© luchschen dreamstime.com
Components | November 08, 2013
Novel microfluidic material breakthrough
Imec and JSR have successfully used JSR’s innovative PA (Photo-patternable Adhesive) material for wafer-scale processing of lab-on-chip devices.
With PA as a key enabling material, imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics. PA is a breakthrough material: a good microfluidic channel material and adhesive at the same time, suitable for wafer-scale processes and mass production.
Lab-on-chip technology will drive a revolution in medical technology in the years to come. It will enable powerful point-of-care diagnosis and treatment through on-chip molecular synthesis, separation, sensing, and detection. Key will be the ability to integrate microfluidics with heterogeneous components such as electronics, sensors, microheaters, and photonics in a cost-effective manner. To merge these elements successfully, new bonding and surface treatment materials are needed.
“PA solves a number of issues that we have with other materials, such as the widely-used PDMS (polydimethylsiloxane, a silicon-based organic polymer)”, says Liesbet Lagae, imec R&D manager of life science technologies. It has all the characteristics we are looking for in a photopatternable material to create microfluidic channels on silicon wafers, including a good channel definition and biocompatibility. But at the same time, it is an adhesive that allows direct thermal bonding with the cover glass. And unlike PDMS, it allows for wafer-scale processing, which is a prerequisite for industrial mass production.”
Imec used PA to process the next generation of its cell sorter lab-on-chip. Integrating on-chip imaging, in-flow cell tomography to identify cells, and bubble jet-flow technology to guide and sort individual cells, the prototype lab-on-chip can process up to 2,000 cells per second. One application envisaged for these ultrafast cell-sorters is the detection of circulating tumor cells in human blood.
JSR and imec are longstanding partners in the development of semiconductor technology and materials going back to the late 80’s. JSR has taken a great interest in microfluidics materials, which it started developing in partnership with imec starting 2011. Two years of R&D including the assessment of biocompatibility and process compatibility have now resulted in a material solution for lab-on-chips such as imec’s cell sorter. Luc van den Hove, CEO of imec: “JSR has now also become a key material supplier in the life science ecosystem. Together, JSR and imec will continue to develop material solutions for life science applications."
“Most applications face the challenge of selecting the right materials and technologies,” emphasizes JSR’s CEO Nobu Koshiba. “Our collaboration with imec proves that open-innovation is key to move from early-stage precompetitive technology to the development of robust products such as these next-generation medical devices.”
Smith Names Sean Evans as Chief Financial Officer
Electronic components and semiconductor distributor, Smith, has appointed Sean...
Astronics completes sale of semiconductor system level test technology
Astronics Corporation, a provider of technologies for the global aerospace, defense, and...
Osram Licht AG confirms talks with Bain Capital and Carlyle Group
Osram Licht AG is confirming the market rumours that Bain Capital and Carlyle Group are...
CIVINTEC acquires the Cidron RFID reader range from Nexus
CIVINTEC, a supplier of RFID products in the global OEM and ODM segment, is acquiring the...
Fraunhofer Institute goes with Veeco's ion beam sputtering technology
Veeco Instruments has shipped its SPECTOR Ion Beam Sputtering (IBS) system and the...
EIB provides a total of €80 million to Zumtobel Group
The European Investment Bank (EIB) is providing the Austrian lighting company Zumtobel...
Mayflex expands operations operations with new HQ
IT communications equipment company, Mayflex, is expanding its UK operations and relocating...
Sensata breaks ground on new $27 million expansion
Sensor manufacturer, Sensata Technologis, has broken ground on a new production and...
WiTricity acquires Qualcomm Halo
Wireless power technology player, WiTricity, announces the acquisition of certain technology platform and IP assets from Qualcomm Incorporated and Qualcomm Technologies, which will bring over 1'500 patents and patent applications...
C&K focuses on business expansion - appoints industry veteran as CRO
C&K, a supplier of electromechanical switches, has appointed Scott Smith as the...
PSS to acquire wafering division of Meyer Burger
Precision Surfacing Solutions (formerly Lapmaster Wolters Group), says that the company...
Another CEO at WĂĽrth Elektronik eiSos
WĂĽrth Elektronik eiSos GmbH & Co. KG announces that it has appointed Thomas Wild as CEO...
Report: Renesas to lay off 1’000 employees
The Japanese chipmaker is reportedly looking to reduce its workforce by almost 1’000 employees by the end of June, as the company is trying compensate for a shrinking domestic market.
ODU to expand in Korea
As of January 1, 2019 ODU has a new company carrying the ODU name in Korea. Kai...
Cisco completes acquisition of Luxtera
Cisco has completed the acquisition of privately-held Luxtera, Inc, a semiconductor...
STMicro to acquire majority stake in Swedish SiC wafer manufacturer
STMicroelectronics says it has signed an agreement to acquire a majority stake in Swedish...
Intersection of hardware and design process in IoT solutions
Recent IoT research by development distributor Premier Farnell indicates that hardware...
ODU-USA in strategic partnership with RED Digital Cinema
ODU announces a strategic partnership with professional digital camera manufacturer...
Teledyne completes acquisition of Scientific Imaging businesses of...
The previously announced acquisition by Teledyne of the Scientific Imaging businesses of...
Infineon closes 1Q19 with lower revenues but better earnings
The semiconductor manufacturer closes the December quarter with revenue...
Related news
Most Read
Load more news