© ifixit
Teardowns | March 12, 2015
Apple's spring forward goes back in time
Apple's "Spring Forward" event brought tantalizing teasers of tomorrow: A new MacBook, details on their world-changing wearable, amazing new touchpad technology, and a couple of laptops from 2013.
Now we bring you our findings on the last of these. Which is not to say the least of these. The construction of the MacBook Air 11" and MacBook Air 13" stay exactly the same, and upgradability could still be better (4 of 10 on the repair scale). However, the MacBook Air has always had a redeeming feature—one we worry is an endangered species at Apple: The non-adhered battery.
After Phil Schiller’s sneak peek into the new ultra-slim MacBook, we're pretty sure the adhered battery trend is likely to continue. We're happy the MacBook Air remains glue-free—a lone survivor among Apple portables—and we’re fearful for the future. Battery adhesive means repair, replacement, and recycling are much more difficult.
We don't have much to say about the MacBook Air refreshes—and we're okay with that. But we didn't want to leave you empty-handed, so we took it upon ourselves to liven up the routine 11" teardown with some Easter egg fun. Check it out!
Teardown Highlights:
The newest Airs keep their traditional model numbers, A1465 and A1466—the same digits we found on models dating as far back as mid 2012.
Broadwell shrinks the MacBook Air's previous architecture (Haswell)—meaning not a lot has changed performance-wise, but a new manufacturing process makes the transistors smaller, and the entire chip more power efficient by up to 30%.
We air the differences in these lightweight notebooks with a light touch.
Chip, chip, hooray!
MacBook Air 11" Early 2015© iFixit
- 1.6 GHz Intel Core i5 5250U processor, with integrated Intel HD Graphics 6000
- Intel DSL5520 Thunderbolt 2 controller
- SK Hynix H9CCNNN8JTALAR LPDDR3 SDRAM
- SK Hynix H5TC4G63CFR 4 Gb (512 MB) low power synchronous DRAM
- Broadcom BCM15700A2
- Texas Instruments/Stellaris LM4FS1EH SMC controller
- Cirrus Logic 4208-CRZ HD audio codec
- Marvell 88SS9183 PCIe SSD controller
- SanDisk 05131 016G 16 GB NAND flash memory
- Samsung K4B2G1646E 2 Gb (256 MB) DDR3 SDRAM
Macbook Air 13" Early 2015© iFixit
- 1.6 GHz Intel Core i5 5250U Processor, with integrated Intel HD Graphics 6000
- Intel DSL5520 Thunderbolt 2 controller
- GL3219 Genesys Logic SDXC controller
- SK Hynix H9CCNNN8JTALAR LPDDR3 SDRAM
- Broadcom BCM15700A2
- SK Hynix H5TC4G63CFR 4 Gb (512 MB) low power synchronous DRAM
- Texas Instruments/Stellaris LM4FS1EH SMC controller
- Cirrus Logic 4208-CRZ HD audio codec
- Samsung S4LN058A01 PCIe 3.0 x4 AHCI Flash controller
- Samsung K9LDGY8S1D-XCK0 16 GB Flash storage
- Samsung K4E4E324ED 512 MB LPDDR3 DRAM
Intel nabs former GlobalFoundries, IBM executive
Intel Corp has hired former IBM chip exec and GlobalFoundries CTO Gary Patton to its team.
Yokogawa UK partners with power supply manufacturer TDK-Lambda
Yokogawa UK has signed a distribution deal with TDK-Lambda. Through Yokogawa’s distribution channels, customers across the UK will now have access to TDK-Lambda’s range of laboratory power supplies.
Denso & TMC launches JV to develop in-vehicle semiconductors
DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
Murata to cease production at several subsidiaries
Saitama Murata Manufacturing – previously Toko, Inc. – a wholly-owned subsidiary of Murata Manufacturing is ceasing production at its production subsidiaries Shantou S.E.Z. Huajian Electronics and Hua Jiuh Technology by the end of 2019.
KORE Wireless picks up Integron
KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride
PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
memsstar ships MEMS production system to University of Freiburg
memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Vishay's plant in Turin, Italy, receives R&D grant
Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester
Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility
The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment
LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs
Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP
Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future
Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP
Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI
Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq
Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset
Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset
AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system
Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets
NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations
A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.
TowerJazz to maintain its TPSCo majority ownership
Israeli semiconductor manufacturer, TowerJazz, says that it will not sell its stake and board control in its joint venture with Panasonic Corp in Japan, following the Japanese company's announcement that it is selling its semiconductor business.
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