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Mobile Semi market topped USD 30bn in 2012
Although overall semiconductor industry growth was nearly flat in 2012, sales of mobile semiconductors reached $31 billion in 2012 according to The Linley Group, an increase of 18 percent over the previous year.
"Smartphone and tablet sales continue to skyrocket, creating demand for mobile semiconductors that is growing at a faster rate than the overall semiconductor market," said Linley Gwennap, founder and principal analyst with The Linley Group. "Our research indicates the market will continue its upward trajectory, with some well-known OEMs continuing to dominate in market share and revenue. With this report, readers gain access to expert opinions on the market trends that will impact their success." As with previous editions, the report tracks chip vendor market share, revenue and unit shipments in five semiconductor categories -- cellular baseband processors, application processors, Bluetooth transceivers, mobile Wi-Fi chips and GPS receivers. This year, the report adds coverage of Near Field Communication (NFC) chips. While today many companies are shipping NFC standalone chips, The Linley Group believes that future Wi-Fi combo chips and processors will integrate this function, limiting opportunities for current NFC leaders NXP and InsideSecure. Though the application processor market has typically been dominated by smartphone vendors Samsung and Apple that design their own chips, Qualcomm edged out Apple for the first time, shipping 249 million units and holding more than a 25 percent share of the market. Qualcomm is benefiting from explosive growth in lower-cost smartphones, particularly in China and other emerging economies. In the cellular baseband market, MediaTek cellular matched Qualcomm's unit shipments, but Qualcomm continues to hold a massive 56.5 percent share of revenue due to higher ASPs. Moreover, as the market continues to shift from GSM to UTMS, Qualcomm unit shipments are expected to rise, increasing its overall share of the baseband processor market. Broadcom today dominates the Wi-Fi market with 62 percent market share. However, The Linley Group expects Broadcom's share to fall to 51 percent by 2016 due to increased competition from Qualcomm, MediaTek and Samsung. These vendors will take share from Broadcom by bundling or integrating Wi-Fi with their popular application processors.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.
Analog Devices acquires HDMI business from INVECAS Analog Devices, Inc. has acquired the High Definition Multimedia Interface (HDMI) business of Santa Clara based INVECAS.
Intel’s chief engineering officer to leave the company Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.
Schleuniger Group acquires the business of US-based Cirris Systems Corp. Following many years of cooperation, the Schleuniger Group and Cirris Systems Corp. have signed an agreement for Schleuniger to acquire Cirris, based in Salt Lake City, Utah, on the basis of an asset deal.
Mu-Del Electronics acquires Luff Research Virginia-based Mu-Del Electronics LLC, an Ironwave Technologies Company and a manufacturer of high-performance RF and Microwave based systems, is acquiring Luff Research.
Sierra Wireless to divest automotive embedded module product line The company has announced a definitive agreement to divest its Shenzhen, China-based automotive embedded module product line for USD 165 million in cash.
The evolving GaN and SiC power semiconductor market landscape The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is rapidly evolving from a startup-dominated business to one led by large-established power semiconductor manufacturers.
AEM acquires DB Design to expands design & application engineering capabilities AEM Holdings Ltd has acquired 100% stake in California-based DB Design Group, Inc. with its key team of designers and machinists located in California serving the Silicon Valley customer base.
Nanoscribe opens new Microfabrication Experience Center The Microfabrication Experience Center at Nanoscribe’s headquarters in Karlsruhe, Germany is opening its doors these days.
Arm expands R&D centre in Budapest The chip company will be growing its staff of developers by more than 50% at its R&D centre in Budapest, Hungary.
Apple wants its supply chain to be 100% carbon neutral by 2030 The Cupertino company says that its wants to bring its entire carbon footprint to net zero – 20 years sooner than the IPCC targets.
Bosch set to expand in Malaysia with new plant in Penang The German manufacturing giant has signed a Sales and Purchase Agreement (SPA) with the Penang Development Corporation for land in the Batu Kawan Industrial Park in Penang.
Tel-Instrument Electronics receives $1.6M test set order Avionics test and measurement solutions designer and manufacturer, Tel-Instrument Electronics, has received a USD 1.6 million test set order for the South Korean military.
EV Group nearly doubles its cleanroom capacity at its HQ EV Group (EVG) has completed the construction of its new Cleanroom V building at its corporate headquarters in Austria.
China steps up pace of Mini/Micro LED commercialisation By 2024, the global Mini/Micro LED market is projected to reach US$4.2 billion in revenue. The positive outlook of the Mini/Micro LED industry has attracted many investors.
STMicro to strengthen its wireless connectivity capabilities via acquisitions STMicroelectronics has signed two M&A agreements related to the acquisitions of the entire share capital of Ultra Wide Band specialist BeSpoon and of the cellular IoT connectivity assets of Riot Micro.
Standex acquires Renco Electronics Standex International Corporation has acquired privately-held, Florida-based Renco Electronics for approximately USD 28 million in cash with an additional three-year earnout payment based upon achieving certain financial targets.Load more news