Components | April 24, 2012
TowerJazz successful in technology transfer
TowerJazz successfully transferred its CMOS image sensor (CIS) technology from its Migdal Haemek, Israel facility to its US fab in Newport Beach, California providing multi-sourcing.
TowerJazz’s CIS process has already been running in high volume in its Israeli plants, and is now available in its Newport Beach, CA facility for customers that require on-shore manufacturing.
The CIS process enables the customization of pixels according to project needs and its superior performance (dark current, low noise and dynamic range) enables a rich offering for various digital imaging applications. For example, TowerJazz’s presence in the industrial sensor market is growing significantly with new applications such as fingerprint detection for homeland security, traffic monitoring cameras and others.
Integration of TowerJazz’s NMOS pixel with its 0.18 analog CMOS provides a US-based solution for specialty image sensors for aerospace and defense applications as well. In addition, TowerJazz’s patented stitching technology overcomes photolithography tool limitations to seamlessly tile 5.5-micron pixel sections into a large pixel array, resulting in ultra-high resolution, high-quality color image sensors. This technology enables manufacturing of die sizes up to a single die per 200-mm wafer.
“We are providing a high level of support to customize pixels in order to optimize performance for specialty applications, including non-ITAR aerospace and military applications. We are pleased with the transfer of our CIS process to our US fab to address customers’ needs for on-shore manufacturing of ITAR applications and to provide a global sourcing solution with our advanced and proven CIS technology offering,” said Dr. Avi Strum, Vice President and General Manager of Specialty Business Unit.
“Our aerospace and defense business is experiencing solid growth and the further expansion of our technology offerings will provide an even broader range of advanced technology to our customer base here in the US,” said Corey Fukushima, TowerJazz Aerospace and Defense Sales.
The CIS process enables the customization of pixels according to project needs and its superior performance (dark current, low noise and dynamic range) enables a rich offering for various digital imaging applications. For example, TowerJazz’s presence in the industrial sensor market is growing significantly with new applications such as fingerprint detection for homeland security, traffic monitoring cameras and others.
Integration of TowerJazz’s NMOS pixel with its 0.18 analog CMOS provides a US-based solution for specialty image sensors for aerospace and defense applications as well. In addition, TowerJazz’s patented stitching technology overcomes photolithography tool limitations to seamlessly tile 5.5-micron pixel sections into a large pixel array, resulting in ultra-high resolution, high-quality color image sensors. This technology enables manufacturing of die sizes up to a single die per 200-mm wafer.
“We are providing a high level of support to customize pixels in order to optimize performance for specialty applications, including non-ITAR aerospace and military applications. We are pleased with the transfer of our CIS process to our US fab to address customers’ needs for on-shore manufacturing of ITAR applications and to provide a global sourcing solution with our advanced and proven CIS technology offering,” said Dr. Avi Strum, Vice President and General Manager of Specialty Business Unit.
“Our aerospace and defense business is experiencing solid growth and the further expansion of our technology offerings will provide an even broader range of advanced technology to our customer base here in the US,” said Corey Fukushima, TowerJazz Aerospace and Defense Sales.
Thales Alenia Space in partnership for ISS-program
NanoRacks will pursue International Space Station opportunities in cooperation with...
Versum Materials opens R&D facility in Pennsylvania
Versum Materials, a materials supplier to the semiconductor industry, has officially opened its...
Qualcomm with 1'500 job cuts
Chipmaker Qualcomm Inc. is said to lay off 1'500 staff in California, the majority of which will have to leave the chipmaker’s San Diego headquarters.
What’s in your portable product?
We are all familiar with batteries these days; they are virtually ubiquitous in a myriad of...
Rheinmetall protects new naval port
The multiphase contract is a worth a double-digit euro million figure and includes the...
Stadium now part of TT Electronics
TT Electronics plc has completed its acquisition of Stadium Group plc, a supplier of design-led...
First Graphene signs MoU with SupremeSAT on miniature satellites
First Graphene has entered into a binding Memorandum of Understanding with...
Littelfuse PLEDs support replacing fluorescent lighting tubes with LED...
Littelfuse, Inc. introduced a series of PLEDs with an ultra-low holding current (just 21mA) that...
Passives: Demand continues to outstrip supply
Especially MLCC, tantalum and chip resistors are affected by this demand-supply discrepancy. The traditional slowdown in demand that is typical for January, has not occurred and consumption is now expected to be up for the global market...
Bittium secures purchase order from Finnish Defence Forces
Bittium Wireless has received a purchase order from the Finnish Defence Forces for products...
CACI withdraws offer to acquire CSRA
CACI International Inc has withdrawn its previously announced offer to acquire all...
ROHM: Apollo plant gets more production capacity
ROHM Semiconductor plans to construct a new building at its Apollo plant in Chikugo (Japan)...
Bosch plans smart factory for electronic components
Bosch is investing EUR 100 million in a new plant in Celaya (Mexico). The German manufacturer plans to build a new smart factory for electronic components in the central Mexican city by 2020.
RoodMicrotec: First quarter sales up 17%
RoodMicrotec reports a 17 percent year‐on‐year increase in sales revenue, due to a strong...
Infineon demonstrates secured authentication using FIDO2 on Microsoft...
Infineon Technologies AG is demonstrating its FIDO2 reference design. The design is...
MediaTek teams up with Microsoft
MediaTek are collaborating with Microsoft to deliver the first ever Azure Sphere chip, the MT3620...
Edwards Vacuum breaks ground on new innovation centre in Oregon
Edwards Vacuum, a manufacturer of vacuum and abatement solutions, has...
Mouser Electronics expands Mexico office
The new and expanded customer service centre in Guadalajara, Mexico, will serve...
Continental expands production with new facility in China
German technology company, Continental, has broken ground on its greenfield facility in Wuhu...
Molex & TTTech to develop industrial IoT solutions
Based on their shared vision of open, flexible and interoperable systems in the Industrial Internet...
Most Read
Load more news
Comments