© ifixit Teardowns | January 05, 2015
The Nexus 9 Teardown
If we were to describe the HTC/Google Nexus 9 in a single word, it would be “meh.”
Yes, it has a legit screen and a solid processor, but we’re hardware and repairability connoisseurs—we want the rest of the internals to match the gloriousness of the main components. Yet this tablet feels like an exercise in corner cutting, even though HTC/Google charges $400 to say hello to this little friend. At least the Nexii of yesteryear got you some repairability for your hard-earned money. With the Nexus 9, you can still easily remove the rear cover—and we thank HTC kindly for that. However, everything else is a mess of glue and hackery. It’s like HTC stuffed their glorious CPU and display into a sack full of other parts, and whatever stuck ended up in the Nexus 9. The device gets a 3 out of 10 repairability score—just a smidge above its much more internally-sophisticated rival, the iPad Air 2.
Teardown highlights: Huzzah! The rear cover is held in place with various welcoming clips, instead of fierce adhesive. No tools are required to pop this cover off—just some sturdy fingernails. All seemed to be going well, until we noticed the rear-facing camera was still lodged in the rear case... The rear-facing camera seems to fit a little too snugly in its cubicle in the rear case; it got pulled right out of its ZIF connector on the motherboard. To make matters worse, the camera connector is on the underside of the motherboard, meaning you'll have to remove the board to reconnect the camera. The 8 MP rear-facing camera is labeled as 3BA804P1 K1419 A 1.0. A bit of Googling reveals that this is the same camera module used by the HTC Desire 610 smartphone—you decide if that’s good or bad. Separating the LCD from the display assembly requires an insane amount of heat, patience and prying. This is some of the toughest adhesive we've ever encountered in a tablet—on par with, though in lesser quantity than, the infamous Surface Pro. Yet another daughterboard! This one connects the motherboard to the lower speaker, vibrator, and a mysterious loner component, well off the board on its own cable... Mystery solved: it's an Asahi Kasei AK8963 3-axis electronic compass, like we saw in the Nexus 5—probably off in lonertown to avoid electromagnetic interference from the rest of the device. It appears that the multitude of tiny boards we removed had more of a purpose than just being annoying—two of them seem to form the backs of speaker boxes for the front-facing stereo speakers. We're no audio experts, but these speakers look a lot more like low-volume earpiece speakers than the far-heftier speakers found in the latest iteration of the iPad Air.
Hidden behind the LCD are a few ICs:
- Synaptics S7504B 43210570 Touchscreen Controller
- C54B M46956 422
- NVIDIA Tegra K1 Dual Denver 64-bit Processor (labeled as T4K885 01P TD590D-A3)
- Elpida/Micron Technology FA164A2MA 16 Gb (2 GB) RAM
- Samsung KLMAG2GEAC 16 Gb eMMC NAND Flash
- Broadcom BCM4354XKUBG MIMO 5G Wi-Fi 802.11ac/Bluetooth 4.0/FM Module
- Texas Instruments TI47CFP91 T65913B3D9
- Broadcom BCM4752 Integrated Multi-Constellation GNSS Receiver
Avery Dennison invests in new factory in Brazil Avery Dennison is gearing up for future growth of RFID technology. Just months after signing a deal to acquire Smartrac's transponder division, the company announces the location of its next RFID manufacturing facility, its first in Brazil and fifth in the world.
ST and TSMC team up on Gallium Nitride-based products STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.
WD to sell ActiveScale business to Quantum Western Digital Technologies, Inc. has entered into a definitive agreement to sell its ActiveScale business to Quantum Corp., under which Western Digital's full line of ActiveScale products will be sold.
Maxim accelerates in Europe with $25M investment in Ireland Maxim Integrated Products, Inc. is opening a new design centre in Dublin, Ireland. The design centre will focus on product development and conducting R&D in the areas of analog semiconductor design.
