© ifixit Teardowns | December 30, 2014
See inside Amazon's tabletop Siri, the Echo
It lives in your home. It's always listening. It's the Amazon Echo, a voice-controlled smart speaker, and it's the closest device yet to the computer in Star Trek.
The Echo's auditory assistant, called Alexa, seems more responsive than Siri—and it's about on par with recent Apple fare on the repair front, too. But the Echo's tricky construction makes disassembly a tad difficult without a manual, so the Amazon Echo earned itself a reasonable 7 out of 10 for repair.
Teardown Highlights: At 9.75" x 3.27", the Amazon Echo stands just a bit bigger than a couple cans of soup. Amazon sealed the Echo up tight, with nary a fastener in sight. But peeling up the foot reveals four impressively long T10 screws holding the bottom stage of the Echo rocket in place. The heavy duty woofer has an even heftier magnet than its tweeting twin. Amazon promises "deep bass response," thanks to this woofer and some funneling by the reflex port. The reflex port boosts the bass while minimizing distortion. Its strange shape takes full advantage of the limited space inside the Echo while allowing Alexa to yell at you from across the room. Now for the fun part! The volume dial contains the user-interactive bits: The top portion spins freely, using a greased-up gear to turn an encoder. The Echo uses a gearing system and encoder to track motion of the outer wheel, whereas the Nest Thermostat uses an optical sensor to watch the outer ring spin by. Around the edge of the wheel, we find the microphones responsible for hearing your commands (six on the perimeter, plus one in the center of the board), and LEDs used to indicate Alexa's acknowledgement.
Chips on the Echo boards:
- Texas Instruments DM3725CUS100 Digital Media Processor
- Samsung K4X2G323PD-8GD8 256 MB LPDDR1 RAM
- Texas Instruments TPA3110D2 15W Filter-Free Class D Stereo Amplifier
- Texas Instruments TPS53312
- Texas Instruments TLV320DAC3203
- SanDisk SDIN7DP2-4G 4 GB iNAND Ultra Flash Memory
- Qualcomm Atheros QCA6234X-AM2D Wi-Fi and Bluetooth Module
- Texas Instruments TPS65910A1 Integrated Power Management IC
- Texas Instruments LP55231 Programmable 9-Output LED Driver
- Texas Instruments TLV320ADC3101 92dB SNR Low-Power Stereo ADC
- Texas Instruments SN74LVC74A Dual Positive-Edge-Triggered D-Type Flip-Flops
- S1053 0090 V6 Microphone
Intel nabs former GlobalFoundries, IBM executive Intel Corp has hired former IBM chip exec and GlobalFoundries CTO Gary Patton to its team.
Yokogawa UK partners with power supply manufacturer TDK-Lambda Yokogawa UK has signed a distribution deal with TDK-Lambda. Through Yokogawa’s distribution channels, customers across the UK will now have access to TDK-Lambda’s range of laboratory power supplies.
Denso & TMC launches JV to develop in-vehicle semiconductors DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
Murata to cease production at several subsidiaries Saitama Murata Manufacturing – previously Toko, Inc. – a wholly-owned subsidiary of Murata Manufacturing is ceasing production at its production subsidiaries Shantou S.E.Z. Huajian Electronics and Hua Jiuh Technology by the end of 2019.
KORE Wireless picks up Integron KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
memsstar ships MEMS production system to University of Freiburg memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Vishay's plant in Turin, Italy, receives R&D grant Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.Load more news