© aleksandr volkov dreamstime.com Components | October 31, 2012
Cadence tapes out of 14nm test-chip with ARM processor
Cadence Design Systems taped out a 14-nanometer test-chip featuring an ARM Cortex-M0 processor implemented using IBM's FinFET process technology.
The 14-nanometer ecosystem and chip are significant milestones of a multi-year agreement between ARM, Cadence and IBM to develop systems-on-chip (SoCs) at the advanced process nodes of 14 nanometers and beyond. SoCs designed at 14 nanometers with FinFET technology offer the promise of a significant reduction in power consumption. "This chip represents a major milestone for advanced node process technology, achieved through tight collaboration among experts at the three companies," said Chi-Ping Hsu, senior vice president, Silicon Realization Group at Cadence. "FinFET designs offer significant advantages to the design community, but also require advanced foundry support, IP and EDA technology to meet the considerable challenges. Cadence, IBM and ARM are collaborating to address these challenges and develop an ecosystem that can support 14-nanometer FinFET development for a broad range of production designs." The chip was developed to validate the building blocks of foundation IP for 14-nanometer design. In addition to the ARM processor, SRAM memory blocks and other blocks were included that provide the characterization data necessary for foundation IP development for FinFET-based ARM Artisan physical IP. "Each move to smaller geometry brings new challenges that require deep collaboration among ecosystem leaders in the SoC design chain," said Dipesh Patel, vice president and general manager, Physical IP Division at ARM. "With 14-nanometer design, many of these challenges center on FinFETs, and our work with Cadence and IBM has focused on answering the key questions about how to make 14-nanometer FinFET design viable and economically feasible." ARM design engineers incorporated an ARM Cortex-M0 processor using 14-nanometer FinFET technology built on IBM's silicon-on-insulator (SOI) technology, which offers an optimal performance/power profile. A comprehensive 14-nanometer double patterning and FinFET support methodology was employed, with engineers using Cadence technology to design the FinFET 3D transistor chip. "The tapeout of this 14-nanometer test chip is the culmination of the significant progress we have made with FinFET on SOI utilizing it's built in dielectric isolation," said Gary Patton, vice president of IBM Semiconductor Research and Development Center. "In fact, Cadence and ARM have collaborated on a design solution to tape out this test chip based on IBM's FinFET technology. We continue to collaborate to deliver on the promise of superior power, performance, and variability control of fully depleted SOI FinFET devices at 14 nanometers and beyond."
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.
Analog Devices acquires HDMI business from INVECAS Analog Devices, Inc. has acquired the High Definition Multimedia Interface (HDMI) business of Santa Clara based INVECAS.
Intel’s chief engineering officer to leave the company Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.
Schleuniger Group acquires the business of US-based Cirris Systems Corp. Following many years of cooperation, the Schleuniger Group and Cirris Systems Corp. have signed an agreement for Schleuniger to acquire Cirris, based in Salt Lake City, Utah, on the basis of an asset deal.
Mu-Del Electronics acquires Luff Research Virginia-based Mu-Del Electronics LLC, an Ironwave Technologies Company and a manufacturer of high-performance RF and Microwave based systems, is acquiring Luff Research.
Sierra Wireless to divest automotive embedded module product line The company has announced a definitive agreement to divest its Shenzhen, China-based automotive embedded module product line for USD 165 million in cash.
The evolving GaN and SiC power semiconductor market landscape The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is rapidly evolving from a startup-dominated business to one led by large-established power semiconductor manufacturers.
AEM acquires DB Design to expands design & application engineering capabilities AEM Holdings Ltd has acquired 100% stake in California-based DB Design Group, Inc. with its key team of designers and machinists located in California serving the Silicon Valley customer base.
Nanoscribe opens new Microfabrication Experience Center The Microfabrication Experience Center at Nanoscribe’s headquarters in Karlsruhe, Germany is opening its doors these days.
Arm expands R&D centre in Budapest The chip company will be growing its staff of developers by more than 50% at its R&D centre in Budapest, Hungary.
Apple wants its supply chain to be 100% carbon neutral by 2030 The Cupertino company says that its wants to bring its entire carbon footprint to net zero – 20 years sooner than the IPCC targets.
Bosch set to expand in Malaysia with new plant in Penang The German manufacturing giant has signed a Sales and Purchase Agreement (SPA) with the Penang Development Corporation for land in the Batu Kawan Industrial Park in Penang.
Tel-Instrument Electronics receives $1.6M test set order Avionics test and measurement solutions designer and manufacturer, Tel-Instrument Electronics, has received a USD 1.6 million test set order for the South Korean military.
EV Group nearly doubles its cleanroom capacity at its HQ EV Group (EVG) has completed the construction of its new Cleanroom V building at its corporate headquarters in Austria.
China steps up pace of Mini/Micro LED commercialisation By 2024, the global Mini/Micro LED market is projected to reach US$4.2 billion in revenue. The positive outlook of the Mini/Micro LED industry has attracted many investors.
STMicro to strengthen its wireless connectivity capabilities via acquisitions STMicroelectronics has signed two M&A agreements related to the acquisitions of the entire share capital of Ultra Wide Band specialist BeSpoon and of the cellular IoT connectivity assets of Riot Micro.
Standex acquires Renco Electronics Standex International Corporation has acquired privately-held, Florida-based Renco Electronics for approximately USD 28 million in cash with an additional three-year earnout payment based upon achieving certain financial targets.Load more news