© maria simonova dreamstime.com Business | July 22, 2014
BASTION - European research programme is launched
European Union’s 7th Framework Programme has launched a collaborative research project BASTION to tackle aging and escaping faults in future nanoelectronics manufacturing technologies.
The project’s international consortium includes two high-techcompanies Aster Technologies and Testonica Lab, five European universities Politecnico di Torino, University of Twente, University of Lund, Tallinn University of Technology and High School Hamm-Lippstadt and the chip provider Infineon Technologies. BASTION - Board and SoC Test Instrumentation for Ageing and No Failure Found - with a budget of 4.65M€ encompasses a period of 3 years and is being coordinated by Dr. Artur Jutman from Testonica Lab. It is widely acknowledged that due to the shrinking feature size of semiconductor technologies we need to pay attention to the reliability of electronic products. The International Technology Roadmap for Semiconductors lists ageing in semiconductor devices as one of the most difficult challenges concerning reliability. Being almost unnoticed in today’s technologies, ageing is expected to manifest itself clearly in the highly miniaturized manufacturing processes towards the end of the current decade, unless measures will be taken to overcome the challenge.Another hard issue is product malfunctions that are difficult, or impossible, to reproduce referred to as No Failure Found (NFF). The BASTION consortium partners will unite their forces to contend the ageing and NFF issues. The coordinator of the project, Testonica Lab, is a world-wide pioneer and a technology leader in embedded synthetic instrumentation for electronics test. Aster Technologies is the leading supplier in board-level testability analysis tools, capitalizing on proven expertise in board testability and strong customer relations. Infineon Technologies offers semiconductor and system solutions and is a major chip supplier to the automotive industry. Testonica, Aster and Infineon are supported by five research institutions from Italy, the Netherlands, Sweden, Germany and Estonia.All the academic institutions involved have a high level of expertise and research excellence in the field of test and reliability of nanoelectronic systems. The project will investigate currently unknown defects, uncertain fault coverage and unclassified field returns. A new defect universe for emerging semiconductor technologies will be assembled and faults will be classified into comprehensive classes. BASTION will study the mechanisms of ageing and will improve the longevity of electronic products. A combination of embedded instrumentation, reliability networks and functional testing will be applied to develop an infrastructure for fast error detection and diagnosis. The goals of BASTION are ambitious. Among other targets the project aims at a considerable lifetime extension of emerging nanoelectronic products as well as at reducing test escapes, and therefore the impact of NFF, at least by the factor of two.
Additional DoD funding reaches SkyWater US semiconductor foundry SkyWater Technology says that the Department of Defense (DoD) has awarded the company up to USD 99 million as a continuation of the previous initiative to advance onshore production capabilities for strategic radiation-hardened (rad-hard) electronics.
Comet Technologies expands manufacturing in Malaysia Comet Technologies says that it aims to double its production capacity in Malaysia – the company will add 30,000 square feet and about 200 employees to its operations in the country.
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Swissbit expands its manufacturing capability in Berlin A new USD multi-million investment will add a new new semiconductor packaging line to Swissbit's electronics production in Berlin, Germany.
Henkel acquires Thermexit business from Nanoramic Henkel has completed the acquisition of the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic) headquartered in Boston, Massachusetts, USA, marketed under the brand Thermexit.
Mobix Labs to acquire EMI Solutions Fabless semiconductor company, Mobix Labs, says it has signed a definitive agreement to acquire EMI Solutions, an Irvine-based manufacturer of electromagnetic interference (EMI) filtering products.
Hexatronic acquires the data center specialist Swedish Hexatronic Group has signed an agreement to acquire 90% of the shares in UK-based Impact Data Solutions Limited (IDS Group).
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Kontron AIS takes over LUCOM As of September first, 2022, Kontron AIS GmbH has taken over LUCOM GmbH and thus strengthen its portfolio as an IIoT solution provider for industrial software and industrial automation.
VinFast and Renesas ink strategic partnership Vietnamese EV maker, VinFast, is expanding its collaboration with Japanese semiconductor company Renesas to include automotive technology development of EVs and delivery of system components.
Intel's close to making final selection for new Italian site The Italian government and Intel have reportedly selected the town of Vigasio in the northeastern Veneto region as their preferred site for the company’s future chip factory in Italy.
FPT Software launches chipmaking subsidiary Vietnamese ICT company, FPT Software, announces that it has launched a new chip subsidiary, FPT Semiconductor, meaning that the company is entering the booming semiconductor industry.
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Habia Cable opens its brand new Polish production facility Habia Cable has officially inaugurated its new, purpose-built, production facility in Poland.
Astera Labs opens new Vancouver location Connectivity solutions specialist Astera Labs has officially opened Astera Labs Vancouver – a new office and lab to support the company’s development of interconnect technologies for AI and Machine Learning architectures.
Qualcomm's automotive design-win pipeline expands to $30B Qualcomm says that its automotive design-win pipeline has grown to USD 30 billion, driven by increased adoption of the company's Snapdragon Digital Chassis solutions across the auto industry.
Henkel expands South Dakota facility Henkel has broken ground on a 35,000 square-foot expansion of its production facility in Brandon, South Dakota. The expanded facility will add new manufacturing muscles and allow Henkel to increase production of thermal interface materials used to manufacture electronics and electric vehicles.
Mouser adds 35+ new manufacturer brands to its line card Mouser Electronics continues to expand its line card by adding 36 new manufacturers through the end of August 2022.
Intelligent Memory expands its reach in Europe The manufacturer of industrial-grade memory product solutions, has won three new strategic distribution partners in Europe – covering the Benelux region, Poland and the UK.
Indium opens the doors to its expanded operations in Rome In late August 2022 Indium Corporation opened the doors to its latest expansion. The company's facility in Rome, New York is now Indium's largest manufacturing center globally in terms of square footage.
onsemi invests $450 million to expand European SiC fab onsemi says that the newly inaugurated expanded silicon carbide (SiC) fab in Roznov, Czech Republic will increase its the company's SiC wafer production capacity by 16 times over the next two years.
One facility upgrade done – on the the next Farnell and Avnet are keeping busy in September. The month marks the opening of its newly-renovated offices in Leeds, as well as the official groundbreaking on a new Avnet distribution center in Bernberg, Germany.
Nürnberg-based LÖKAST is now an official Metcal distributor OK International announces LÖKAST GmbH in Nürnberg is now an official Metcal distributor.
Mycronic to ship SLX mask writer to Asian customer The Swedish manufacturer of production equipment says that it has received an order for an SLX mask writer from an unnamed – new – customer in Asia.
Skeleton’s supercapacitors to power CAF’s new metro units Supercapacitor specialist Skeleton Technologies says that it will supply supercapacitors to the metro units that the Spanish manufacturer CAF will provide to the city of Granada, Spain.
Strong earthquake shakes Taiwan Updated: A 6.8 magnitude earthquake struck Taitung in the southeastern part of Taiwan on Sunday, local time, reports the Central Weather Bureau (CBW), the country's seismological center.
EPC opens new motor drive center of excellence EPC has opened a new design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets.
Murata to set up a new materials joint venture Murata Manufacturing, Ishihara Sangyo Kaisha and Fuji Titanium Industry – a wholly owned subsidiary of Ishihara Sangyo Kaisha – have signed a basic agreement to establish a joint venture to manufacture barium titanate for use in multilayer ceramic capacitors and other products.
Digi-Key enters distribution deal with Schneider Electric Digi-Key Electronics has secured a distribution agreement in North America with Schneider Electric. As a result of this partnership, Digi-Key now offers a selection of Schneider Electric's power, automation and control, and sensor products.Load more news