© mpanch dreamstime.com Components | April 19, 2013
World's Smallest, Slimmest and Lightest
Fujitsu, Fujitsu Frontech and Fujitsu Laboratories announced a practical version of "the world's smallest, slimmest and lightest contact-free vein authentication sensor".
There are a multitude of vein authentication devices in the market, including those for the finger or back of the hand, but the newly developed sensor is unique for its compact form factor, being 5.2mm thinner and 56% lighter than conventional sensors. At approximately 4.0g, the size has been reduced to a 25.0mm width, a 25.0mm depth, and a height of 6.0mm. This makes it easier to incorporate into a broader range of electronic devices, including the thinnest of today's notebook PCs and tablets. This, in turn, helps to expand the range of potential applications for palm vein authentication. With the inclusion of a feature that continuously captures palm vein images, instantly pick out the best image for authentication, and automatically verify, users can easily perform authentication by simply placing their palm lightly over the sensor. Challenges to Date To enable biometric authentication to be utilized in a wider range of locations and circumstances, Fujitsu has sought both robust security and superior user-friendliness for its palm vein authentication technology. At the same time, it also aims to develop smaller, thinner sensors that can be incorporated into a variety of electronic devices. Fujitsu has worked to develop and commercialize thin, miniature sensors capable of being integrated into the design of notebook PCs. However, in order to make the technology readily applicable to an even broader range of applications, there has been significant demand for even thinner and smaller sensors that maintain the same high standards of security and usability. Sensor Features With an eye toward incorporating this sensor into a variety of electronic devices, Fujitsu has developed the world's smallest, slimmest and lightest vein authentication sensor among a multitude of vein authentication devices, including those for the finger or back of the hand. Moreover, to facilitate integration with older versions of PalmSecure and to help users migrate to the new technology, Fujitsu has ensured compatibility with older generations while preserving the same usability, including continuous image capture and automatic verification functionality. The key features of the new sensor are as follows:
- World's smallest, slimmest and lightest sensor: To enable an even smaller and slimmer form factor, Fujitsu newly designed lighting and optical systems as components inside the sensor used for image capture. In fully leveraging its advantages as a palm vein authentication sensor that is contact-free and employs an image-reflective method for authentication, the new sensor is 25.0mm wide, 25.0mm deep, and 6.0mm tall, and weighs 4.0g or 56% less than conventional sensors. As a result, the new sensor is the world's smallest, thinnest and lightest of its kind, thereby greatly increasing the range of devices into which it can be incorporated.
- Same convenient operations through continuous image capture and automatic verification: The new sensor is able to continuously capture palm vein images, instantly pick out the best image for authentication, and automatically verify. This allows users to perform authentication by simply placing their palm lightly over the sensor for high accuracy and convenience.
- Can be used in combination with previous PalmSecure technology: For customers who currently use older PalmSecure technology (notebook PC sensors, built-in keyboard sensors for desktop PCs, attachable PalmSecure-SL sensors), Fujitsu has ensured that the new technology is compatible with older registration/authentication data formats and employs the same familiar operation methods, such as the way users hold their hand over the sensor. This makes it easy to use the new sensor in combination with existing sensors while also helping users migrate to the new technology.
Nuvia closes series A, eyes data center servers Santa Clara semiconductor design startup Nuvia Inc., formed earlier this year by three former top Apple Inc. design executives, has closed its series A round with USD 53 million secured.
Ingun's going global; expands in Latin America and Eastern Europe Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.Load more news