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Business | March 03, 2016
TSMC to ramp up 16nm chip production
Taiwanese TSMC is reportedly panning to increase its monthly capacity of its 16nm process technology from 40'000 units to 80'000 12-inch wafers.
According to a report in DigiTimes, TSMC's co-CEO CC Wei stated that the company's share of the 14/16nm foundry market segment will exceed 70% in 2016 – up from about 40% in 2015.
The increased production is expected to effect TSMC's sales performance starting this month, the report continues.
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Fraunhofer Institute goes with Veeco's ion beam sputtering technology
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EIB provides a total of €80 million to Zumtobel Group
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Mayflex expands operations operations with new HQ
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WiTricity acquires Qualcomm Halo
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C&K focuses on business expansion - appoints industry veteran as CRO
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PSS to acquire wafering division of Meyer Burger
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Another CEO at WĂĽrth Elektronik eiSos
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Report: Renesas to lay off 1’000 employees
The Japanese chipmaker is reportedly looking to reduce its workforce by almost 1’000 employees by the end of June, as the company is trying compensate for a shrinking domestic market.
ODU to expand in Korea
As of January 1, 2019 ODU has a new company carrying the ODU name in Korea. Kai...
Cisco completes acquisition of Luxtera
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STMicro to acquire majority stake in Swedish SiC wafer manufacturer
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Intersection of hardware and design process in IoT solutions
Recent IoT research by development distributor Premier Farnell indicates that hardware...
ODU-USA in strategic partnership with RED Digital Cinema
ODU announces a strategic partnership with professional digital camera manufacturer...
Teledyne completes acquisition of Scientific Imaging businesses of...
The previously announced acquisition by Teledyne of the Scientific Imaging businesses of...
Infineon closes 1Q19 with lower revenues but better earnings
The semiconductor manufacturer closes the December quarter with revenue...
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