EU Commission clears Infineon's acquisition of Cypress
The European Commission has, under the EU Merger Regulation, approved the acquisition of...
GLOBALFOUNDRIES buys Smartcom’s PDK team
GLOBALFOUNDRIES has acquired the process design kit (PDK) engineering team from...
New head of Zeiss Research Microscopy Solutions
Effective 1 October 2019, Dr. Michael Albiez became Head of the Research Microscopy...
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ams is not backing down – launches new offer for Osram
The Austrian sensor manufacturer says that it intends to launch a new all-cash...
Sivers IMA and NXP collaborate on 5G
NXP Semiconductors and Sivers IMA Holding AB announces a collaboration to deliver a...
LEMO opens new facility in the Netherlands
To support the unprecedented growth of its Benelux business, LEMO has invested in a new...
Wafer capacity by feature size shows rapid growth at <10nm
Leading-edge processes (<28nm) took over as the largest portion in terms of...
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Component Aggregators vs E-Commerce Marketplaces
What is the difference between electronic component aggregators and a marketplace? 67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged...
Elatec USA appoints Paul Massey as CEO
Elatec USA Inc., developer and manufacturer of RFID products, has named Paul K. Massey as...
Data Respons reports on record high quarterly results
Data Respons presented figures for Q3 showing both solid revenue growth and a good...
EC imposes interim measures on Broadcom
The European Commission has ordered Broadcom to stop applying certain provisions...
Specialisation kept Universal Robots agile through the years
Universal Robots, the Danish robotics company that many analysts credit with both...
2Q/2019: Memory business is approaching bottom
“Combined DRAM and NAND revenue was USD 25.4 billion in 2Q/2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, says Simone Bertolazzi...
Tridonic supplies new Beijing airport with light-on-demand
Tridonic supplies the new mega airport Beijing Daxing International Airport with drivers...
Infineon-radar technology in Google Pixel 4 Smartphone
Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion...
NVIDIA leads way but competition is intensifying
Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI)...
Nidec continues Polish investment
Nidec Motors & Actuators continues to expand in Poland and decided to invest a further...
Phoenix Contact builds R&D centre in Skolkovo
German electronics company Phoenix Contact is building a regional development and competence centre in Moscow's high-tech cluster Skolkovo.
Elektrobit opens software lab in Berlin
Kickstarts the new office by signing a collaboration agreement with Daimler...
Smiths Detection scanners keep laptops and liquids in the bag
Recent implementation of Smiths Detection’s checkpoint scanners at Melbourne Airport...
Murata develops Millimeter-Wave RF Module for Terragraph
Murata Manufacturing is working to develop an RF module solution for Terragraph, a gigabit...
Ynvisible Interactive enters manufacturing agreement with Invisense
Ynvisible Interactive has entered into a partnership with Invisense AB, a developer of passive...
RoodMicrotec and Totech to jointly offer long-term storage services
RoodMicrotec N.V, is teaming up with Totech Europe B.V. Under the cooperation agreement, the...
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