© andreypopov dreamstime.com Business | October 26, 2015
Microchip and Kvaser to collaborate on CAN FD
Controller Area Network (CAN) interface specialist, Kvaser AB, has entered into a strategic collaboration with Microchip Technology Inc., to support CAN with Flexible Data-Rate (CAN FD).
Microchip will be integrating Kvaser’s CAN and CAN FD IP in future controller products destined for automotive and industrial applications. CAN FD is an extension to the original CAN protocol as specified in ISO 11898-1 that responds to increased bandwidth requirements in automotive networks. CAN FD allows for a higher data rate and larger packet size that makes it well suited for data intensive automotive electronic applications. Speaking about the partnership, Lars-Berno Fredriksson, president of Kvaser AB, said: “Kvaser is proud to support Microchip’s CAN FD developments with our CAN FD IP – this is great validation of the work we have been doing in preparation for CAN FD. As one of the first companies to participate in the CAN ecosystem, Kvaser offers deep knowledge and long experience in CAN and we are fully committed to supporting new developments, such as CAN FD.” “Microchip recognizes that there will be a transition from CAN 2.0 to CAN FD in the coming years. Since 2012, Microchip has been working directly with automotive OEMs in all global regions to understand their requirements, timelines and expectations and are developing solutions to support their needs,” Commented Orlando Esparza, Microchip’s CAN FD Product Line Marketing Manager. “Microchip has a good and longstanding relationship with Kvaser, helping to minimize our device development cycle times. As a result, we have been able to quickly make design adjustments to meet ISO specification changes and requirements and plan to begin the roll out of controller products mid-2016. Microchip has already released multiple automotive approved physical layer CAN FD transceiver products. ”
Broadcom to supply wireless components to Apple Certain subsidiaries of Broadcom have entered into two separate multi-year statement of work agreements with Apple Inc.
TowerJazz, Cadence, and KPI to open analog design lab TowerJazz, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, are collaborating to open a new analog circuit design lab in Ukraine.
STMico CEO: ‘We closed 2019 with a solid fourth quarter’ The semiconductor manufacturer reported 2019 fourth quarter new revenues of USD 2.75 billion, gross margin of 39.3%, operating margin of 16.7% and new income of USD 392 million.
Car supplier Harman plans to close German site The automotive supplier Harman apparently wants to stick to its plans and close the plant in Straubing (Germany). Between 625 and 700 jobs are affected.
Camtek receives orders for 34 systems from five manufacturers Camtek says it has received orders for 34 systems for 2D inspection of CMOS image sensors from five different manufacturers, of which 25 are from two customers.
Changes to Next Biometrics' management Next Biometrics' CFO, Knut Stålen, will step down from his position on the last day of February 2020. Knut Stålen has been with NEXT Biometrics since 2014.
Foxconn and Heraeus sign MoU Foxconn Technology Group and Heraeus have signed a Memorandum of Understanding for a strategic cooperation within the space of 5G.
BAE to pick up Collins Aerospace’s GPS business and Raytheon’s ATR business BAE Systems has reached definitive agreements for the proposed acquisitions of Collins Aerospace’s military Global Positioning System (GPS) business and Raytheon’s Airborne Tactical Radios (ATR) business.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.Load more news