© cumypah dreamstime.com Business | July 01, 2014
Research Begins on Breaker Technologies for DC Power Grids
The partners of research project ”NEST-DC”: Airbus Group, E-T-A Elektrotechnische Apparate, Infineon, Siemens, University of Bremen, today announced a new research project.
Direct current offers many advantages compared to the conventional alternating current used today: For example, losses in power grids and electric devices are a total of 5 to 7 percent smaller than with alternating current. Direct current also makes it possible to more efficiently feed electric energy from regenerative sources into power grids and energy storage and to improve grid stability; with direct current it would be possible to build much more compact electric devices. In the past the lack of efficient and cost-effective circuit breaker technologies has made it impossible to fully exploit the potentials of direct current, e.g. in distribution grids in data center, photovoltaics and telecommunication systems or in on-board grids for aviation and shipping, electric vehicles and railway technology. The only electromechanical circuit breakers available today implicate the risk of arcing when switching direct current and voltages; furthermore they are slow to react, heavy, unwieldy and expensive. Funded by the German Federal Ministry of Education and Research (BMBF), the research project “ NEST-DC” aims to investigate the foundations of an innovative semiconductor-based and completely electronic circuit breaker for DC power grids and applications. The new circuit breaker should be able to switch direct current on, and most importantly switch it off, as quickly and safely as possible at voltages of up to 1,500V. Among other things NEST-DC will explore innovative semiconductor components such as the Over Current Blocking Field Effect Transistor (OCB-FET). New structure and connection technologies and switching topologies for the circuit breakers that will use OCB-FETs are to be formulated and tested. There will be demonstrators for the project results in the areas of on-board aviation grids, electromobility and photovoltaics, as well as for direct current distribution networks. NEST-DC partner research assignments The NEST-DC research partners represent the complete value creation chain from the semiconductor chip all the way to the DC power grid system. The team includes the University of Bremen’s Institute for Electrical Drives, Power Electronics, and Devices (IALB) and the four companies Airbus Group, E-T-A Elektrotechnische Apparate GmbH, Siemens AG and Infineon Technologies AG (project coordination). Support is also being provided by the European Center for Power Electronics e.V. (ECPE), headquartered in Nuremberg, Germany. Within the project, the IALB will handle investigation and simulation of novel semiconductor structures for use in the OCB-FETs, static and dynamic measurement of the newly developed circuit breakers and testing their thermal behavior and destruction limits. Airbus Group Innovations will define the requirements for aviation applications, researching a suitable topology and developing a demonstrator together with the NEST-DC partners. The hardware tests will be carried out by Airbus Group in Ottobrunn, Germany. Siemens will concentrate on the structure and connection technologies of the circuit breakers. E-T-A Elektrotechnische Apparate will define the requirements for industrial applications and, together with the partners, will validate the circuit breakers for voltage classes up to 1,500V. Infineon is leading the project, contributing its power semiconductor expertise and researching power semiconductors intended for use in the OCB-FETs. The NEST-DC research project is receiving approximately Euro 2.3 million in support from the BMBF in the context of the funding focus area “Power Electronics for Increasing Energy Efficiency”. The project began in October 2013 and will run for three years. NEST-DC abbreviates the German for “ Innovative Electronic Direct Current Circuit Breakers for Renewable Energies and On-Board Power Networks”.
New Chinese R&D centre to develop and produce conductive material Following an investment of CNY 500 million (about EUR 64 million), Changzhou Fusion New Material (Fusion New Material) is planning to drastically increase the its existing production capacity of silver paste products to 100 tons per month.
Farnell inks deal with Industrial Shields to distribute open-source automation devices Farnell has entered into a new global franchise with Industrial Shields, a developer and manufacturer of industrial automation devices (PLCs and Panel PCs) based on open source hardware from Raspberry Pi and Arduino.
Marvell to acquire Inphi – accelerating growth in cloud and 5G infrastructure Marvell Technology Group and Inphi Corporation have entered into a definitive agreement under which Marvell will acquire Inphi for about USD 10 billion.
Dana invests in electronic systems and control software specialist Dana Incorporated has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
Kioxia to expand 3D flash memory production via new fab Kioxia Corporation says it will start construction of a fabrication facility (Fab7) at Yokkaichi Plant in the Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASHTM. Construction of the new fab is expected to commence during the spring of 2021.
STMicro sets up ‘Lab-in-Fab’ to advance adoption of piezoelectric MEMS The company says it is partnering with A*STAR’s IME, a research institute in Singapore, and Japanese manufacturing-tool vendor ULVAC, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
Powell expands in Europe with new HQ, technical staff & more US-based supplier of connectors, Powell Electronics, is making a push for Europe. The company says it has strengthened its European presence by relocating to new premises in Dublin, Ireland, employing more technical staff to support design-in activities and signing new franchises agreements.
Axcelis ships multiple systems to CMOS image sensor manufacturers Axcelis Technologies, a supplier of high-productivity solutions for the semiconductor industry, says it has shipped multiple Purion VXE and Purion EXE high energy systems to several, unnamed, CMOS image sensor manufacturers.
AMD to acquire Xilinx in a $35 billion deal AMD and Xilinx have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at USD 35 billion.
EvoNexus and GF team up to accelerate growth of wireless and IoT startups EvoNexus, a non-profit technology incubator, and GlobalFoundries are teaming up to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).
Fingerprint finds its way into another PC Swedish biometrics company, Fingerprint Cards, says that the company has been awarded a design win by an unnamed, but described as a top tier, PC manufacturer, with a product launch planned for Q1 2021.
Osram scores major win in patent dispute At the end of April 2019, US-based Lighting Science Group (LSG) filed a patent infringement complaint at the U.S. International Trade Commission (ITC) against Osram and other companies in the lighting industry.
Cicor expands capacity at Wangs facility Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
Pixelworks to sell 7% stake to Chinese investors Pixelworks says it has entered into a Securities Purchase Agreement with MTM-Xinhe Investment Limited, a consortium of investors from the Chinese semiconductor and mobile eco-system, under which Pixelworks would issue and sell in shares representing about 7% of the company's outstanding shares for USD 6.6 million dollars.
Allegro MicroSystems sets terms for $325 IPO Allegro MicroSystems, a fabless chip company focusing on sensing and power technology, has commenced a proposed initial public offering of its common stock.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.Load more news