© iFixit Components | April 27, 2011
Meet the Nikon D5100
It seems as though all the hot new electronics these days are tablet-this, phone-that. Frankly, our engineers had enough. Their spudgers were getting soft; we needed to do something that would present a challenge and get them sharp again.
They were desperate for something more mechanically complex to chew on than the cell phone and tablet fare we've been feeding them lately. We knew exactly where to turn. We've already written a Nikon D70 repair manual, we know first-hand how difficult it is to take apart a pro SLR camera. What better way to infuse a bit of fun in our teardowns than taking apart another SLR? Enter the just-released Nikon D5100. Teardown highlights: - The D5100 utilizes a 16.2 megapixel DX format CMOS sensor to capture images. This sensor has the same specs of the sensor used by the Nikon D7000. - Chipworks reports that each pixel on the sensor is 4.8 µm wide. That's about half the diameter of a red blood cell. - The sensor has a special glass cover that turns red when viewed at an angle, but is completely transparent when viewed head-on. Neat! - Unlike other recent teardowns, the battery can be easily replaced by opening the compartment with your thumbnail. - The 7.4 V 1030 mAh EN-EL14 Li-ion battery is used by the D5100, D3100, and the COOLPIX P700. Sadly, it's not compatible with other cameras in the Nikon lineup, such as the D90 and D7000. - Definitely make sure to discharge the large-and-in-charge 330µF flash capacitor if you attempt any repairs on the D5100. Otherwise you risk accidentally killing your camera. - The camera has roughly 4 billion screws holding it together. We had to skip a lot of the "unscrewing this screw" pictures in order to keep the teardown interesting, since we took out 37 of them to get to the teardown layout shot. - You can easily access the motherboard by removing the rear cover. You just need to remove twenty-ish #00 Phillips screws, disconnect 9 ribbon cables, and desolder a few wires... - There's a light blue pad wedged between the bottom of the flash capacitor and the bottom camera frame. It conducts heat away from the capacitor to cool it down during flash-intensive shooting. - The top cover is a feat of engineering by itself. Within its walls are contained: Main control wheel, shutter/aperture control wheel, live view lever, On/Off switch, "info" button, record button, shutter button, exposure compensation button, IR sensor, AF lamp, flash, flash control circuitry, flash actuator, and the microphone. - The flash is actuated by a linear solenoid that pushes on a lever to release the spring-loaded flash -- either automatically if the sensor detects a low-light situation, or when the flash button is depressed. The D5100 contains a lot of the same chips found in the Nikon D7000. Key players include: - Nikon EXPEED 2 EI-154 1051 Z05 image processor - Samsung K4T1G164QF-BCE7 1Gb DDR2-800 SDRAM (total of 3 Gb = 375 MB) - MXIC MX29GL128EHXFI-90G 128 Mb parallel flash memory - Toshiba TMP19A44FEXBG low-power microcontroller - Nikon EI-155 M4L1BA00 00151044 - Nikon NHHS-2 049M8 © All images: iFixit / This image has a zoom function Right out of the box we noticed that the D5100 body was not the same heft and size as the D90. It just felt... punier. But then we took some photos with it. To our eyes, the photos came out amazing. Needless to say, we sincerely hope the camera works once we put it back together. The D5100 scored a pitiful 2 out of 10 Repairability Score. In this case, that's probably for the best. Only but the techiest of techs could attempt to repair their own D5100 and actually have it work again post-repair. There's so many potential pitfalls to repairing this device that we suggest the common nerd gets expert help before disassembling their camera. Ready for more? Find it here.
Renesas and Panthronics team up on wireless charging and IoT solutions Renesas and Panthronics AG, a fabless semiconductor company specialising in high performance wireless products, are collaborating to bring solutions to the consumer, industrial, and Internet of Things (IoT) markets.
Murata completes new production facility in Malaysia Murata Electronics (Malaysia) Sdn.Bhd. (Perak, Malaysia), a production subsidiary of Murata Manufacturing Co., Ltd., recently completed construction of a production facility that was started in October 2018.
AKKA is now a majority owner of Data Respons Following the closing of the voluntary offer period, AKKA holds 72.89% of Data Respons’ share capital.
