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Components | October 28, 2015
Thinfilm partners with Ypsomed to make medical devices 'smart'
The Ypsomed Group, a medical technology firm, will collaborate with Thin Film Electronics ASA to incorporate NFC OpenSense technology into its line of YpsoMate autoinjection devices.
Thinfilm’s OpenSense technology provides smartphone-centric NFC readability before and after product opening.
Infineon adds additional space to its Hungarian operations
The German semiconductor manufacturer has once again expanded its Hungarian...
Continental expands its Trutnov powertrain plant
Continental has opened a combined production and storage facility in Trutnov, Czech...
Arm acquires Stream Technologies
ARM has acquired Stream Technologies, specialising in management tools for the...
Potential Dialog / Synapics - Deal is confirmed
Dialog Semiconductor Plc. has announced it will 'proceed with Due Diligence for a potential acquisition of Synaptics'.
Interconnection technologies for next-generation 5G mobile...
Innovative solution concepts based on new materials, hybrid printed circuit board (PCB)...
LEMO USA achieves 2016 revision for ISO 13485 certification
LEMO USA, Inc. has received their certificate for the 2016 revision of the ISO 13485...
Premier Farnell names new President
The distributor announces a change in leadership as Graham McBeth retires from his position...
Airbus collaborates with Wilhelmsen on UAS for maritime deliveries
Airbus and Wilhelmsen Ships Service have entered into a strategic collaboration to drive...
Murata: 'No damages after earthquake'
On June 18, 2018, at 7:58 AM local time, an earthquake struck Osaka Prefecture.
PLS’ UDE enables real multicore debugging for NXP’s S32V234...
With support of NXP’s S32V234 automotive multicore SoCs by the Universal Debug Engine...
Broadcom lays off more than 1'000 employees after Brocade merger
Following the acquisition of Brocade, Broadcom says that it has laid off about 1’100...
Japanese manufacturer starts production in Slovakia
MinebeaMitsumi has held an opening ceremony for its new – 26’000 square metres – plant in...
Safran and Nexter sign a framework agreement
Nexter and Safran have signed a framework contract concerning Safran Electronics...
Bombardier Transportation opens production hall in Germany
Bombardier Transportation inaugurated a new final assembly hall in Bautzen...
Ultralow jitter clock generation (4.5GHz) & clock distribution (7.5GHz)...
Analog Devices announced the LTC6952, LTC6953, LTC6955 and LTC6955-1 family of low...
Würth Elektronik eiSos expands & doubles in size in Waldenburg
Just two years after opening its – highly automated – logistics centre with sample factory, Würth is investing another EUR 25 million at its site in Waldenburg.
European research project iDev40 focuses on networking
The European research project iDev40 (Integrated Development 4.0) is launched today under the...
Q&A on Wireless Charging
The primary goal in any wireless power design is to guarantee delivery of the required power under worst-case power transfer conditions. However, it is equally important to avoid thermal and electrical overstress in the receiver...
High reliability VRLA batteries from Yuasa available at Gresham...
Authorised Yuasa battery distributor Gresham Power Electronics, the Salisbury based...
IQD and Digi-Key inks distribution deal
IQD Frequency Products, part of the Würth Elektronik eiSos group, announces they have...
Hirose Electric expands into the Italian market
The Japanese connectors manufacturer says that it is expanding its European...
German component distribution defies challenges
Despite component shortages, the German component distribution market (according to FBDi e.V.) continued to grow during the first quarter of 2018. The order situation remains stable.
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