© Analog Devices Inc Products | June 26, 2018
Isolated 4-Port 802.3bt PoE++ PSE controller delivers up to 71.3W
Analog Devices announces the Power by Linear LTC4291/LTC4292 isolated 4-port power sourcing equipment (PSE) controller chipset designed for use in IEEE 802.3bt (PoE++) Power over Ethernet (PoE) systems.
This is a product release announcement by Analog Devices Inc.. The issuer is solely responsible for its content.
The LTC4291/LTC4292 provides 4 independent PSE ports comprised of 2 channels each, ensuring fully compliant support for the next generation of IEEE 802.3bt powered devices (PDs). The LTC4291 includes a digital interface to the PSE host, while the LTC4292 implements the high voltage Ethernet power interface. The two ICs intercommunicate using an inexpensive Ethernet transformer. The transformer-isolated communication protocol replaces up to six expensive opto-couplers and a complex isolated 3.3V supply used in traditional designs, resulting in significant BOM cost savings and a more robust and easy to manufacture design. View the LTC4291/LTC4292 product page, download data sheet, order samples and evaluation boards: http://www.analog.com/LTC4291 The LTC4291/LTC4292 chipset operates seamlessly with compliant 802.3bt PD controllers, the LT4294 or LT4295, forming complete end-to-end PoE++, PoE+ and PoE solutions. Up to 71.3W of power can be delivered to single-signature or dual-signature PDs. Users will appreciate the robustness of the 80V pins. Analog Devices leads the industry in low power path dissipation, significantly outperforming PSEs that integrate higher RDS(ON) MOSFETs. PD discovery is accomplished using a multipoint voltage and current detection mechanism, ensuring the best immunity from false PD detection. Advanced power management includes Autoclass support, prioritized fast shutdown, 14-bit per-port power and current readback, 8-bit programmable power limits and 7-bit programmable overload current limits. Systems can be updated with field-upgradable firmware. A 1MHz I2C interface allows a host controller to digitally configure the chipset or query port status. Power management “C” demonstration libraries are also available to reduce NRE and improve time to market. The LTC4291/LTC4292 chipset is offered in the industrial temperature range. The LTC4291 digital controller is in a RoHS-compliant 24-pin 4mm x 4mm QFN package, while the LTC4292 analog controller is in a 40-pin 6mm x 6mm QFN package. The LTC4291/LTC4292 is Analog Devices’ first 802.3bt PSE controller and provides an upgrade path from the popular LTC4266 4-port 802.3at PSE controller. Please visit http://www.analog.com/poe for more product information. Summary of Features: LTC4291/LTC4292
- Four PSE Ports; Two Channels per Port
- Fully Compliant IEEE 802.3bt Type 3 & 4 PSE
- Compliant Support for Type 1, 2, 3 & 4 PDs
- Chipset Provides Electrical Isolation; Eliminates Optos & Isolated 3.3V Supply
- Low Power Dissipation; 0.15Ω Sense Resistance per Power Channel; Enables Extremely Low RDS(ON) External MOSFETs
- Very High Reliability Multipoint PD Detection; Connection Check Distinguishes Single-Signature & Dual-Signature PDs
- Continuous, Dedicated Per-Port Power & Current Monitoring
- 1MHz I2C Compatible Serial Control Interface
- Pin or I2C Programmable Max PD Power up to 71.3W
- 40-Pin 6mm x 6mm (LTC4292) & 24-Pin 4mm x 4mm (LTC4291) QFN Packages
|Product||Production Availability||Price Each per 1,000||Package|
|LTC4291||Now||Starts at $2.00||24-Pin 4mm x 4mm QFN|
|LTC4292||Now||Starts at $6.00||40-Pin 6mm x 6mm QFN|
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Sponsored content by CMLCML manufactures Insulated Metal Substrate (IMS) solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.
Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news