Workers to stay home as SK Hynix trainee had contact with virus patient 800 workers of the South Korean chipmaker has quarantined themselves – as a preventive measure – in order to keep the spread of the Coronavirus at bay.
Dialog Semiconductor to acquire Adesto Technologies Dialog Semiconductor has signed a definitive agreement to acquire all outstanding shares of Adesto Technologies Corporation.
Renesas and Panthronics team up on wireless charging and IoT solutions Renesas and Panthronics AG, a fabless semiconductor company specialising in high performance wireless products, are collaborating to bring solutions to the consumer, industrial, and Internet of Things (IoT) markets.
Murata completes new production facility in Malaysia Murata Electronics (Malaysia) Sdn.Bhd. (Perak, Malaysia), a production subsidiary of Murata Manufacturing Co., Ltd., recently completed construction of a production facility that was started in October 2018.
AKKA is now a majority owner of Data Respons Following the closing of the voluntary offer period, AKKA holds 72.89% of Data Respons’ share capital.
Sequans and Avnet sign global distribution deal Sequans Communications S.A. and Avnet have entered into a distribution agreement whereby Avnet will promote and sell Sequans’ IoT chips and modules and will exclusively promote and sell Monarch Go, an LTE-M/NB-IoT modem component designed for and certified by Verizon.
Synopsys completes acquisition of certain IP assets from INVECAS Synopsys, Inc. has completed its acquisition of certain IP assets from INVECAS. This acquisition broadens Synopsys' DesignWare Logic Library, Embedded Memory, General Purpose I/O, Analog, and Interface IP portfolio.
Qualcomm: Coronavirus may impact phone industry Chip maker Qualcomm Inc has issued a statement that the coronavirus outbreak in China poses a potential threat to the mobile phone industry.
South Korean supplier to set up manufacturing in Hungary Soulbrain, a South Korean materials company supplying chemicals used in semiconductors, displays and battery cells, is establishing its first European unit in Tatabánya in Hungary.
Seven major chip acquisitions valued at USD 1bn or more Semiconductor merger and acquisition activity strengthened in 2019 after pulling back in the two previous years from historic high levels of M&A agreements in 2015 and 2016.
Jenoptik is expecting further growth in 2020 Despite difficult economic conditions, Jenoptik continued to grow in 2019.
ams reports record results for full year 2019 Austrian sensor manufacturer ams reports that its revenues for 2019 was up 32% year-on-year, and fourth quarter revenues exceeded expectations with strong adjusted operating profitability.
Xperi enters into a patent and technology license deal with SK hynix Xperi Corporation has entered into a new patent and technology license agreement with semiconductor manufacturer SK hynix.
Communications equipment makers want high power outputs and small solution footprints Many communications systems are powered via a 48 V backplane. This voltage is normally stepped down to a lower intermediate bus voltage, typically to either 12 V, 5 V, or even lower, in order to power the racks of boards within the system.
Pennsylvania’s AMETEK acquires IntelliPower AMETEK Inc. has purchased IntelliPower, designer and manufacturer of high-reliability external battery packs and power conditioners and distribution units for defense and industrial applications.
Nuvia unveils first NA office, new leadership Santa Clara-based silicon design start-up NUVIA Inc. has opened its first international office in Toronto, Ontario, Canada.
Murata completes new production building in Japan One of Murata’s manufacturing subsidiaries – Fukui Murata Manufacturing Co., Ltd. – has completed the construction of a new production building in Echizen City on the Fukui Prefecture, Japan.
Synapse opens two offshore semiconductor design centres Synapse Design has officially opened its newest semiconductor design centers: One in Ahmedabad, India and one in Penang, Malaysia. With the addition of these two design centers, the company now has eight offshore design centers (ODC).
Amtech receives order from power semiconductor customer in Asia Amtech Systems says that its subsidiary, Bruce Technologies, Inc., has received a significant new order for its full 300mm clustered HTR diffusion furnace from a top-tier global power semiconductor customer in Asia. The furnace is expected to ship in fiscal Q1 2021.Load more news