© daniel schweinert dreamstime.com Business | April 22, 2013
Bluetooth chip shipments to nearly double by 2017
Bluetooth chip shipments to nearly double by 2017, driven by demand for integrated parts in mobile devices.
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets. Worldwide shipments of ICs that include Bluetooth technology are set to rise to 3.1 billion units in 2017, up 91 percent from 1.6 billion in 2011, according to a new report entitled Bluetooth—Classic or Smart Ready from IMS Research, now part of IHS. While shipments of standalone Bluetooth chips are substantial, the market is currently dominated by combination ICs that incorporate support for multiple wireless technologies in addition to Bluetooth. However, the fastest-growing segment of the Bluetooth chip market is MSoCs, whose shipments are expected to rise by a factor of 18 from 2012 to 2017. “Smartphones and media tablets are packing increasing capabilities into products that have a lower cost and a thinner form factor,” said Liam Quirke, connectivity analyst at IHS. “All this is driving demand for more highly integrated ICs, including Bluetooth-enabled connectivity chips and MSoCs. Most of the leading smartphone platforms already make use of integrated connectivity ICs, and increasingly will adopt Bluetooth-enabled MSoCs in the future.” No blues for Bluetooth chips Combination connectivity ICs accounted for 75 percent of total Bluetooth chip shipments in 2012. However, due to the rise of MSoCs, the combination chips will see their share of the Bluetooth market decline to 55 percent in 2017, although their shipments will continue to rise as the overall market expands. By 2017, MSoCs will account for 23 percent of the market, up from just 2 percent in 2012 and zero in 2011. Standalone devices' share of the market largely will remain flat, declining to 21 percent in 2017, down from 24 percent in 2011. Combo ICs at the cutting edge Many of today’s most popular and advanced smartphones and tablets are employing combination connectivity ICs. For example, Apple Inc.’s iPad Mini and iPhone 5 employ Broadcom Corp.’s BCM4334 single-chip, dual-band combo device, as revealed by a dissection of the products conducted by the IHS iSuppli Teardown Analysis Service. The BCM4334 includes support for Wi-Fi and an FM radio receiver, along with Bluetooth. Based on a virtual teardown, IHS iSuppli believes that Samsung’s new Galaxy S4 smartphone includes the Broadcom BCM4335, which integrates Bluetooth, along with the FM radio and a complete 5G Wi-Fi system. MSoCs multiply The MSoC takes the integration of combination chips to the next level, forming a single chip that incorporates the cellular baseband, applications processor and wireless connectivity. The release of Qualcomm’s Snapdragon S4 family of processors in 2012 integrated these various elements, with many incorporating both Bluetooth and Wi-Fi. In these components, the digital portion of the connectivity IC is integrated into the SoC, taking advantage of benefits such as less power being required by the more advanced manufacturing process. The analog counterpart is situated in a companion IC, which includes components for both Wi-Fi and FM radio. “MSoCs benefit manufacturers by reducing design complexity while providing lower-cost mobile platform solutions,” Quirke noted. “IHS is projecting that lower-end smartphones will be quick to adopt such solutions.”
500 jobs lost as Molex decides to close facility Connectors and interconnect components manufacturer, Molex, has announced that it will shut down production and close its Shannon, Ireland, a decision that will affect about 500 employees.
NTU Singapore and GF to explore next-gen memory technology Nanyang Technological University, Singapore (NTU Singapore) and GlobalFoundries will jointly be exploring the next-generation of embedded memory for smart systems.
EU Commission clears Infineon's acquisition of Cypress The European Commission has, under the EU Merger Regulation, approved the acquisition of US-based Cypress Semiconductor by German semiconductor company Infineon Technologies.
Sponsored content by Sourceability NA LLCComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
GLOBALFOUNDRIES buys Smartcom’s PDK team GLOBALFOUNDRIES has acquired the process design kit (PDK) engineering team from Smartcom Bulgaria AD to enhance GF’s scale and capabilities.
