© alterfalter dreamstime.com Components | March 19, 2013
Kotura rolls out 100G silicon photonics chips
Kotura, Inc. announced a silicon photonics industry first. The company is demonstrating its Optical Engine in a Quad Small Form-factor Pluggable (QSFP) package.
Kotura's Optical Engine uses Wavelength Division Multiplexing (WDM), in which different signals can share the same path. Kotura is the only silicon photonics provider to offer WDM and now chalks up another industry first as the only silicon photonics provider to demonstrate WDM in a 100 gigabits per second (Gb/s) 4x25 QSFP package with 3.5 watts of power. Kotura's Optical Engine provides an inexpensive, small form factor that reduces power consumption and provides a high level of integration. Consuming only 3.5 watts of power, Kotura is addressing the need for green solutions for 100G pipes desired by data centers and high performance computers (HPC). The QSFP package has become the industry standard footprint for 4x10G and 40G Ethernet in data centers as well as 40G and 56G Infiniband in HPC. Kotura predicts that the same package will become the industry's volume standard for 100G networks in both data centers and HPC applications. "The QSFP package enables our customers to fit 40 transceivers across the front panel of a switch, providing 10 times more bandwidth than CFP solutions," said Jean-Louis Malinge, Kotura president and CEO. "Because we monolithically integrate WDM and use standard Single Mode Fiber duplex cabling, our solution eliminates the need for expensive parallel fibers. No other silicon photonics provider can offer WDM in a 3.5 watt QSFP package." A long-time innovator in WDM, Kotura has integrated all of the 100G optical and opto-electrical functions into two small chips. According to Malinge, the beauty of Kotura's WDM is that it can scale from four channels to many more, on the same chip. At 100G and higher, Kotura's customers need WDM to avoid the use of expensive ribbon fiber, parallel connectors and patch panels. For large data centers, reaches of 30 meters to 2 kilometers are common and expensive ribbon fiber dominates the interconnect fabric costs. For Active Optical Cables and very short-reach links, Kotura also offers a parallel version of its 100G Optical Engine. "The market for 40G transceivers in QSFP packages has grown much faster than expected," said Vladimir Kozlov, founder and CEO of LightCounting Market Research. "Squeezing 100G in the same QSFP package and reducing power consumption is critical for applications of 100 Gb/s optics in data centers."
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.
Analog Devices acquires HDMI business from INVECAS Analog Devices, Inc. has acquired the High Definition Multimedia Interface (HDMI) business of Santa Clara based INVECAS.
Intel’s chief engineering officer to leave the company Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.Load more news