Sequans and Avnet sign global distribution deal Sequans Communications S.A. and Avnet have entered into a distribution agreement whereby Avnet will promote and sell Sequans’ IoT chips and modules and will exclusively promote and sell Monarch Go, an LTE-M/NB-IoT modem component designed for and certified by Verizon.
Synopsys completes acquisition of certain IP assets from INVECAS Synopsys, Inc. has completed its acquisition of certain IP assets from INVECAS. This acquisition broadens Synopsys' DesignWare Logic Library, Embedded Memory, General Purpose I/O, Analog, and Interface IP portfolio.
Qualcomm: Coronavirus may impact phone industry Chip maker Qualcomm Inc has issued a statement that the coronavirus outbreak in China poses a potential threat to the mobile phone industry.
South Korean supplier to set up manufacturing in Hungary Soulbrain, a South Korean materials company supplying chemicals used in semiconductors, displays and battery cells, is establishing its first European unit in Tatabánya in Hungary.
Seven major chip acquisitions valued at USD 1bn or more Semiconductor merger and acquisition activity strengthened in 2019 after pulling back in the two previous years from historic high levels of M&A agreements in 2015 and 2016.
Jenoptik is expecting further growth in 2020 Despite difficult economic conditions, Jenoptik continued to grow in 2019.
ams reports record results for full year 2019 Austrian sensor manufacturer ams reports that its revenues for 2019 was up 32% year-on-year, and fourth quarter revenues exceeded expectations with strong adjusted operating profitability.
Xperi enters into a patent and technology license deal with SK hynix Xperi Corporation has entered into a new patent and technology license agreement with semiconductor manufacturer SK hynix.
Communications equipment makers want high power outputs and small solution footprints Many communications systems are powered via a 48 V backplane. This voltage is normally stepped down to a lower intermediate bus voltage, typically to either 12 V, 5 V, or even lower, in order to power the racks of boards within the system.
Pennsylvania’s AMETEK acquires IntelliPower AMETEK Inc. has purchased IntelliPower, designer and manufacturer of high-reliability external battery packs and power conditioners and distribution units for defense and industrial applications.
Nuvia unveils first NA office, new leadership Santa Clara-based silicon design start-up NUVIA Inc. has opened its first international office in Toronto, Ontario, Canada.
Murata completes new production building in Japan One of Murata’s manufacturing subsidiaries – Fukui Murata Manufacturing Co., Ltd. – has completed the construction of a new production building in Echizen City on the Fukui Prefecture, Japan.
Synapse opens two offshore semiconductor design centres Synapse Design has officially opened its newest semiconductor design centers: One in Ahmedabad, India and one in Penang, Malaysia. With the addition of these two design centers, the company now has eight offshore design centers (ODC).
Amtech receives order from power semiconductor customer in Asia Amtech Systems says that its subsidiary, Bruce Technologies, Inc., has received a significant new order for its full 300mm clustered HTR diffusion furnace from a top-tier global power semiconductor customer in Asia. The furnace is expected to ship in fiscal Q1 2021.
Osram starts the year with a strong first quarter After a challenging fiscal year 2019, Osram has made a robust start to fiscal 2020. On a comparable basis, revenue in the first quarter (ending December) grew slightly by 0.5% to EUR 873 million.
Presto acquires DELTA Microelectronics business from FORCE Technology Presto Engineering, an outsourced operations provider to semiconductor and (IoT) device manufacturers, has acquired the DELTA Microelectronics business unit of FORCE Technology, the European provider of ASIC supply chain services.
Infineon: 'Our cost reduction measures are beginning to take effect' In the first three months of the 2020 fiscal year, Infineon's revenue decreased by 7% from EUR 2,062 million to EUR 1,916 million quarter-on-quarter.
Lam Research to expand global footprint Lam Research Corporation has selected Batu Kawan Industrial Park in Penang, Malaysia as the location for a new advanced technology production facility.
ON Semi looking to sell its manufacturing facility in Belgium ON Semiconductor says that it is exploring a sale of its manufacturing facility in Oudenaarde, Belgium.Load more news