© iFixit Teardowns | November 27, 2013
Sony PlayStation 4 Teardown
Straight from the chilly streets of Ottawa, Canada to you! We teamed up with our pals at Chipworks to get our hands on (and in) the all-new Sony PlayStation 4.
We've grown accustomed to Apple's accelerated release schedule, so when a device refresh is seven years in the making, we tend to get excited.
And the PS4 did not disappoint. This modern gaming machine has its feet firmly rooted in hardware land, and its head off in the cloud. While the console is not backwards compatible, cloud gaming could resurrect the games you stand to lose. Your newest zombie-slaying game additions, on the other hand, will find a secure home on the PS4’s user-replaceable hard drive. With fewer screws and absolutely no adhesive, the console is more repairable than ever. Even in spite of security screws, warranty voiding seals, and a couple of sharp edges, the PS4 is both easy-to-open and repair-friendly—earning itself an 8 out of 10 on our repairability scale. Highlights: We're happy to see Sony give power to the people with the PS4's hard drive: it's user-replaceable. All that stands between you and hard drive nirvana is a plastic cover and some screws. But this is a bittersweet expansion win; the PS4 will not support external USB storage, drastically limiting the console's usefulness as a media center. Tamper-evident stickers and Security Torx screws stand in the way of opening our PS4—not insurmountable, but certainly discouraging to the average user's repair dreams.
- SCEI CXD90026G SoC (includes AMD "Jaguar" CPU Cores and Radeon GPU)
- Samsung K4G41325FC-HC03 512 MB GDDR5 RAM (total of 16 x 512 MB = 8 GB)
- SCEI CXD90025G Secondary/Low Power Processor for Network Tasks
- Samsung K4B2G1646E-BCK0 2Gb DDR3 SDRAM
- Macronix MX25L25635FMI 256Mb Serial Flash Memory
- Marvell Wireless Avastar 88W8797 7 Integrated 2x2 WLAN/Bluetooth/FM Single-Chip SoC
- Panasonic MN86471A HDMI Communication LSI
- Marvell 88EC060-NN82 Ethernet Controller
- SCEI 1327KM44S
- Genesys Logic GL3520 USB 3.0 Hub Controller
- Samsung K4G41325FC-HC03 4 Gb (512 MB) GDDR5 RAM
- International Rectifier 35858 N326P IC2X
- Macronix 25L1006E CMOS Serial Flash Memory
- Renesas SCEI RJ832841FP1
- Microchip Technology 312 3536A
Global microelectronics market with overall stable development "Although the growth path of the global microelectronics market is intact, on a long-term trend-line, it declined by 12.1 percent to USD 412 billion in 2019," said Dr. Sven Baumann, ZVEI expert for microelectronics, sensors and actuators.
Jörg Doblaski takes on the role of X-FAB CTO X-FAB Silicon Foundries announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.
GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021 The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass USD 1 billion in 2021, energised by demand from hybrid & electric vehicles, power supplies, and photovoltaic (PV) inverters.
POET and Sanan IC Inks LoI to form $50 million JV The proposed JV aims to disrupt the data center market using the POET Optical Interposer to achieve superior economics and scale.
SG Wireless designates Digi-Key as authorised distributor for the US SG Wireless, the IoT solutions arm of EMS provider Season Group, has added Digi-Key as an authorised distributor of its IoT products for the US.
Kioxia completes acquisition of LITE-ON Technology’s SSD business Kioxia Holdings Corporation says it expects to complete its acquisition of LITE-ON Technology Corporation’s Solid State Drive (SSD) business, Solid State Storage Technology Corporation and its affiliated companies on July 1, 2020.
II-VI licenses technology for SiC devices and modules for power electronic II‐VI Incorporated has singed an agreement with General Electric to license GE's technology to manufacture silicon carbide (SiC) devices and modules for power electronics.
Dialog Semi completes its acquisition of Adesto Dialog Semiconductor says it has completed the acquisition of Adesto Technologies Corporation (Adesto)), a provider of custom ICs and embedded systems for the IIoT market.
Changes in NAND Flash Prices to Be Limited in 3Q20 Despite the reduced demand for consumer electronics and smartphones as a result of the COVID-19 pandemic, the NAND Flash market showed a short supply in 1H20, thanks to the corresponding rising demand for cloud services and distance education, as well as increased inventory procurement by some clients concerned with a possible breakage in the supply chain.
USI breaks ground on its new Huizhou manufacturing facility The electronics designer and manufacturer is looking to reinforce its foundation in Southern China and is doing so by adding a new manufacturing facility in Huizhou (Guangzhou, China).
R&M opens U.S. production facility The 10,000-square-foot facility in Elkridge, Maryland aims to services U.S. East Coast, Southern and Midwestern customers with consulting, production, support, and rapid delivery.
Osram: Slight recovery after weak 3rd quarter expected Osram Licht AG expects for the fiscal year 2020 a comparable revenue decline of -15 to -19 percent (previously:-3 and +3 percent), an adjusted EBITDA margin of 3 to 6 percent (previously: 9 to 11 percent) and a negative free cash flow in the mid double digit to lower triple digit million range.
Taiwan edges South Korea as largest base for IC wafer capacity China capacity expansion forecast to push the country into second place in the regional rankings in 2022, trailing only Taiwan in size.
Siemens acquires UltraSoC Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).
BMW and Mercedes-Benz halt cooperation in automated driving The BMW Group and Mercedes-Benz AG are putting their cooperation on development of next-generation technology for automated driving temporarily on hold.
Olympus to divest Imaging Business Olympus Corporation and Japan Industrial Partners, Inc. signed a memorandum of understanding to carveout Olympus’s Imaging business to a new company and subsequently transfer its shares to a fund managed, operated or otherwise handled by JIP.
Dialog ups its outlook for Q2 Dialog Semiconductor says it is increasing its Q2 2020 revenue outlook due to a stronger than expected demand for tablets and notebooks.
Odyssey opens first European repair facility in Nijmegen Odyssey Technical Solutions is opening a new repair facility on Novio Tech Campus in Nijmegen. The company is focused on the repair and service of equipment in Radio Frequency (RF), DC and microwaves.
NOR Flash ASP to potentially drop in 2H20 NOR Flash buyers found that their inventories were low and stepped up their procurement efforts as they anticipated the growing risk of COVID-19 causing disruptions in the supply chain.
Globalfoundries acquires Land in U.S. Globalfoundries has secured a purchase option agreement for approximately 66 acres of undeveloped land adjacent to its most advanced manufacturing facility, Fab 8, in Malta, N.Y., near the Luther Forest Technology Campus (LFTC).
GF and SkyWater team up on technology development GlobalFoundries and SkyWater Technology have signed a Memorandum of Understanding (MOU) to manufacture secure solutions for the U.S. defense industrial base and cooperate on development of emerging technologies.
EBV Elektronik to franchise Sequans in EMEA EBV Elektronik, an Avnet company, today announced that it will distribute the product portfolio of Sequans Communications S.A. in EMEA.
Volkswagen increases stake in QuantumScape The Volkswagen Group is increasing its stake in QuantumScape and making an additional investment of up to US$200 million in the US battery specialist.
Danfoss secures capacities for electro-mobility chips at Infineon In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement.Load more news