© Autotalks Products | September 06, 2018
Autotalks Launches the World's First Global V2X Solution
By adding C-V2X to its existing 2nd generation automotive qualified chipset, Autotalks is paving the way to road safety everywhere
This is a product release announcement by Autotalks. The issuer is solely responsible for its content.
Autotalks, global leader in V2X, announced the launch of the first ever global V2X solution. Autotalks’ deployment-ready, 2nd generation V2X (Vehicle to Everything) chipset is the only available solution capable of supporting both DSRC and C-V2X direct communications (PC5 protocol) at the highest security level. The chipset supports DSRC based on 802.11p/ITS-G5 standards and C-V2X based on 3GPP specifications. V2X communication is heading to mass-market adoption as the world’s largest OEMs announced intentions to equip their new car models with the technology. In recent years, V2X diverged into two different technologies, DSRC and C-V2X, with fundamentally different architectures, making it difficult to harmonize a single global solution. Autotalks, a leader and innovator in V2X, addresses the need for a global solution by equipping its mass-market ready 2nd generation chipsets with C-V2X in addition to their native support of DSRC. Autotalks brings a decade of wireless expertise, which led to an industry leading radio performance. This solid foundation of modem and radio specifically built and optimized for V2X, coupled with the company’s deep knowledge of 3GPP standards and implementation, will result in superior C-V2X direct communications performance. While DSRC-based V2X is deployed in the US, Europe and Japan, C-V2X is gaining momentum in other regions. Autotalks chipsets were designed from the ground up to meet V2X market requirements and standards, which gives its C-V2X offering a head start to meet security, environmental, quality, thermal and other requirements. Delivering dual-mode (DSRC and C-V2X) functionality on existing automotive qualified AEC-Q100 grade 2 chipsets while leveraging production grade software and maintaining the present API, enables the shortest time to market for a global dual-mode V2X platform. Autotalks solution minimizes development, testing and certification efforts for a V2X system to be deployed anywhere, via a software-defined toggle between V2X technologies. Autotalks’ PC5 solution utilizes the globally defined 5.9 GHz ITS spectrum for V2X and is cellular network agnostic (no cellular SIM or coverage required, works without or with any 3G/4G/5G cellular modem). Separating V2X from the cellular Network Access Device (NAD) improves the cost-effectiveness of Telematic Control Unit (TCU) deployments. The separation of V2X from in-vehicle infotainment ensures that the purpose of the V2X system, which is giving drivers alerts of on-road dangers, is not compromised. Furthermore, V2X isolation combined with Autotalks’ recognized cybersecurity leadership, leads to a truly secure platform; a fundamental V2X requirement and necessity. To learn more about the separation of PC5 from cellular NAD, please read this whitepaper. “Autotalks is proud to announce that its existing 2nd generation chipset can now support PC5,” said Hagai Zyss, CEO of Autotalks. “It is a revolutionary stride proving Autotalks’ market leadership. This demonstrates that a truly secure global V2X solution could have only been developed by a company that has multidisciplinary experience in creating Automotive safety communication solutions. We are committed to staying forward thinkers and bringing to mass-market a V2X solution that will save lives in all regions and protocols in the most cost-efficient manner.”
Imagination announces latest licensing deal with NXP Imagination Technologies says that NXP has extended its license for Imagination’s Ethernet Packet Processor (EPP) IP for use in S32 vehicle network processors.
Synaptics to buy rights to Broadcom’s Wireless IoT connectivity business Synaptics Incorporated has signed definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of Broadcom for approximately USD 250 million in an all-cash transaction.
Apple to start mass producing Mac SoC, projected to cost under US$100 According to the latest investigations by TrendForce, Apple officially unveiled its self-designed Mac SoC processors based on the ARM architecture in June, with the market release of the first Mac device with Apple Silicon (which broadly refers to chips designed by Apple) scheduled to take place by the end of this year.
Mini LED supply chain to benefit from Apple’s new 12.9-inch iPad Pro As Apple’s upcoming release of products featuring Mini LED backlight generates a growth in Mini LED demand, the company has also stimulated actors in the Mini LED supply chain to increase their production capacities.
