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New Aitech Core i7 Haswell-based 3U VPX SBC
Aitech Defense Systems Inc. now offers the C873, a rugged SBC based on Intel’s 4th generation, quad-core Core i7 Haswell processor operating at 2.4 GHz.
The single-slot SBC is one of the first to boards to integrate this exceptional computing performance into a rugged, 3U OpenVPX platform, offering up to 20% more processing over previous generations of SBCs. The Core i7 processor includes Turbo Boost Technology 2.0 that enables temporary operation at higher frequencies for enhanced performance. It also features an integrated HD Graphics 4600 core for 2D/3D graphics and video processing and provides RGBHV and HDMI/DVI outputs. The C873 is coupled with a Lynx Point QM87 I/O Platform Controller Hub (PCH) that supports legacy and high-speed interfaces enabling system design flexibility. To best utilize the exceptional performance of the Core i7, the high-performance C873 incorporates a variety of I/O interfaces as well as large memory arrays that complement the board’s high processing capabilities. Standard I/O includes four GigE ports as well as five USB ports, two SATA ports and two serial I/O interfaces as well as eight general purpose discrete I/O lines. An industry-standard PMC/XMC expansion slot enables the integration of additional resources, including memory, I/O or multiple-monarch processor PMCs. The C873 offers some of the highest memory capacities available on a 3U OpenVPX SBC to support specific application needs as well as mass storage requirements. Up to 16 GB of fast DDRL3 SDRAM with ECC protection as well as 64 GB of SATA Flash come standard. Two 16 MB Flash BIOS ensures reliable system boot, even if the primary device fails. Capable of communicating with up to eight other PCIe OpenVPX modules without a backplane switch, the C873 is ideal for embedded systems that require a rugged solution coupled with high data and graphics processing requirements. If a switch is used, even more modules can be accommodated. The board can be either air-cooled or conduction-cooled, which can also be provided as a VPX REDI-compliant SBC, depending on user requirements. Supporting seven OpenVPX slot profiles (defined by VITA 65), the new C873 can be incorporated in a variety of applications and environments. An IPMI controller offers system-level monitoring of the C873’s health and status. Three onboard temperature sensors and an elapsed time recorder (ETR) further assist in monitoring board health. Both standard and avionics (windowed) watchdog timers as well as a real time clock are available on the SBC.
Intel nabs former GlobalFoundries, IBM executive Intel Corp has hired former IBM chip exec and GlobalFoundries CTO Gary Patton to its team.
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Denso & TMC launches JV to develop in-vehicle semiconductors DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
Murata to cease production at several subsidiaries Saitama Murata Manufacturing – previously Toko, Inc. – a wholly-owned subsidiary of Murata Manufacturing is ceasing production at its production subsidiaries Shantou S.E.Z. Huajian Electronics and Hua Jiuh Technology by the end of 2019.
KORE Wireless picks up Integron KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
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Vishay's plant in Turin, Italy, receives R&D grant Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.
TowerJazz to maintain its TPSCo majority ownership Israeli semiconductor manufacturer, TowerJazz, says that it will not sell its stake and board control in its joint venture with Panasonic Corp in Japan, following the Japanese company's announcement that it is selling its semiconductor business.Load more news