© iFixit Business | November 16, 2012
Nikon D600 Teardown
Hey, guess what -- time for another camera teardown! Today we bring you the saucy internals of a Nikon D600. This "entry level" full-frame camera is chock full of goodies, just like SLRs we've torn down in the past.
And just like previous SLRs, the D600 is a bear to take apart. The guts are a maze of cables, connectors, and soldered wires. In true SLR fashion, the D600 scored a very low 2 out of 10 repairability score, as most components almost require a certification in soldering in order to properly remove. The sole standout is the somewhat easy-to-remove tripod mount, held in place with four #00 screws. Highlights:
© iFixitChipworks helped us identify the sensor inside the D600. It's a Sony unit that measures 35.9mm x 24.0mm. * Multiple hidden screws hold the body of the D600 intact. We found the little Phillips buggers hiding under the eye cup, rubber grip, and viewfinder diopter dial, in addition to the exposed screws residing on the bottom cover. * It's nice to see that the D600 tripod mount comes out separately from the rest of the body. It would be a shame to compromise a $2,100 camera just because the mount becomes cross-threaded. * The depth-of-field preview and function buttons both lay inside the front case underneath two rubber covers. Though not a common repair, replacing these buttons is certainly feasible. * The battery grip also pops off somewhat easily. That's another component where replacement is feasible, which is great news for photographers who grip tightly to their SLR and wear it out prematurely.
© iFixitWe were disappointed to find that the LCD is fused to the rear case, and cannot be swapped without replacing the entire back of the camera. If you crack the LCD on an older Nikon SLR like the D90, it's possible to find an inexpensive replacement and fix it yourself. With the fused LCD, though, D600 users will definitely want to opt for some type of screen protection. Luckily, the main EMI shield is removed by simply unscrewing some Phillips screws, and does not require any desoldering. A large square of thermal compound also tips us off that this shield works double duty as a heat sink, removing any excess heat from the D600's motherboard. Motherboard chips: * Toshiba 80 MHz TMP19A44F10XBG low-power microcontroller * Samsung K4B2G0846D 1 GB DDR3 SDRAM * Spansion GL128S90DHI02 16 MB flash memory * Nikon EXPEED 3 image processing engine * Inrevium TE4302RX SD card controller * Nikon EL-166 To get a closer look at the full-frame CMOS sensor, we remove the frame and layers of filters covering it. We were relieved to find an insulated rubber cover on the beefy 350 µF flash capacitor, protecting us against what could have been a dangerous shock. Just in case it wasn't so welcoming, we were ready with our capacitor discharge tool -- always a good idea when dealing with large capacitors. Trust us, we speak from experience. And as always you can find the entire teardown here
500 jobs lost as Molex decides to close facility Connectors and interconnect components manufacturer, Molex, has announced that it will shut down production and close its Shannon, Ireland, a decision that will affect about 500 employees.
NTU Singapore and GF to explore next-gen memory technology Nanyang Technological University, Singapore (NTU Singapore) and GlobalFoundries will jointly be exploring the next-generation of embedded memory for smart systems.
EU Commission clears Infineon's acquisition of Cypress The European Commission has, under the EU Merger Regulation, approved the acquisition of US-based Cypress Semiconductor by German semiconductor company Infineon Technologies.
GLOBALFOUNDRIES buys Smartcom’s PDK team GLOBALFOUNDRIES has acquired the process design kit (PDK) engineering team from Smartcom Bulgaria AD to enhance GF’s scale and capabilities.
New head of Zeiss Research Microscopy Solutions Effective 1 October 2019, Dr. Michael Albiez became Head of the Research Microscopy Solutions strategic business unit (RMS SBU) at Zeiss and, with this appointment, a member of the management team for the Zeiss Industrial Quality & Research (IQR) segment. He has also been appointed Managing Director of Carl Zeiss Microscopy GmbH.
ams is not backing down – launches new offer for Osram The Austrian sensor manufacturer says that it intends to launch a new all-cash takeover offer for Osram Licht for EUR 41.00 per share.
Sivers IMA and NXP collaborate on 5G NXP Semiconductors and Sivers IMA Holding AB announces a collaboration to deliver a state-of-the-art solution for 5G-NR (New Radio), such as gigabit Fixed Wireless Access applications.
Sponsored content by Sourceability NA LLCComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
LEMO opens new facility in the Netherlands To support the unprecedented growth of its Benelux business, LEMO has invested in a new, purpose-built, hi-tech and eco-friendly facility near Amsterdam.
Wafer capacity by feature size shows rapid growth at <10nm Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49 percent of the IC industry’s total capacity.
Elatec USA appoints Paul Massey as CEO Elatec USA Inc., developer and manufacturer of RFID products, has named Paul K. Massey as Chief Executive Officer. In this newly created position, Massey will report to the Elatec Board of Directors and Managing Director Stefan Haertel.
Data Respons reports on record high quarterly results Data Respons presented figures for Q3 showing both solid revenue growth and a good margin increase. The company reports 35 percent growth in operating income and 68 percent growth in the operating profit, reaching an EBITA margin of 12.1 percent in the third quarter.
EC imposes interim measures on Broadcom The European Commission has ordered Broadcom to stop applying certain provisions contained in agreements with six of its main customers. This will "prevent serious and irreparable harm to competition likely to be caused by Broadcom's conduct, which prima facie (at first sight) infringes EU competition rules".
Specialisation kept Universal Robots agile through the years Universal Robots, the Danish robotics company that many analysts credit with both creating and taking over the collaborative robot space.
2Q/2019: Memory business is approaching bottom “Combined DRAM and NAND revenue was USD 25.4 billion in 2Q/2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, says Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement.
Tridonic supplies new Beijing airport with light-on-demand Tridonic supplies the new mega airport Beijing Daxing International Airport with drivers, intelligent lighting control and light-on-demand with daylight tracking.
Infineon-radar technology in Google Pixel 4 Smartphone Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people worldwide 1 will be using smart devices to sense their environment next year.
NVIDIA leads way but competition is intensifying Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
Nidec continues Polish investment Nidec Motors & Actuators continues to expand in Poland and decided to invest a further PLN 165.2 million (EUR 3.8 million) in Kraków's special economic zone in Niepołomic.
Phoenix Contact builds R&D centre in Skolkovo German electronics company Phoenix Contact is building a regional development and competence centre in Moscow's high-tech cluster Skolkovo.
Elektrobit opens software lab in Berlin Kickstarts the new office by signing a collaboration agreement with Daimler subsidiary MBition.
Smiths Detection scanners keep laptops and liquids in the bag Recent implementation of Smiths Detection’s checkpoint scanners at Melbourne Airport pave way for reduction of passenger journey time by 50 percent.
Murata develops Millimeter-Wave RF Module for Terragraph Murata Manufacturing is working to develop an RF module solution for Terragraph, a gigabit wireless technology developed by Facebook. The module solution aims at meeting the growing demand for reliable, high-speed internet access in urban and suburban environments.
Ynvisible Interactive enters manufacturing agreement with Invisense Ynvisible Interactive has entered into a partnership with Invisense AB, a developer of passive humidity sensors. The agreement between the companies establishes Ynvisible as the preferred manufacturing partner for Invisense’s growing range of humidity sensor products.Load more news