National Instruments completes acquisition of OptimalPlus NI has officially closed the acquisition of OptimalPlus, a data analytics software provider for the semiconductor, automotive and electronics industries.
LeddarTech acquires VayaVision LeddarTech has acquired sensor fusion and perception software company VayaVision.
ON Semi to provide Danfoss with high power devices ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the fast growing electric vehicle market.
X-FAB hit by cyber attack On the fifth of July, the mixed signal foundry expert, was the target of a cyber security attack.
UK and France on the map for Huawei Back in 2018, Huawei acquired 500 acres of land in Cambridge. Now the first phase of the Huawei Campus was approved by the local council and the company is gearing up to start the expansion. Adding to that, in late February, the Chinese telecom giant said it intends to build an automated factory will focus on 4G and 5G equipment in France.
Jenoptik is looking to accelerate growth with acquisition of TRIOPTICS Jenoptik is acquiring 100% of the shares in TRIOPTICS GmbH, a supplier of test equipment and manufacturing systems for optical components and sensors.
Global microelectronics market with overall stable development "Although the growth path of the global microelectronics market is intact, on a long-term trend-line, it declined by 12.1 percent to USD 412 billion in 2019," said Dr. Sven Baumann, ZVEI expert for microelectronics, sensors and actuators.
Jörg Doblaski takes on the role of X-FAB CTO X-FAB Silicon Foundries announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.
GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021 The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass USD 1 billion in 2021, energised by demand from hybrid & electric vehicles, power supplies, and photovoltaic (PV) inverters.
POET and Sanan IC Inks LoI to form $50 million JV The proposed JV aims to disrupt the data center market using the POET Optical Interposer to achieve superior economics and scale.
SG Wireless designates Digi-Key as authorised distributor for the US SG Wireless, the IoT solutions arm of EMS provider Season Group, has added Digi-Key as an authorised distributor of its IoT products for the US.
Kioxia completes acquisition of LITE-ON Technology’s SSD business Kioxia Holdings Corporation says it expects to complete its acquisition of LITE-ON Technology Corporation’s Solid State Drive (SSD) business, Solid State Storage Technology Corporation and its affiliated companies on July 1, 2020.
II-VI licenses technology for SiC devices and modules for power electronic II‐VI Incorporated has singed an agreement with General Electric to license GE's technology to manufacture silicon carbide (SiC) devices and modules for power electronics.
Dialog Semi completes its acquisition of Adesto Dialog Semiconductor says it has completed the acquisition of Adesto Technologies Corporation (Adesto)), a provider of custom ICs and embedded systems for the IIoT market.
Changes in NAND Flash Prices to Be Limited in 3Q20 Despite the reduced demand for consumer electronics and smartphones as a result of the COVID-19 pandemic, the NAND Flash market showed a short supply in 1H20, thanks to the corresponding rising demand for cloud services and distance education, as well as increased inventory procurement by some clients concerned with a possible breakage in the supply chain.
USI breaks ground on its new Huizhou manufacturing facility The electronics designer and manufacturer is looking to reinforce its foundation in Southern China and is doing so by adding a new manufacturing facility in Huizhou (Guangzhou, China).
R&M opens U.S. production facility The 10,000-square-foot facility in Elkridge, Maryland aims to services U.S. East Coast, Southern and Midwestern customers with consulting, production, support, and rapid delivery.
Osram: Slight recovery after weak 3rd quarter expected Osram Licht AG expects for the fiscal year 2020 a comparable revenue decline of -15 to -19 percent (previously:-3 and +3 percent), an adjusted EBITDA margin of 3 to 6 percent (previously: 9 to 11 percent) and a negative free cash flow in the mid double digit to lower triple digit million range.
Taiwan edges South Korea as largest base for IC wafer capacity China capacity expansion forecast to push the country into second place in the regional rankings in 2022, trailing only Taiwan in size.
Siemens acquires UltraSoC Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).Load more news
- A new EMS provider sees the light of day
- Global microelectronics market with overall stable development
- GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021
- Germany amps up domestic battery production with massive state subsidies
- ABB completes divestment of Power Grids to Hitachi