© rawpixelimages dreamstime.com Components | May 26, 2017
Qualcomm signs JV for smartphone chipsets in China
AC Capital, Leadcore, Qualcomm and Wise Road Capital have signed an agreement to form a joint venture to design and sell smartphone chipsets in China.
Jianguang Asset Management Co., Ltd. (JAC Capital), Leadcore Technology Co., Ltd (Leadcore, a subsidiary of Datang Telecom Technology Co., Ltd.), Qualcomm (China) Holding Co., Ltd. (a subsidiary of Qualcomm Technologies, Inc) and Wise Road Capital Ltd. (Wise Road Capital) signed an agreement to form a joint venture – JLQ Technology. This joint venture will focus on the design, packaging, testing, customer support and sales related to chipsets for mass-tier smartphones designed and sold into China. “This joint venture represents the organic combination of financial and industry resources of Qualcomm, JAC Capital, Datang Telecom, and Wise Road Capital, the synergy of which is advantageous to local technology innovation,” said Brighten Li, chairman of investment evaluation committee, JAC Capital. “It also represents an important step for JAC Capital as an eco-system player in the global semiconductor industry. JAC Capital, with its background in the financial industries and many- years of experience in the semiconductor and telecommunication industries, will help this joint venture to achieve long-term success.” “This joint venture further demonstrates Qualcomm’s long term commitment to the China mobile industry. This project will help Qualcomm expand its presence to new segments and customers, as an addition to our vibrant and fast growing semiconductor business in China” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and president, QCT. JLQ Technology will be registered in Gui’an New Area in Guizhou Province. The formation of this joint venture is subject to the approval by relevant authorities, and the parties currently anticipate that it will be completed later this year.
Merck and Micron to develop sustainable gas solutions Science and technology company Merck is joining forces with Micron Technology to develop gas solutions with a low global warming potential (GWP) used in the production of semiconductors.
Navitas acquires GeneSiC – becoming a GaN & SiC specialist GaN power IC specialist, Navitas Semiconductor, is acquiring SiC power device specialist GeneSiC Semiconductor – as it aims to become a power semiconductor powerhouse.
Neonode missed the mark during the second quarter 2022 The Swedish optical sensing solutions provider struggled with COVID-19 driven lock-downs in Asia, component shortages within the printer and automotive market during the company’s second quarter. But the company remains optimistic about its growth potential.
Change of ownership for Studer Cables – Harting steps in Industrial connectivity specialist, Harting Technology Group, announces that it is forming a strategic partnership with the Swiss manufacturer of cable solutions and systems, Studer Cables AG.
GlobalFoundries shipped a record 630 thousand wafers in 2Q22 GlobalFoundries’ CEO Dr. Thomas Caulfield, says that the company shipped 630 thousand wafers during the second quarter of 2022 – a new record. This was driven by double-digit growth at sites in the US and Europe.
SMIC second quarter revenue surge Chinese semiconductor manufacturer Semiconductor Manufacturing International Corporation (SMIC), is reporting second-quarter revenue USD 1,903.2 million, an increase of over 40% YoY.
onsemi opens expanded SiC facility in New Hampshire The newly inaugurated site will increase the company’s SiC boule production capacity by five times year-over-year and almost quadruple the number of its employees in Hudson, New Hampshire by the end of 2022.
China says US CHIPS Act is a threat to trade China has criticised the new US law aimed at encouraging domestic chip production and ultimately reducing reliance on Asian production – something that China sees as a threat to trade and also an attack on Chinese business.
RS to acquire Risoul for $275 million RS Group announces that it has entered into an agreement to acquire Risoul y Cia, S.A. de C.V. (Risoul), a family-owned distributor of industrial and automation product and service solutions in Mexico, for a cash consideration of USD 275 million.
Intel said to be close to $5 billion Italian deal Intel is reportedly closing in on completing a deal to build a semiconductor packaging and assembly plant in Italy – a deal worth an initial USD 5 billion.
Ferrotec breaks ground on new factory in Malaysia Work begins on a new facility aimed at expanding the company's position as a supplier of materials to the semiconductor manufacturing equipment industry.
Micro-Epsilon opens competence centre for micromechatronics Sensor specialist Micro-Epsilon recently opened a new production center for micromechatronics at its headquarters in Ortenburg, Germany – where miniature mechatronic systems for semiconductor machine design and aerospace applications are manufactured.
Micron to invest $40 Billion in US memory manufacturing As a direct response to the signing of the CHIPS Act, Micron has announced the largest ever investment in US memory manufacturing – estimated to create 40,000 US jobs.
Biden signs CHIPS bill to bolster semiconductor production US President Biden has now signed into law the bipartisan CHIPS and Science Act of 2022 – which aims to stimulate investments that will strengthen US manufacturing, supply chains, and national security.
Qualcomm deepens its ties with GlobalFoundries GlobalFoundries and Qualcomm say they are more than doubling their existing long-term semiconductor manufacturing agreement.
New Heilind Electronics Europe warehouse in Poland Due to the dynamic development and customer acquisition in new European markets, Heilind Electronics Europe decided to rent the first warehouse and office in Poland.
Leuze starts operations at new Malaysian plant Following just 16 months of construction, Leuze has opened its new production site in Malacca, Malaysia.
Indium partners with SAFI-Tech on solder product development Indium Corporation and SAFI-Tech will evaluate market applications for supercooled solder materials and explore the development of new products.
Rohm SiC MOSFETs qualified for automotive use Rohm’s latest 4th generation of SiC MOSFETs has been fully qualified in Semikron’s eMPack modules for automotive use.
Gapwaves and Bosch to jointly develop radar antennas Swedish tech company Gapwaves have entered into an agreement with Bosch regarding the development and large-scale production of high-resolution radar antennas for automotive vehicle applications aiming at highly automated driving.
Würth Elektronik ICS opens subsidiary in Italy Würth Elektronik ICS is expanding its activities in Italy with the opening of the new subsidiary Würth Elektronik ICS Italia s.r.l.
Semtech to acquire Sierra Wireless Semtech and Sierra Wireless have entered into a definitive agreement under which Semtech will acquire all outstanding shares of Sierra Wireless for USD 31 per share in an all-cash deal valued at USD 1.2 billion.
Materion looking to accelerate growth with new facility Materion Corporation, a supplier of advanced materials, has established a new facility in Milwaukee, Wisconsin to accelerate the growth of advanced chemical solutions for the semiconductor and EV battery markets.Load more news