2, commodities like Discretes and Standard Logic did exceptionally well, while the key areas Analog and MOS Micro trailed the trend – although for different reasons – and Opto products actually decreased. Discretes grew by 23.5% to 141 Million Euro, Power Discretes by 12.1% to 240 Million Euro, Sensors by 11.4% to 56 Million Euro. Opto on the other side shrank by 2.7% to 210 Million Euro. Analog ICs grew by 3.4% to 678 Million Euro, Memories increased by 9.9% to 189 Million Euro, MOS Micro by 3.7% to 466 Million Euro, Programmable Logic by 6.8% to 147 Million Euro, Standard Logic by 9.9% to 40 Million and finally Other Logic (ASSPs etc.) by 11.4% to 128 Million Euro. Georg Steinberger: “What is clearly visible from a 9-months-view, is that a group of commodities did really well, while some areas like LEDs, Analog and “older” MOS Micro technologies suffered. In the MOS Micro arena it seems that MPUs and higher end MCUs are taking control, while the Analog field is seeing former distribution business being handled by manufacturers direct. For the year 2018, we maintain our position of a solid single-digit ending.”
Cicor expands capacity at Wangs facility Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
Pixelworks to sell 7% stake to Chinese investors Pixelworks says it has entered into a Securities Purchase Agreement with MTM-Xinhe Investment Limited, a consortium of investors from the Chinese semiconductor and mobile eco-system, under which Pixelworks would issue and sell in shares representing about 7% of the company's outstanding shares for USD 6.6 million dollars.
Allegro MicroSystems sets terms for $325 IPO Allegro MicroSystems, a fabless chip company focusing on sensing and power technology, has commenced a proposed initial public offering of its common stock.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Advantech expands with three new offices in North America The embedded production and solution provider has opened three new branch offices in Downers Grove, Illinois; Danvers, Massachusetts; and Toronto, Canada.
ASM's CFO, Peter van Bommel, to retire Chief Financial Officer, Peter van Bommel, has notified the Supervisory Board of ASM of his wish to retire from the company at the next Annual General Meeting to be held in May 2021.Load more news