© marvell Components | April 19, 2016
Marvell opens automotive center of excellence
Chip maker Marvell has officially opened its automotive networking technology development center, the Marvell Automotive Center of Excellence (ACE).
Located in Ettlingen, Germany, ACE is closely located by major OEMs and tier one customers. Automotive technological developments have advanced rapidly in recent years and the next generation of cars needs a new architecture to run a wide array of features such as full driver assist, Ultra high-definition (HD) displays and over-the-air updates. And by expanding development and education efforts in these areas with a dedicated team of engineers, Marvell aims to utilise this knowledge to advance the architecture of future connected, intelligent cars. “Marvell is excited to extend its leadership in the automotive industry with the opening of this training facility,” said Philip Poulidis, Vice President and General Manager, Internet of Things, Automotive and Multimedia Business Units at Marvell Semiconductor, Inc. “With significant technological advancements in recent years, it is our priority to ensure our customers are current on the latest emerging automotive technologies. Germany is an important epicenter for automotive electronics advancement, and by opening this center we hope to work closely with our customers and partners in our quest to advance automotive technology.” Ian Riches, director of the global automotive practice at Strategy Analytics, adds: “With more than 25 years of market leadership in automotive electronics forecasting experience, Strategy Analytics is at the pulse of the auto industry and closely watching the development of today’s Advanced Driver Assistance Systems (ADAS) technologies. Marvell has a rich history in pushing the boundaries and bringing to market innovative technologies that continue to shape the future of the automotive industry. With the formal announcement of Marvell’s Automotive Center of Excellence in Germany, the company is better positioned to drive new automotive designs and technologies forward. The global market for ADAS is forecast to reach $41 billion by 2023, with sensor revenue exceeding USD 15.0 billion in the same year. With Marvell’s commitment to this market, we’ll see great advancements coming ahead.” The Marvell engineering design team is responsible for dedicated automotive products such as switch, end-node system-on-chips (eSoCs), gateways and automotive software.
Intel’s EU investment: Details to be expected soon Earlier this year US chip manufacturer Intel launched a USD 20 billion expansion plan which would see the construction of two new chip plants in Arizona – as well as an expansion in Europe.
X-FAB releases statement following explosion at Texas fab On November 12, 2021, an explosion occurred at X-FAB’s site in Lubbock, Texas, during maintenance work done at the deionized water system. One employee lost his life, another employee was taken to hospital with non-life-threatening injuries and was later released.
Sponsored content by Siemens EDADigital transformation: How Siemens EDA helps you engineer a smarter future faster We are living in an age of ever-accelerating digital innovation, where worldwide knowledge, commerce and communication are broadly accessible and literally at our fingertips. Over the past six decades, thousands of companies in the tech sector have worked diligently to bring new, ever-more sophisticated electronic innovations to market daily, culminating in today’s age of digitalization, which is rapidly changing how we live, travel, conduct business and communicate. This pace of digital transformation will accelerate even more rapidly as more companies begin to incorporate artificial intelligence (AI) and machine learning (ML) into their systems to leverage and even monetize the exponentially increasing amount of data produced by seemingly “everything digital.”
AKM provides an update on its fire damaged fab In late October last year a fire broke out at Asahi Kasei Microsystem’s (AKM) semiconductor factory in Nobeoka, Miyazaki prefecture. The fire completely ravished the fab and took a total of three days to completely extinguish. But how does the company fare today?
Micron and UMC reaches a global settlement According to the global settlement agreement, both companies will globally withdraw their complaints against the other party, and UMC will make a one-time payment of an undisclosed amount to Micron.
A*STAR and STMicro team up on SiC R&D for the EV market The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics are launching an R&D collaboration in the field of silicon carbide for power-electronics applications in the automotive and industrial markets.
Jochen Hanebeck to succeed Reinhard Ploss as CEO of Infineon The Supervisory Board of German chip giant, Infineon, has decided that Jochen Hanebeck will take over as the new Chief Executive Officer of Infineon Technologies AG on 1 April 2022.
Sponsored content by OMRON EuropeInvest in advanced solutions from OMRON, Industry-leader. Achieving flawless operation takes ongoing investment in technologies such as 3D AOI. The Omron VT-S1080 3D AOI delivers value through advanced, stable, and accurate 3D capabilities. The AI-assisted and IPC-correlated Solder Joint Inspection is ideal for today’s more dynamic assemblies.
