© Apple - for illustrative purposes Business | July 30, 2018
Finisar to expand 3D VCSEL production capacity
Finisar, a supplier of 3D Sensing VCSEL (Vertical Cavity Surface Emitting Laser) technology, held a ribbon-cutting ceremony on the 9th of July to celebrate its new manufacturing facility in Sherman, Texas.
Finisar will use the site to increase production capacity of its VCSELs and related 3D Sensing technologies, used in a wide range of applications The company has been working diligently to prepare the site for operations. The building, formerly owned by MEMC and SunEdison, has been under renovation since December 2017 and is on target to commence production by the end of this calendar year. It is currently certified as clean room operational and the first production tooling has been installed and qualified. The company has hired nearly 200 employees, including the operations and support staff necessary to begin production. Finisar expects to expand hiring further later this year to support the anticipated ramp to high volume production, a press release reads. “Finisar is excited to unveil this new state-of-the-art facility which will expand critical production capacity of our VCSEL products needed to support customer requirements,” said Michael Hurlston, Finisar’s CEO. “We are also pleased to create hundreds of manufacturing jobs in the US and to hire talent from the local area as we work together to make Sherman the VCSEL Capital of the World.” Originally used by Finisar in its optical communication products, VCSEL technology is extending the possibilities of consumer and scientific applications including 3D facial recognition, augmented reality, automotive in-cabin sensing and automotive LIDAR.
Cooperation between Elmos and Fraunhofer Institute IMS comes to an end The cooperation between Elmos Semiconductor AG and Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) in Duisburg will end on June 30, 2020 in accordance with the agreed contract period, despite Elmos wishes to continue.
Exxelia picks up Micropen Technologies Exxelia, a Paris-headquartered designer and manufacturer of high-rel passive components and sub-systems for extreme environments announced the completion of its late-2019 acquisition of Micropen Technologies Corporation.
Calif-based Pixelworks broadens footprint in China Video and display processing solutions provider Pixelworks Inc. has opened a new engineering center in Shenzen, China.
Jenoptik to acquire 100% of Spanish company Jenoptik is strengthening its position as a full-service provider of automated manufacturing solutions via the acquisition of Spanish company INTEROB. The contract was signed on January 25th and is expected to close in the coming weeks. The purchase price was slightly less than twice the revenue in 2019.
Broadcom to supply wireless components to Apple Certain subsidiaries of Broadcom have entered into two separate multi-year statement of work agreements with Apple Inc.
TowerJazz, Cadence, and KPI to open analog design lab TowerJazz, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, are collaborating to open a new analog circuit design lab in Ukraine.
STMicro CEO: ‘We closed 2019 with a solid fourth quarter’ The semiconductor manufacturer reported 2019 fourth quarter new revenues of USD 2.75 billion, gross margin of 39.3%, operating margin of 16.7% and new income of USD 392 million.
Car supplier Harman plans to close German site The automotive supplier Harman apparently wants to stick to its plans and close the plant in Straubing (Germany). Between 625 and 700 jobs are affected.
Camtek receives orders for 34 systems from five manufacturers Camtek says it has received orders for 34 systems for 2D inspection of CMOS image sensors from five different manufacturers, of which 25 are from two customers.
Changes to Next Biometrics' management Next Biometrics' CFO, Knut Stålen, will step down from his position on the last day of February 2020. Knut Stålen has been with NEXT Biometrics since 2014.
Foxconn and Heraeus sign MoU Foxconn Technology Group and Heraeus have signed a Memorandum of Understanding for a strategic cooperation within the space of 5G.
BAE to pick up Collins Aerospace’s GPS business and Raytheon’s ATR business BAE Systems has reached definitive agreements for the proposed acquisitions of Collins Aerospace’s military Global Positioning System (GPS) business and Raytheon’s Airborne Tactical Radios (ATR) business.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.Load more news