© balint radu dreamstime.com Products | January 30, 2018
Renesas Electronics expands RX130 MCU lineup
Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced 38 new microcontrollers (MCUs) in its RX130 Group.
This is a product release announcement by Renesas Electronics Europe. The issuer is solely responsible for its content.
The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. The ultra-low power, low-cost RX130 Group adds higher responsiveness and functionality for touch-based home appliances, and building and industrial automation applications requiring 3V or 5V system control and low power consumption. Featuring a new capacitive touch IP with improved sensitivity and robustness, and a comprehensive device evaluation environment, the new 32-bit RX130 MCUs are an ideal fit for devices designed with challenging, non-traditional touch materials, or required to operate in wet or dirty environments, such as a kitchen, bath, or factory floor. “As technology advancements make touch-based HMI more commonplace in home, building, and industrial devices, manufacturers are working toward new ways to bring innovative and differentiated products to highly competitive markets,” said Tim Burgess, Senior Director, Renesas Electronics Corporation. “With the RX130 MCUs, Renesas offers a powerful, responsive and safety-compliant touch solution that allows designers to explore new materials and operating environments for their devices, while providing design scalability with full compatibility for future growth.” Key features of the new RX130 Group of MCUs New capacitive touch IP for improved responsiveness, noise immunity, and robustness: The RX130 Group of MCUs combines excellent sensitivity and noise tolerance, making it possible to develop touch keys employing a variety of cover materials for use in a broad array of applications. These include control panels for electric appliances used in locations where they are likely to get wet, home equipment employing recessed switches for a more attractive design, and industrial machinery that must be operated wearing gloves for safety reasons. The expanded RX130 Group of MCUs features a new capacitive touch IP that supports both self-capacity and mutual-capacity for improved robustness and sensitivity. The capacitive touch sensor also significantly improves noise immunity and sensitivity for operation in wet conditions or dirty conditions. This allows manufacturers to apply touch keys to a variety of challenging, non-traditional materials, such as wood, glass, or thick acrylic, opening up capacitive touch to a wider range of use in wet materials, while reducing safety or malfunction risks. Expanded on-chip memory for design future proofing: Multi-language support, integrated HMI and system control, and enhanced functional safety are among the key trends driving up demand for on-chip memory in the home appliance, and building and industrial automation markets. Renesas has expanded the on-chip memory range and package lineup for the RX130 Group. Designers can select an MCU with 64 KB flash memory in a 48-pin package, or 128 KB in an 80-pin package, and then move up to 128KB, 256 KB, 384 KB or 512 KB in a 100-pin package. With the wide lineup, designers can support evolving design needs using a single platform or common design as application code sizes and functionality continue to increase. The RX130 Group of MCUs is compliant with IEC/UL60730 safety standards for consumer electronics, with several built-in functional safety hardware elements. Easy migration path to higher performance Renesas RX MCUs with touch control: In addition to full compatibility across the RX130 Group, the new MCUs are compatible with the RX231/RX230 Group of MCUs, offering manufacturers a seamless migration path to the higher-performance Renesas MCUs for touch-control and 5V system-control solutions. Pin compatibility and software compatibility make it possible to reuse existing software resources and providing coverage for a range of low- and high-end devices. Hardware compatibility is supported by Renesas’ RX Firmware Integration Technology (FIT) Driver Package, which offers a common API that makes it easy for designers to move up or down seamlessly within the Renesas RX Family, and also reduces the burden of program development and software resource management in software development. Robust device evaluation environment for improved sensitivity: Renesas also provides a robust evaluation environment for the new RX130 MCUs to support both self- and mutual-capacity functions. This includes:
- A Renesas Starter Kit designed for basic function evaluation
- A Renesas Touch Solution Kit designed for a detailed capacitive touch feature evaluation
- The Workbench6 v1.07.00.00 tool environment with improved noise immunity and tuning ability to improve usability for capacitive touch software development
- Development environment toolbox, including Renesas’ FIT, emphasizing portability between MCUs within the RX Family
Intel nabs former GlobalFoundries, IBM executive Intel Corp has hired former IBM chip exec and GlobalFoundries CTO Gary Patton to its team.
Yokogawa UK partners with power supply manufacturer TDK-Lambda Yokogawa UK has signed a distribution deal with TDK-Lambda. Through Yokogawa’s distribution channels, customers across the UK will now have access to TDK-Lambda’s range of laboratory power supplies.
Denso & TMC launches JV to develop in-vehicle semiconductors DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
Murata to cease production at several subsidiaries Saitama Murata Manufacturing – previously Toko, Inc. – a wholly-owned subsidiary of Murata Manufacturing is ceasing production at its production subsidiaries Shantou S.E.Z. Huajian Electronics and Hua Jiuh Technology by the end of 2019.
KORE Wireless picks up Integron KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
memsstar ships MEMS production system to University of Freiburg memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Vishay's plant in Turin, Italy, receives R&D grant Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.Load more news