New head of Zeiss Research Microscopy Solutions Effective 1 October 2019, Dr. Michael Albiez became Head of the Research Microscopy Solutions strategic business unit (RMS SBU) at Zeiss and, with this appointment, a member of the management team for the Zeiss Industrial Quality & Research (IQR) segment. He has also been appointed Managing Director of Carl Zeiss Microscopy GmbH.
ams is not backing down – launches new offer for Osram The Austrian sensor manufacturer says that it intends to launch a new all-cash takeover offer for Osram Licht for EUR 41.00 per share.
Sivers IMA and NXP collaborate on 5G NXP Semiconductors and Sivers IMA Holding AB announces a collaboration to deliver a state-of-the-art solution for 5G-NR (New Radio), such as gigabit Fixed Wireless Access applications.
LEMO opens new facility in the Netherlands To support the unprecedented growth of its Benelux business, LEMO has invested in a new, purpose-built, hi-tech and eco-friendly facility near Amsterdam.
Wafer capacity by feature size shows rapid growth at <10nm Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49 percent of the IC industry’s total capacity.
Elatec USA appoints Paul Massey as CEO Elatec USA Inc., developer and manufacturer of RFID products, has named Paul K. Massey as Chief Executive Officer. In this newly created position, Massey will report to the Elatec Board of Directors and Managing Director Stefan Haertel.
Data Respons reports on record high quarterly results Data Respons presented figures for Q3 showing both solid revenue growth and a good margin increase. The company reports 35 percent growth in operating income and 68 percent growth in the operating profit, reaching an EBITA margin of 12.1 percent in the third quarter.
EC imposes interim measures on Broadcom The European Commission has ordered Broadcom to stop applying certain provisions contained in agreements with six of its main customers. This will "prevent serious and irreparable harm to competition likely to be caused by Broadcom's conduct, which prima facie (at first sight) infringes EU competition rules".
Specialisation kept Universal Robots agile through the years Universal Robots, the Danish robotics company that many analysts credit with both creating and taking over the collaborative robot space.
2Q/2019: Memory business is approaching bottom “Combined DRAM and NAND revenue was USD 25.4 billion in 2Q/2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, says Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement.
Tridonic supplies new Beijing airport with light-on-demand Tridonic supplies the new mega airport Beijing Daxing International Airport with drivers, intelligent lighting control and light-on-demand with daylight tracking.
Infineon-radar technology in Google Pixel 4 Smartphone Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people worldwide 1 will be using smart devices to sense their environment next year.
NVIDIA leads way but competition is intensifying Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
Nidec continues Polish investment Nidec Motors & Actuators continues to expand in Poland and decided to invest a further PLN 165.2 million (EUR 3.8 million) in Kraków's special economic zone in Niepołomic.
Phoenix Contact builds R&D centre in Skolkovo German electronics company Phoenix Contact is building a regional development and competence centre in Moscow's high-tech cluster Skolkovo.
Elektrobit opens software lab in Berlin Kickstarts the new office by signing a collaboration agreement with Daimler subsidiary MBition.
Smiths Detection scanners keep laptops and liquids in the bag Recent implementation of Smiths Detection’s checkpoint scanners at Melbourne Airport pave way for reduction of passenger journey time by 50 percent.
Murata develops Millimeter-Wave RF Module for Terragraph Murata Manufacturing is working to develop an RF module solution for Terragraph, a gigabit wireless technology developed by Facebook. The module solution aims at meeting the growing demand for reliable, high-speed internet access in urban and suburban environments.
Ynvisible Interactive enters manufacturing agreement with Invisense Ynvisible Interactive has entered into a partnership with Invisense AB, a developer of passive humidity sensors. The agreement between the companies establishes Ynvisible as the preferred manufacturing partner for Invisense’s growing range of humidity sensor products.Load more news