© shawn hempel dreamstime.com Business | November 05, 2012
Cortus with smallest 32-bit Microcontroller IP core
Cortus claims to have released the world’s smallest 32-bit microcontroller IP core – the APS1. The launch of the silicon efficient, low cost APS1 completes Cortus’ 2012 processor roadmap.
The Cortus APS1 is a native 32-bit core with a modern RISC architecture. In common with other Cortus processors, the APS1 has a 5 to 7 stage integer pipeline with out-of-order completion ensuring that most integer instructions (load and stores included) are executed in a single cycle. It is the fourth member of the Cortus microcontroller IP core family to be released in 2012 complementing the larger energy efficient APS3R, high performance APS5 and the floating point FPS6 cores. “We are proud to break our own record in terms of 32-bit core size”, said Michael Chapman, CEO and President of Cortus. He adds, “Our first product – the APS3 – pioneered the market for silicon efficient 32-bit processor cores and with the APS1 we have an even more compact core”. Michael Chapman explains, “With the APS1 released, there is almost no reason to continue to use 8-bit cores. SoC developers benefit from an easier SW development cycle, more performance and lower power consumption”. The APS1 has a fully 32-bit architecture with 16 general purpose registers. Its CPU gatecount starts at about 6800 gates. In the TSMC 90 nm technology this can be as small as 0.03 mm2 (Dolphin SESAME-HD library). As a member of the Cortus family of processors, the APS1 interfaces to all of Cortus’ peripherals including the Ethernet 10/100 MAC, USB 2.0 Device and USB 2.0 OTG via the efficient APS bus. It also shares the simple vectored interrupt structure which ensures rapid, real time interrupt response, with low software overhead. The APS toolchain and IDE (for C and C++) are available to licensees free of charge, and it can be customised and branded for final customer use. Ports of various RTOSs are available such as FreeRTOS, Micrium µC/OS.
Global microelectronics market with overall stable development "Although the growth path of the global microelectronics market is intact, on a long-term trend-line, it declined by 12.1 percent to USD 412 billion in 2019," said Dr. Sven Baumann, ZVEI expert for microelectronics, sensors and actuators.
Jörg Doblaski takes on the role of X-FAB CTO X-FAB Silicon Foundries announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.
GaN and SiC power semiconductor markets set to pass $1 billion mark in 2021 The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass USD 1 billion in 2021, energised by demand from hybrid & electric vehicles, power supplies, and photovoltaic (PV) inverters.
POET and Sanan IC Inks LoI to form $50 million JV The proposed JV aims to disrupt the data center market using the POET Optical Interposer to achieve superior economics and scale.
SG Wireless designates Digi-Key as authorised distributor for the US SG Wireless, the IoT solutions arm of EMS provider Season Group, has added Digi-Key as an authorised distributor of its IoT products for the US.
Kioxia completes acquisition of LITE-ON Technology’s SSD business Kioxia Holdings Corporation says it expects to complete its acquisition of LITE-ON Technology Corporation’s Solid State Drive (SSD) business, Solid State Storage Technology Corporation and its affiliated companies on July 1, 2020.
II-VI licenses technology for SiC devices and modules for power electronic II‐VI Incorporated has singed an agreement with General Electric to license GE's technology to manufacture silicon carbide (SiC) devices and modules for power electronics.
Dialog Semi completes its acquisition of Adesto Dialog Semiconductor says it has completed the acquisition of Adesto Technologies Corporation (Adesto)), a provider of custom ICs and embedded systems for the IIoT market.
Changes in NAND Flash Prices to Be Limited in 3Q20 Despite the reduced demand for consumer electronics and smartphones as a result of the COVID-19 pandemic, the NAND Flash market showed a short supply in 1H20, thanks to the corresponding rising demand for cloud services and distance education, as well as increased inventory procurement by some clients concerned with a possible breakage in the supply chain.
USI breaks ground on its new Huizhou manufacturing facility The electronics designer and manufacturer is looking to reinforce its foundation in Southern China and is doing so by adding a new manufacturing facility in Huizhou (Guangzhou, China).
R&M opens U.S. production facility The 10,000-square-foot facility in Elkridge, Maryland aims to services U.S. East Coast, Southern and Midwestern customers with consulting, production, support, and rapid delivery.
Osram: Slight recovery after weak 3rd quarter expected Osram Licht AG expects for the fiscal year 2020 a comparable revenue decline of -15 to -19 percent (previously:-3 and +3 percent), an adjusted EBITDA margin of 3 to 6 percent (previously: 9 to 11 percent) and a negative free cash flow in the mid double digit to lower triple digit million range.
Taiwan edges South Korea as largest base for IC wafer capacity China capacity expansion forecast to push the country into second place in the regional rankings in 2022, trailing only Taiwan in size.
Siemens acquires UltraSoC Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).
BMW and Mercedes-Benz halt cooperation in automated driving The BMW Group and Mercedes-Benz AG are putting their cooperation on development of next-generation technology for automated driving temporarily on hold.
Olympus to divest Imaging Business Olympus Corporation and Japan Industrial Partners, Inc. signed a memorandum of understanding to carveout Olympus’s Imaging business to a new company and subsequently transfer its shares to a fund managed, operated or otherwise handled by JIP.
Dialog ups its outlook for Q2 Dialog Semiconductor says it is increasing its Q2 2020 revenue outlook due to a stronger than expected demand for tablets and notebooks.
Odyssey opens first European repair facility in Nijmegen Odyssey Technical Solutions is opening a new repair facility on Novio Tech Campus in Nijmegen. The company is focused on the repair and service of equipment in Radio Frequency (RF), DC and microwaves.
NOR Flash ASP to potentially drop in 2H20 NOR Flash buyers found that their inventories were low and stepped up their procurement efforts as they anticipated the growing risk of COVID-19 causing disruptions in the supply chain.
Globalfoundries acquires Land in U.S. Globalfoundries has secured a purchase option agreement for approximately 66 acres of undeveloped land adjacent to its most advanced manufacturing facility, Fab 8, in Malta, N.Y., near the Luther Forest Technology Campus (LFTC).
GF and SkyWater team up on technology development GlobalFoundries and SkyWater Technology have signed a Memorandum of Understanding (MOU) to manufacture secure solutions for the U.S. defense industrial base and cooperate on development of emerging technologies.
EBV Elektronik to franchise Sequans in EMEA EBV Elektronik, an Avnet company, today announced that it will distribute the product portfolio of Sequans Communications S.A. in EMEA.
Volkswagen increases stake in QuantumScape The Volkswagen Group is increasing its stake in QuantumScape and making an additional investment of up to US$200 million in the US battery specialist.
Danfoss secures capacities for electro-mobility chips at Infineon In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement.Load more news