© ifixit Teardowns | September 25, 2015
Teardown: Is the iPhone 6s worth its weight in rose gold?
No teardown is as highly-anticipated as an iPhone teardown—so, to quell your curiosity, our teardown engineers ventured to the land down under and investigated the innards of an iPhone 6s.
Getting into the new iPhone is almost as easy as it was before—thanks to some surprise adhesive lurking beneath the display. Once inside, though, the iPhone 6s quickly distinguished itself from its predecessor. Apple’s new Taptic Engine squished the battery ever-so slightly, the display grew to accommodate additional capacitive sensors, and the A9 got a size bump from last year’s A8. While we can't confirm the die size—the A9 package itself appears bigger (roughly 14.5 x 15 mm, up from 13.5 x 14.5 mm on the A8). Our guess at the cause of growth? The addition of the embedded M9 motion coprocessor. iPhone 6s teardown highlights: The rumors are true—the battery capacity is down a bit, and we suspect the reduced battery size is to accommodate the Taptic Engine. The Lithium-ion pack comes in at 3.8 V, 6.55 Whr, and 1715 mAh, a small but notable decrease from the 1810 mAh battery in last year's iPhone 6. But Apple promises that battery life remains the same. The display assembly gained 15 grams compared to the iPhone 6. The additional capacitive sensors to power their new fancy 3D Touch really beefed up the display. Battery and screen repairs should be fairly straightforward—but unfortunately, the Touch ID cable is paired to the logic board, complicating repairs. iPhone 6s Chips:
- Apple A9 APL0898 SoC + Samsung 2 GB LPDDR4 RAM
- Qualcomm MDM9635M LTE Cat. 6 Modem (vs. the MDM9625M found in the iPhone 6)
- InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo (also found in iPhone 6)
- Bosch Sensortec 3P7 LA 3-axis Accelerometer (likely BMA280)
- TriQuint TQF6405 Power Amplifier Module
- Skyworks SKY77812 Power Amplifer Module
- Avago AFEM-8030 Power Amplifier Module
- Qualcomm QFE1100 Envelope Tracking IC
- Toshiba THGBX5G7D2KLFXG 16 GB 19 nm NAND Flash Memory
- Universal Scientific Industrial 339S00043 Wi-Fi Module
- NXP 66V10 NFC Controller (vs. 65V10 found in iPhone 6)
- Apple/Dialog 338S00120 Power Management IC
- Apple/Cirrus Logic 338S00105 Audio IC
- Qualcomm PMD9635 Power Management IC
- Skyworks SKY77357 Power Amplifier Module
- Murata 240 Front-End Module
- RF Micro Devices RF5150 Antenna Switch
- NXP 1610A3
- Apple/Cirrus Logic 338S1285 Audio IC
- Texas Instruments 65730AOP Power Management IC
- Qualcomm WTR3925 Radio Frequency Transceive
Kurt Sievers takes the helm at NXP At its annual general meeting of shareholders, the appointment of Kurt Sievers as the company’s next CEO was overwhelmingly approved.
Excelitas’ Qioptiq subsidiary expands with new plant Excelitas Technologies, a company delivering photonic solutions, sats that its Qioptiq subsidiary held a ground-breaking ceremony last week to mark the beginning of construction for a new factory in Göttingen, Germany.
Farnell adds Sorensen power supplies to its roster Distributor Farnell announces that it has added Sorensen, the premier DC programmable power supply brand from Ametek, to its range of power supplies.
Infineon raises EUR 1 billion following successful share placement Infineon informs that the company placed 55 million new shares, following an accelerated bookbuilding process with institutional investors, under the exclusion of subscription rights. The shares were placed at a price of EUR19.30 per share, meaning that the company managed to raise EUR 1.06 billion.
Skeleton Technologies strengthens management with new COO Skeleton Technologies has appointed Ants Vill, former Vice President of Product, as Chief Operating Officer.
SiPearl chooses Germany for its first international operational subsidiary SiPearl, a designer of the microprocessor for the European exascale supercomputer, is opening its first international subsidiary in Duisburg, in the Ruhr region, Germany, in order to build closer connections with its German partners and future clients.
DELO reports increased revenues despite current pandemic DELO closed the financial year that ended on March 31 with a turnover of EUR 163 million. This is an increase of almost 5% compared to the previous year (EUR 156 million).
China falls far short of its "Made-in-China 2025" goal IC production in China represented 15.7% of its $125 billion IC market in 2019, up only slightly from 15.1% five years earlier in 2014. IC Insights forecasts that this share will increase by 5.0 percentage points to 20.7% in 2024 (one percentage point per year on average).
COVID-19 highlights the gravity of the secondary market for SME Cha Jin-Seok, Chief Financial Officer of SK Hynix, said it best in the company’s Q1 earnings call, “Because of a never experienced pandemic, even basic business activities such as maintaining normal operations and predicting future demand have become challenging tasks.”
GlobalFoundries to implement ITAR at US manufacturing facility GlobalFoundries plans to implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York.
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.
Manz receives follow-up order for display production equipment Manz says it has received an order with a total volume in the low double-digit million euro range for display production equipment.
Aehr Receives initial order from new customer for FOX-NP solution Aehr Test Systems says it has received orders from a new customer and their subcontract manufacturing supplier for a FOX solution including a FOX-NP full wafer test system, an initial WaferPak Contactor, and a FOX WaferPak Aligner to perform production qualification of their silicon photonics devices.
AIM names new director of product management AIM Solder has appointed Timothy O’Neill to the position of Director of Product Management.Load more news