© iFixit Teardowns | January 02, 2014
Mac Pro Teardown: Thinking outside the box
Beneath the surface, the Mac Pro's compact, three-sided design is like nothing we've ever seen before—an example of what engineers can do when they think outside of the box.
The Mac Pro is both small and repairable. In fact, it’s the most repairable Apple product we’ve seen all year. The hood pops off with the flick of a switch. There’s not a proprietary screw in sight and the RAM can be replaced without any tools. Impressively, the CPU is also user-upgradeable; intrepid fixers should be able to save considerably by upgrading from the base-level processor configuration. Our chief demerit: There is no room or port for adding your own internal storage. Sure, it’s got heaps of Thunderbolt, but we'd rather use SATA if we could. Final repairability score: 8/10
Teardown Highlights: Looks like the Mac Pro has taken some design pointers from the recent AirPort Extreme and Time Capsule bodies: a thin, vertical design with individual boards on separate sides. A CPU upgrade appears entirely possible—and well worth it, with an alleged cost savings of $1050 for an upgrade to 12 cores. The dual AMD FirePro D300 graphics cards dominate the initial view. Their symmetry is broken only by the SSD cage nestled up alongside GPU number two. Amidst the usual processing power and cost comparison with a similar home-built desktop PC, these graphics cards (and a heck of a deal with AMD) may be the key to Apple finally undercutting homebrew systems on a pure power/cost basis. The dual AMD FirePro graphics cards are nearly identical twins reunited after birth. One has a GPU hailing from China, while the second is sourced from Taiwan, and also differs by hosting the single SSD slot. This seems to us like a potential opportunity for expansion—perhaps higher storage configurations make use of two of this variety, for doubling up on SSDs? A novel disc-shaped daughterboard ties everything together at the base of the machine.
- 3.7 GHz Quad-Core Intel Xeon E5-1620 v2 with Turbo Boost up to 3.9 GHz
- Intel BD82C602J Platform Controller Hub
- Elpida 4 GB DDR3L SDRAM
- PLX Technology PEX8723 PCI-E switch
- Intel DSL5520 Thunderbolt 2 controller
- AMD FirePro D300 graphics processor
- Elpida W2032BBBG 2 Gb GDDR5 VRAM
- Samsung S4LN053X01-8030 (ARM) flash controller
- Samsung K9HFGY8S5C-XCK0 flash storage
- Samsung K4P4G324EB 512 MB RAM
- Broadcom BCM57762 gigabit ethernet controller
- Fresco Logic FL1100 4-port USB 3.0 host controller
- Parade PS8401A HDMI jitter cleaning repeater
- Cirrus 4208-CRZ audio codec
Imagination announces latest licensing deal with NXP Imagination Technologies says that NXP has extended its license for Imagination’s Ethernet Packet Processor (EPP) IP for use in S32 vehicle network processors.
Synaptics to buys rights to Broadcom’s Wireless IoT connectivity business Synaptics Incorporated has signed definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of Broadcom for approximately USD 250 million in an all-cash transaction.
Apple to start mass producing Mac SoC, projected to cost under US$100 According to the latest investigations by TrendForce, Apple officially unveiled its self-designed Mac SoC processors based on the ARM architecture in June, with the market release of the first Mac device with Apple Silicon (which broadly refers to chips designed by Apple) scheduled to take place by the end of this year.
Mini LED supply chain to benefit from Apple’s new 12.9-inch iPad Pro As Apple’s upcoming release of products featuring Mini LED backlight generates a growth in Mini LED demand, the company has also stimulated actors in the Mini LED supply chain to increase their production capacities.
National Instruments completes acquisition of OptimalPlus NI has officially closed the acquisition of OptimalPlus, a data analytics software provider for the semiconductor, automotive and electronics industries.
LeddarTech acquires VayaVision LeddarTech has acquired sensor fusion and perception software company VayaVision.
ON Semi to provide Danfoss with high power devices ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the fast growing electric vehicle market.
X-FAB hit by cyber attack On the fifth of July, the mixed signal foundry expert, was the target of a cyber security attack.
UK and France on the map for Huawei Back in 2018, Huawei acquired 500 acres of land in Cambridge. Now the first phase of the Huawei Campus was approved by the local council and the company is gearing up to start the expansion. Adding to that, in late February, the Chinese telecom giant said it intends to build an automated factory will focus on 4G and 5G equipment in France.
Jenoptik is looking to accelerate growth with acquisition of TRIOPTICS Jenoptik is acquiring 100% of the shares in TRIOPTICS GmbH, a supplier of test equipment and manufacturing systems for optical components and sensors.
Global microelectronics market with overall stable development "Although the growth path of the global microelectronics market is intact, on a long-term trend-line, it declined by 12.1 percent to USD 412 billion in 2019," said Dr. Sven Baumann, ZVEI expert for microelectronics, sensors and actuators.
Jörg Doblaski takes on the role of X-FAB CTO X-FAB Silicon Foundries announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.
GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021 The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass USD 1 billion in 2021, energised by demand from hybrid & electric vehicles, power supplies, and photovoltaic (PV) inverters.
POET and Sanan IC Inks LoI to form $50 million JV The proposed JV aims to disrupt the data center market using the POET Optical Interposer to achieve superior economics and scale.
SG Wireless designates Digi-Key as authorised distributor for the US SG Wireless, the IoT solutions arm of EMS provider Season Group, has added Digi-Key as an authorised distributor of its IoT products for the US.
Kioxia completes acquisition of LITE-ON Technology’s SSD business Kioxia Holdings Corporation says it expects to complete its acquisition of LITE-ON Technology Corporation’s Solid State Drive (SSD) business, Solid State Storage Technology Corporation and its affiliated companies on July 1, 2020.
II-VI licenses technology for SiC devices and modules for power electronic II‐VI Incorporated has singed an agreement with General Electric to license GE's technology to manufacture silicon carbide (SiC) devices and modules for power electronics.
Dialog Semi completes its acquisition of Adesto Dialog Semiconductor says it has completed the acquisition of Adesto Technologies Corporation (Adesto)), a provider of custom ICs and embedded systems for the IIoT market.
Changes in NAND Flash Prices to Be Limited in 3Q20 Despite the reduced demand for consumer electronics and smartphones as a result of the COVID-19 pandemic, the NAND Flash market showed a short supply in 1H20, thanks to the corresponding rising demand for cloud services and distance education, as well as increased inventory procurement by some clients concerned with a possible breakage in the supply chain.
USI breaks ground on its new Huizhou manufacturing facility The electronics designer and manufacturer is looking to reinforce its foundation in Southern China and is doing so by adding a new manufacturing facility in Huizhou (Guangzhou, China).
R&M opens U.S. production facility The 10,000-square-foot facility in Elkridge, Maryland aims to services U.S. East Coast, Southern and Midwestern customers with consulting, production, support, and rapid delivery.
Osram: Slight recovery after weak 3rd quarter expected Osram Licht AG expects for the fiscal year 2020 a comparable revenue decline of -15 to -19 percent (previously:-3 and +3 percent), an adjusted EBITDA margin of 3 to 6 percent (previously: 9 to 11 percent) and a negative free cash flow in the mid double digit to lower triple digit million range.
Taiwan edges South Korea as largest base for IC wafer capacity China capacity expansion forecast to push the country into second place in the regional rankings in 2022, trailing only Taiwan in size.
Siemens acquires UltraSoC Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).Load more news
- A new EMS provider sees the light of day
- Global microelectronics market with overall stable development
- GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021
- Germany amps up domestic battery production with massive state subsidies
- ABB completes divestment of Power Grids to Hitachi