© ifixit Teardowns | June 23, 2015
First Look at the Force Touch Track Pad
MacBook Pro 13" Retina Force Touch trackpad: Not what you expect.
After Apple's surprise announcement of the new 12" MacBook (a while back), with its shiny renders and proudly touted pressure sensitive, haptic-feedback-equipped trackpad, we were expecting to find an identical trackpad implementation in the new MacBook Pro 13" Retina. And we were surprised. While the MacBook-to-be looks like it's going to feature a weight-saving "I" shape, with the four springy force sensors jutting out from a central beam, our teardown revealed that the new 13" Pro's implementation is quite different: A solid aluminum plate, with four springs punched out of it. Heavier and beefier, and perhaps technologically completely different—we'll just have to wait for the MacBook's release to see. Due to the gluey mess of a battery, soldered RAM, and other proprietary problems, the MacBook Pro 13" Retina Display Early 2015 scrapes the bottom of the barrel with a 1 out of 10 on the repair scale. Oh, and we have a puppy.
Teardown Highlights: Apple's "Taptic Engine" is powered by an array of electromagnets that rapidly push and pull against a metal rail mounted beneath the trackpad, to create a tiny "buzz" of feedback with each click (and a second buzz for a "force click"). Based on the wiggly pattern of traces stuck to the metal tabs, we're pretty sure the magic pressure sensors in the new Force Touch trackpad are tiny strain gauges. Mounted on flexing metal supports, they detect the amount of flex on each—and based on that, the force from above. This looks familiar... The all-new and twice-as-fast flash memory has the exact same ICs as the one found in our recent teardown of the MacBook Air 13".
- Intel SR26K Dual-Core i5-5257U processor with Intel Iris Graphics 6100
- SK Hynix H9CCNNNBLTALAR LPDDR-SDRAM
- Cirrus 4208-CRZ HD audio codec
- Intel DSL5520 Thunderbolt 2 controller
- Texas Instruments TI 58872D
- Fairchild Semiconductor DE46SY
- SK Hynix H5TC4G63AFR 4 Gb (512 MB) DDR3 SDRAM
- Texas Instruments/Stellaris LM4FS1EH SMC controller
- Broadcom BCM15700A2
- Texas Instruments HD3SS213 DisplayPort differential switch
- Samsung S4LN058A01 PCIe 3.0 x4 AHCI flash controller
- Samsung K4E4E324ED 512 MB LPDDR3 DRAM
- Samsung K9LDGY8S1D-XCK0 16 GB flash storage
- Parade Technology PS8401A HDMI jitter cleaning repeater
- Genesys Logic GL3219 SDXC card reader controller
- NXP Semiconductors PCA9501 8-bit I/O expander
Graphcore secures additional $150 million in new capital Bristol-based pure-play machine intelligence AI processor company, Graphcore, has secured an additional USD 150 million in new capital.
Nexperia partners with Ricardo to develop GaN-based EV inverter design Nexperia has entered into a partnership with automotive engineering consulting company, Ricardo, to produce a technology demonstrator for an EV inverter based on gallium nitride (GaN) technology.
TSMC to hire thousands of new employees in 2020 The contract semiconductor manufacturer is reportedly planning to hire more than 4’000 new employees over the course of the year as it plans to develop high-end processes.
Elmos increases semiconductor sales by 7.7% in 2019 According to preliminary, unaudited figures, Elmos Semiconductor increased sales of the semiconductor business by 7.7% to EUR 273.4 million in 2019.
STAr expands via acquisition of Accel-RF Taiwanese company, STAr Technologies, announces that it is acquiring San Diego-based Accel-RF Instruments Corporation.
RoodMicrotec signs sales representative agreement with Cedar RoodMicrotec N.V., has appointed Cedar Technologies as sales representative for the Nordic countries, Poland, the United Kingdom, and Ireland.
GlobalFoundries & GlobalWafers sign MoU to increase capacity GlobalFoundries (GF) and GlobalWafers Co., Ltd. (GWC), have signed a memorandum of understanding to develop a long-term supply agreement for 300mm silicon-on-insulator (SOI) wafers.
Nichicon inks new sales partnership with ICEL Nichicon (America) Corporation has entered into a new partnership with Italian film capacitor manufacturer, ICEL. Nichicon will represent ICEL through sales and marketing efforts in the Americas.
Significant decline in sales in the German component distribution German component distribution shrinks by 20% in the fourth quarter of 2019, says the FBDi e.V.
Samsung starts mass production at new EUV manufacturing line Samsung Electronics’ new semiconductor fabrication line in Hwaseong, Korea, has begun mass production.
Avery Dennison invests in new factory in Brazil Avery Dennison is gearing up for future growth of RFID technology. Just months after signing a deal to acquire Smartrac's transponder division, the company announces the location of its next RFID manufacturing facility, its first in Brazil and fifth in the world.
ST and TSMC team up on Gallium Nitride-based products STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.
WD to sell ActiveScale business to Quantum Western Digital Technologies, Inc. has entered into a definitive agreement to sell its ActiveScale business to Quantum Corp., under which Western Digital's full line of ActiveScale products will be sold.
Maxim accelerates in Europe with $25M investment in Ireland Maxim Integrated Products, Inc. is opening a new design centre in Dublin, Ireland. The design centre will focus on product development and conducting R&D in the areas of analog semiconductor design.
Workers to stay home as SK Hynix trainee had contact with virus patient 800 workers of the South Korean chipmaker has quarantined themselves – as a preventive measure – in order to keep the spread of the Coronavirus at bay.
Dialog Semiconductor to acquire Adesto Technologies Dialog Semiconductor has signed a definitive agreement to acquire all outstanding shares of Adesto Technologies Corporation.
Renesas and Panthronics team up on wireless charging and IoT solutions Renesas and Panthronics AG, a fabless semiconductor company specialising in high performance wireless products, are collaborating to bring solutions to the consumer, industrial, and Internet of Things (IoT) markets.
Murata completes new production facility in Malaysia Murata Electronics (Malaysia) Sdn.Bhd. (Perak, Malaysia), a production subsidiary of Murata Manufacturing Co., Ltd., recently completed construction of a production facility that was started in October 2018.
AKKA is now a majority owner of Data Respons Following the closing of the voluntary offer period, AKKA holds 72.89% of Data Respons’ share capital.
Sequans and Avnet sign global distribution deal Sequans Communications S.A. and Avnet have entered into a distribution agreement whereby Avnet will promote and sell Sequans’ IoT chips and modules and will exclusively promote and sell Monarch Go, an LTE-M/NB-IoT modem component designed for and certified by Verizon.
Synopsys completes acquisition of certain IP assets from INVECAS Synopsys, Inc. has completed its acquisition of certain IP assets from INVECAS. This acquisition broadens Synopsys' DesignWare Logic Library, Embedded Memory, General Purpose I/O, Analog, and Interface IP portfolio.
Qualcomm: Coronavirus may impact phone industry Chip maker Qualcomm Inc has issued a statement that the coronavirus outbreak in China poses a potential threat to the mobile phone industry.
South Korean supplier to set up manufacturing in Hungary Soulbrain, a South Korean materials company supplying chemicals used in semiconductors, displays and battery cells, is establishing its first European unit in Tatabánya in Hungary.Load more news