European Semiconductor distribution sales sets new records DMASS reports a whopping 31.8% growth in semiconductors in Q3 and +44.7% in interconnect, passive and electromechanical components. Shortages remain biggest problem for entire industry.
Jenoptik signs agreement to sell Vincorion Jenoptik AG has signed an agreement to sell the Vincorion division. It will be acquired by a fund managed by private equity firm STAR Capital Partnership LLP.
NAND Flash revenue rises by 15% QoQ for 3Q21 The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce’s latest investigations.
Samsung to invest $17 billion in new Texas fab South Korean electronics giant, Samsung, has chosen Taylor, Texas to build a new, USD 17 billion, semiconductor manufacturing facility.
Sponsored content by ElectrolubeAre Encapsulation Resins Suitable for EV Applications? Beth Turner from Electrolube (MacDermid Alpha Electronic Solutions) discusses how and where encapsulation resins can be incorporated into electric vehicle design to protect vital electronics and improve overall efficiency.
Qualcomm acquires Clay AIR Clay AIR, an AI powered hand tracking and gesture recognition technology company, has been acquired by Qualcomm.
AmpliTech to acquire Spectrum Semiconductor Materials AmpliTech Group, a designer, developer and manufacturer of signal-processing components, has executed a definitive agreement to acquire the assets and operations of San Jose-based Spectrum Semiconductor Materials Inc., a specialty distributor of semiconductor components.
Veeco ships first system from new manufacturing facility Veeco Instruments says that the company has shipped the first LSA101 Laser Spike Annealing System from its new San Jose, California facility to an unnamed semiconductor manufacturer.
Smith to divest its Its solar division The distributor of electronic components says that it has signed an agreement to sell its solar sales and services division, known as ONTILITY Powered by Smith, to BBB Industries, LLC under its new division, TerrePower.
TTI to acquire SMD Inc. Specialty distributor of electronic components, TTI, Inc.,has entered into a purchase agreement to acquire SMD Inc., a privately held electronic component distributor headquartered in Irvine, California.
Former GlobalFoundries executive to lead IQE Following an extensive and rigorous search process, the board of the UK supplier of compound semiconductor wafer products announces that it has appointed Americo Lemos as Chief Executive Officer, starting on 10 January 2022.
New promotions at Velocity Electronics The electronic components distributor announces that it has promoted Hal Juergens to Global Vice President of Sales Operations and also promoted Grant Schnabel to Global VP of Sales and Business Development.
GaN Systems raises $150M to speed up adoption of GaN technology GaN Systems announces a USD 150 million growth capital funding round to accelerate innovation and adoption of GaN technology across its automotive, consumer, industrial, and enterprise markets.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Ian Wallace to shoulder new business development role at Digi-Key Electronic component distributor, Digi-Key Electronics, has promoted Ian Wallace has been to vice president, Americas and EMEA business development.
GlobalFoundries and Ford are aiming to boost chip supplies Semiconductor manufacturer, GlobalFoundries, says it is entering into a strategic collaboration with Ford Motor Company with the aim of advancing semiconductor manufacturing and technology development within the United States. The companies are looking to boost chip supplies for Ford and the US auto industry.
BSL to supply semiconductor components to SDU Ban Seng Lee Industries Sdn Bhd (BSLI), a subsidiary of Malaysian BSL Corporation, has secured a Letter of Award from SD Unify Pte Ltd (SDU) to fabricate semiconductor components and sub-assembly modules.
BMW turns to Qualcomm for automated driving collaboration Qualcomm Technologies will bring the latest advancements in driver assistance technologies, and products of its Snapdragon Ride Platform, to BMW Group's next generation of advanced driver-assistance systems (ADAS) and automated driving (AD) platforms.
TI plans massive semiconductor wafer fab expansion Texas Instrument says it plans to start construction on its new 300-millimeter semiconductor wafer fabrication plants in Sherman, Texas. The company says that the site has the potential for up to four fabs to meet demand over time. Construction of the first and second fabs is set to begin in 2022.
btv technologies expands production capacities in Romania Following a planning phase of almost two months, implementation has the company's complete focus. On November 01, 2021, three additional programming machines form the manufacturer Data I/O PSV7000 were put into operation in Timisoara, Romania.
Qualcomm sets new growth targets Qualcomm said that it is continuing to expand its chipset business to meet the growing opportunity for its technology at its 2021 Investor Day. The Company expects its addressable opportunity to grow from approximately USD 100 billion today to USD 700 billion in the next decade, as more devices become intelligently connected.Load more news