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Qualcomm increases die size >40%
ABI Research reports that Qualcomm’s latest combination application/communication processor, the 8974 (which belongs to the Snapdragon 800 family), has a die area over 40% larger than the prior generation MSM8960 (an S4 plus dual core Krait application processor/ LTE modem) which measured 85.6sq mm.
The 8974 improves nearly all aspects of the prior generation, including:
- 2.3GHz quad-core Krait 400 application processor
- Adreno 330 GPU
- Full suite of connectivity (including 802.11ac, GPS, GNSS, and BT 4.0)
- LTE-Advanced modem capable of supporting 150Mbps data rates via carrier aggregation