© Chipworks Teardowns | September 18, 2013
iPhone 5s: Enter Bosch Sensortec
At first glance we’re seeing a lot of familiar components with the major standouts being the new A7 processor and two new MEMS devices.
There is also a new power management IC by Dialog Semiconductor and a new audio codec and class D amplifier by Cirrus Logic. Chipworks has been able to locate the M7 in the form of the NXP LPC18A1. This represents a big win for NXP. "We had anticipated the M7 to be an NXP device based on input from industry analysts and our partners and we are happy to see this to be the case." The compass is AKM’s AK8963; the 3-Axis Gyroscope (a device with package markings B329) has been identified as an STMicroelectronics as expected. But the accelerometer is actually a design win for Bosch Sensortech with their BMA220 3-axis accelerometer. Previously this has been a socket dominated exclusively by STMicroelectronics. Great socket win Bosch! The A7 is made on the same process as the new Samsung Exynos 5410, the 28-nm HKMG process. Which is preferable, more pixels or a sensor with higher sensitivity? We all would like to have both, however at some point camera system and chip designers have to turn the knob towards one or the other. Apple has opted to stand on an 8 Mp resolution for the 5S iSight camera, but have increased the active pixel array area by 15%. With the help of a larger f/2.2 aperture, the system delivers a 33% increase in light sensitivity. The iSight camera has DNL markings which are consistent with the markings on the camera modules housing the Sony IMX145 we saw in the iPhone 5 and 4s. The iPhone 5S 8 Mp iSight camera module is 8.6 mm x 7.8 mm x 5.6 mm thick. The new iSight camera module has been refreshed with a custom 1.5 µm pixel pitch stacked (Exmor-RS) Sony sensor. The side-view X-ray image shows us what is now conventional packaging for Apple’s iSight cameras: a ceramic chip carrier with a back-mounted, back-illuminated CMOS image sensor (CIS) chip. Bump bonding is used to connect the die signal pads to the chip carrier lands. A decap and quick peek through our microscope shows the telltale signs of a Sony Exmor-RS sensor. We first saw Sony’s stacked CMOS image sensor chips (using through-silicon vias -TSVs) in the 8 Mp ISX014 from a Fujitsu tablet, and then in the 13 Mp IMX135 from the Samsung Galaxy S4 primary camera (The CIS is stacked on the image signal processor – ISP). Contained within the Wi-Fi SoC module is the BCM4334 which seen before in the iPhone 5. It includes IEEE 802.11 a/b/g/n single-stream MAC/baseband/radio, Bluetooth 4.0 + HS, and an integrated FM radio receiver. It is designed to be used with external 2.4 GHz and 5 GHz front-end modules, which include power amplifiers, T/R switches and optional low noise amplifiers. The 4g LTE Modem is a Qualcomm MDM9615M. This device utilizes a two-chip solution in the form of a Samsung DRAM to retain carrier specific information and a Samsung-fabricated LTE baseband processor. Other Design Wins As already stated in collaboration with iFixit, below is a list of some of the other design wins on the iPhone 5s’ two-sided circuit board:
- The touchscreen controller is Broadcom BCM5976A0KUB2G
- The LTE Modem is Qualcomm MDM9615M
- The LTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS transceiver is Qualcomm WTR1605L
- The RF power management IC is Qualcomm PM8018
- The NAND flash is SK Hynix H2JTDG8UD3MBR 128 Gb (16 GB)
- TriQuint TQM6M6224
- Apple 338S1216
- Texas Instruments 37C64G1
- Skyworks 77810
- Skyworks 77355
- Avago A790720
- Avago A7900
- Apple 338S120L
Arrow sits comfortably as number one among distributors SourceToday has rolled up their sleeves and taking it upon themselves to analyse the world of electronic component distribution.
Vitesco and ROHM cooperate on Silicon Carbide Power Solutions The powertrain business area of Continental Vitesco Technologies and ROHM Semiconductor have recently signed a development partnership, beginning in June 2020.
Six chip companies expecting an increase in 2Q sales Because of uncertainty regarding the impact of Covid-19 on business in the second half of this year, many semiconductor companies have not provided full year 2020 guidance.
Murata to close its Kanuma manufacturing plant It was short lived, the Kanuma plant. Established back in September of 2017, the site has developed, designed and produced primary and secondary batteries, but now the plant will close and production will be transferred.
Integra wins $3 million contract from Northrop Grumman Integra Technologies has been was awarded a $3 million contract from Northrop Grumman.
NI to acquire OptimalPlus in a $365 million deal National Instruments has entered into a definitive agreement to acquire OptimalPlus Ltd., a global player in data analytics software for the semiconductor, automotive and electronics industries.
Seagate to consolidate operations in the US On June 1, 2020, Seagate Technology committed to a restructuring plan with the aim reduce its cost structure, and invest in future opportunities. The company also intends to consolidate its Minnesota facilities into one location.
SkyWater chosen for volume US manufacturing of temperature sensing chip Foundry partner, SkyWater Technology, has been chosen by investment firm, Asymmetric Return Capital (ARC) and Linear ASICs, a fabless analog and mixed-signal semiconductor company, to volume manufacture a microchip with temperature sensing capabilities used in a low-cost, smartphone-enabled wireless patch that assists in the remote detection of COVID-19.
Samsung expands with new NAND flash facility Samsung Electronics plans to expand its NAND flash production capacity in Pyeongtaek, Korea, in order to improve its ability to meet demands from emerging technologies.
ASML ships first-generation multibeam inspection system ‘eScan1000’ ASML Holding NV says that it has completed system integration and testing of its first-generation HMI multibeam inspection (MBI) system for 5 nm nodes and beyond.
Cognex takes measures to counter deteriorating market conditions Machine vision technology provider, Cognex Corporation, says it is taking significant steps to reducing expenses due to deteriorating market conditions and to position the company for growth when conditions improve.
Verkotan selects PWC technology from Rohde & Schwarz Test and measurement specialist Rohde & Schwarz has recently introduced the R&S PWC200, the first plane wave converter (PWC) on the market. Verkotan is the first independent test house to choose this technology to test 5G NR FR1 base stations over-the-air (OTA).
Kurt Sievers takes the helm at NXP At its annual general meeting of shareholders, the appointment of Kurt Sievers as the company’s next CEO was overwhelmingly approved.
Excelitas’ Qioptiq subsidiary expands with new plant Excelitas Technologies, a company delivering photonic solutions, sats that its Qioptiq subsidiary held a ground-breaking ceremony last week to mark the beginning of construction for a new factory in Göttingen, Germany.
Farnell adds Sorensen power supplies to its roster Distributor Farnell announces that it has added Sorensen, the premier DC programmable power supply brand from Ametek, to its range of power supplies.
Infineon raises EUR 1 billion following successful share placement Infineon informs that the company placed 55 million new shares, following an accelerated bookbuilding process with institutional investors, under the exclusion of subscription rights. The shares were placed at a price of EUR19.30 per share, meaning that the company managed to raise EUR 1.06 billion.
Skeleton Technologies strengthens management with new COO Skeleton Technologies has appointed Ants Vill, former Vice President of Product, as Chief Operating Officer.Load more news