© rawpixelimages dreamstime.com Business | April 21, 2016
Orbotech's SPTS division receives repeat order from Huatian Technology
SPTS Technologies, an Orbotech company, has received a repeat order from Huatian Technology (Kunshan) Electronics for its Sigma fxP physical vapor deposition (PVD) systems.
Huatian Technology, a subsidiary of the Chinese IC test and packaging services company, TianShui Huatian Technology Co., Ltd (TSHT), will deploy the additional Sigma fxP PVD systems to expand its existing capacity of 300mm packaging lines for under bump metallization (UBM) and CMOS image sensor (CIS) packaging services. According to SEMI’s February 2016 report, China is the largest regional market for packaging equipment with 30% of global demand, and has grown at a CAGR of 19% over the past 10 years. In 2014, the Chinese government published the National Integrated Circuit Industry Development Promotion Summary, also known as the national “guideline.” One objective of the guideline is for China packaging technology to achieve world-class levels by 2020. “China aims to be self-sustaining in ICs, with a goal of becoming 70% self-sufficient by 2025. As a result, significant investments are being made throughout the domestic supply chain,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “With the purchase of these additional SigmafxP PVD systems, Huatian is well positioned to meet the growing demand for wafer level packaging services from its global and domestic customers.” Mr Aimo. Xiao, CEO of Huatian Technology (Kunshan) Electronics Co., Ltd stated, “To implement our growth plan, it is important to partner with suppliers such as Orbotech’s SPTS, which share our philosophy of technology innovation and success through the highest quality customer support. The Sigma fxP PVD system delivers first-class results at a low cost of ownership, which helps us remain cost competitive and grow our business. We look forward to working more closely with Orbotech-SPTS as we continue to build our 300mm packaging capabilities for the next phase of our growth.”
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.
Manz receives follow-up order for display production equipment Manz says it has received an order with a total volume in the low double-digit million euro range for display production equipment.
Aehr Receives initial order from new customer for FOX-NP solution Aehr Test Systems says it has received orders from a new customer and their subcontract manufacturing supplier for a FOX solution including a FOX-NP full wafer test system, an initial WaferPak Contactor, and a FOX WaferPak Aligner to perform production qualification of their silicon photonics devices.
AIM names new director of product management AIM Solder has appointed Timothy O’Neill to the position of Director of Product Management.
Seoul Semi files patent suit against automotive LED light distributor Seoul Semiconductor says it has filed a patent infringement lawsuit in the United States District Court for the District of New Jersey against Onyx Enterprise Int’l Corp., a distributor of automotive components.
X-FAB expands foundry offering for silicon-based microfluidics In order to address heightening demands, X-FAB Silicon Foundries SE, has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies.
Renesas withdraw from LD/PD business and close production Renesas has decided to withdraw from the laser diode (LD) and photo diode/detector (PD) businesses, and to close the production line at its Shiga Factory, which manufactures compound semiconductor products.
TSMC confirms its intention to build new US fab The Semiconductor giant has announced its intention to build and operate an advanced semiconductor fab in the United States with support from the US government and the state of Arizona.
Flisom to set up shop in Hungary The Swiss solar technology company chose Kecskemét, Hungary as the location for its plant of industrial capacity.
VRG Earns ISO 9001:2015 Certification VRG Components, an independent distributor of electronic components, have been awarded the ISO 9001:2015 certification.
Richardson RFPD ink distribution franchise deal with u-blox Richardson RFPD – an Arrow Electronics company – has entered into a global franchise distribution agreement with u-blox.
Imagination and BAIC Capital creates automotive joint venture Imagination Technologies and BAIC Group Industrial Investment (BAIC Capital), have signed a joint venture agreement to initiate the establishment of an automotive fabless semiconductor company.
Swissbit continues its growth trend with Ardian as a new partner Together with the management team, investment house, Ardian, is acquiring Swiss memory manufacturer Swissbit.Load more news