Components | June 15, 2012
HSA Foundation formed by AMD, ARM, Imagination, MediaTek & TI
AMD, ARM, Imagination, MediaTek and Texas Instruments formed the Heterogeneous System Architecture (HSA) Foundation.
AMD, ARM, Imagination Technologies, MediaTek Inc., and Texas Instruments are the initial founding members of the HSA Foundation. The companies will work together to drive a single architecture specification and simplify the programming model to help software developers take greater advantage of the capabilities found in modern central processing units (CPUs) and graphics processing units (GPUs), and unlock the performance and power efficiency of the parallel computing engines found in heterogeneous processors. “HSA moves the industry beyond the constraints of the legacy system architecture of the past 25-plus years that is now stifling software innovations,” said Phil Rogers, HSA Foundation President and AMD Corporate Fellow. “By aiming HSA squarely at the needs of the software developer, we have designed a common hardware platform for high performance, energy efficient solutions. HSA is unlocking a new realm of possibilities across PCs, smartphones, tablets and ultrathin notebooks, as well as the innovative supercomputers and cloud services that define the modern computing experience.” As an independent consortium, the HSA Foundation is open to any and all computing industry professionals with an interest in driving the next era in computing performance and energy efficiency. The HSA Foundation welcomes forward-thinking semiconductor companies, platform and OS vendors, device manufacturers, independent software vendors, academia and open source developers. Members of the HSA Foundation plan to deliver robust development solutions for heterogeneous compute to drive innovative content and applications with developer tools, software developer kits (SDKs), libraries, documentation, training, support and more. “One year ago, AMD boldly announced a roadmap for making HSA a reality, starting with combining the CPU and GPU as a unified processing engine to create an architecture that would greatly simplify the programming of heterogeneous platforms,” said Manju Hegde, corporate vice president of Heterogeneous Applications and Developer Solutions for AMD. “Today, we are continuing our heterogeneous computing leadership and dedication to driving broad industry adoption by making the HSA architecture an open standard.”
Broadcom to supply wireless components to Apple Certain subsidiaries of Broadcom have entered into two separate multi-year statement of work agreements with Apple Inc.
TowerJazz, Cadence, and KPI to open analog design lab TowerJazz, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, are collaborating to open a new analog circuit design lab in Ukraine.
STMico CEO: ‘We closed 2019 with a solid fourth quarter’ The semiconductor manufacturer reported 2019 fourth quarter new revenues of USD 2.75 billion, gross margin of 39.3%, operating margin of 16.7% and new income of USD 392 million.
Car supplier Harman plans to close German site The automotive supplier Harman apparently wants to stick to its plans and close the plant in Straubing (Germany). Between 625 and 700 jobs are affected.
Sponsored content by CMLCML manufactures Metal Substrate solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
Camtek receives orders for 34 systems from five manufacturers Camtek says it has received orders for 34 systems for 2D inspection of CMOS image sensors from five different manufacturers, of which 25 are from two customers.
Changes to Next Biometrics' management Next Biometrics' CFO, Knut Stålen, will step down from his position on the last day of February 2020. Knut Stålen has been with NEXT Biometrics since 2014.
Foxconn and Heraeus sign MoU Foxconn Technology Group and Heraeus have signed a Memorandum of Understanding for a strategic cooperation within the space of 5G.
BAE to pick up Collins Aerospace’s GPS business and Raytheon’s ATR business BAE Systems has reached definitive agreements for the proposed acquisitions of Collins Aerospace’s military Global Positioning System (GPS) business and Raytheon’s Airborne Tactical Radios (ATR) business.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.Load more news