Components | June 13, 2012

Micron markets 2Gb and 4Gb, 1GHz/DDR3-2133

Micron Technology introduced a new class of 1GHz, 2-gigabit (Gb) and 4Gb, 30-nanometer (nm) DDR3 devices.
AMD and LSI are among the latest technology and IP partners for these products, both having worked closely with Micron throughout the development process. Micron relies on its ecosystem partnerships to deliver greater product reliability and compatibility, which, in turn, optimizes customers' time to market and design costs.

"Massive data growth continues to tax storage and networking equipment, and contending with that growth requires high-performance memory interfaces to meet system bandwidth requirements," said Harold Gomard, SerDes and DDR IP Product Manager, LSI. "Micron's broad memory product line and support for 1GHz DDR3 memory in 2 and 4Gb-based modules enables LSI to meet the needs of enterprise and cloud networking and storage customers."

"We continue to build an aggressive portfolio for the performance-focused graphics market," said Matt Skynner, corporate vice president and general manager, AMD Graphics. "With Micron's new DDR3 devices we expect to drive even more performance."

"High-speed DDR3 will be powering the mainstream graphics and high-performance networking markets in 2012 and beyond. Micron is prepared to support these demanding markets by leveraging our expertise with high-volume, cost-efficient DDR3 products and developing these very high-performance DDR3 devices," said Robert Feurle, vice president of DRAM marketing for Micron. "The combination of our advanced process technology and our commitment to the graphics and high-end computing markets has proven highly successful, and these new 30nm 2Gb and 4Gb DDR3 products will continue to deliver on that promise."


Samples of Micron's new class of high-performance, low-power DDR3 devices are available now, with volume production ramping by summer.
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