EBV Elektronik signs with Samsung Semiconductor

EBV Elektronik, an Avnet company has signed an agreement with Samsung Semiconductor Europe, for distribution of Samsung’s LED component products in EMEA region.

“Extending our opto-components portfolio to include Samsung’s LED products will allow us to move ahead on our path towards increased growth in this market,” comments Sebastian Hülck, Director Vertical Segment Lighting, EBV Elektronik, EMEA. “With Samsung on board, we now offer a wider range of products from mid- power LEDs to high-power emitters, along with COBs, LED modules, and LED packages for automotive, TV and IT markets.” “This agreement sets the stage for us to supply our LED component products through the deep European wide EBV sales network. Samsung will focus on its LED component business by providing high-quality products that meet customer needs for LED lighting packages and engines. We will cooperate closely with EBV to further develop our share in the LED Lighting market.” says Ove-Kristian Sörensen, Director of LED Components at Samsung Semiconductor Europe.

Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.

Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.

Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.

AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.

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